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EP0561462A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Manufacturing electronic devices comprising, e.g., TFTs and MIMs

Assignee: Philips Electronics UK Ltd
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Filing: 1993-03-12
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Granted: —
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Expires: 2013-03-12
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Abstract

Abstract Body portions (36) of semiconductor crystalline silicon material of sufficient quality to form high-mobility TFTs (thin-film transistors) and other semiconductor devices of a driver circuit are formed by depositing on a substrate (14) a layer of insulating silicon-based non-stoichiometric compound material (32) and then converting this material (32) into the semiconductive crystalline material (36) by heating with an energy beam (40), for example from an excimer laser. The use of an energy beam (40) permits easy localization of the heating (and consequent conversion) both vertically and laterally. The deposition (e.g. by plasma-enhanced chemical vapour deposition) and the beam annealing can both be carried out without heating the substrate (14) to high temperatures, and so a glass or other low-cost substrate (14) can be used. An unconverted part (32a) underlying the crystalline silicon body portion (36) can form at least part of a gate insulator of the TFT. The deposited non-stoichiometric compound material may be of a type suitable for forming a MIM-type switching device so that unconverted areas (42) of the insulating material (32) may be retained for that purpose. This permits the fabrication of an LCD device comprising a picture-element array of MIM type devices in the unconverted material (32) of the layer and TFT driver circuitry in the crystalline silicon material (36) of the layer.

Inventors

  • 👤 John Martin C/O Philips Research Lab. Shannon

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-01 04:49
CPC Classifications
G; G02; G02F; G02F1/00; G02F1/01; G02F1/13; G02F1/133; G02F1/136; G02F1/1362; G02F1/1333; G02F1/1345; G02F1/13454; H; H10; H10B; H10B63/00; H10B63/20; H10B63/22; H10D; H10D30/00; H10D30/60; H10D30/67; H10D86/00; H10D86/01; H10D86/021; H10D86/0221; H10D86/0223; H10D86/40; H10D86/60; G02F2202/00; G02F2202/10; G02F2202/104; Y; Y10; Y10S; Y10S148/00; Y10S148/091; Y10S148/15

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 104 words
A method of manufacturing an electronic device comprising at least one semiconductor device which has a body portion of semiconductive crystalline silicon material, wherein the silicon crystalline material is formed by depositing a layer on a substrate and annealing at least a part of the layer with an energy beam, which method is characterised in that the layer is deposited as an insulating non-stoichiometric compound material of silicon alloyed with at least one other element, and in that at least a part of the insulating non-stoichiometric compound material is converted into the semiconductive crystalline silicon material by heating that part with the energy beam.
Claim 2
Dependent Claim 68 words
A method as claimed in claim 1, further characterised in that a first area of the deposited layer is annealed with the energy beam to provide the semiconductive crystalline silicon material for the semiconductive device, and in that a second area of the deposited layer is not subjected to the energy beam and is retained on the substrate as insulating non-stoichiometric compound material in the manufactured electronic device.
Claim 3
Dependent Claim 28 words
A method as claimed in claim 2, further characterised in that the second area is provided with two electrodes to form a MIM-type switching device on the substrate.
Claim 4
Dependent Claim 77 words
A method as claimed in claim 3, further characterised in that an array of the MIM-type switching devices is formed on the substrate and is connected to driving circuits also formed on the substrate, in that the MIM-type switching devices are formed with the insulating non-stoichiometric compound material, and in that the driving circuits comprise a plurality of the semiconductor devices having body portions of the semiconductive crystalline silicon material formed by annealing with the energy beam.
Claim 5
Independent Claim 62 words
A method as claimed in any one of the preceding claims, further characterised in that the energy beam is of a wavelength having an absorption depth in the deposited layer which is so much less than the thickness of the deposited layer that the insulating non-stoichiometric compound material is converted into semiconductive crystalline silicon material over only a part of its thickness.
Claim 6
Dependent Claim 75 words
A method as claimed in claim 5, further characterised in that the semiconductor device is a thin-film transistor having a gate which is formed on the substrate before depositing the layer, in that the semiconductive crystalline silicon material provides a channel region of the transistor, and in that an unconverted part of the insulating non-stoichiometric compound material provides at least a part of a gate insulator between the underlying gate and the overlying channel region.
Claim 7
Dependent Claim 41 words
A method as claimed in claim 6, further characterised in that, before depositing the layer of insulating non-stoichiometric compound material, an insulating layer is formed on the gate so as to provide a part of the gate insulator of the transistor.
Claim 8
Independent Claim 58 words
A method as claimed in any one of claims 5 to 7, further characterised in that an underlying unconverted part of the insulating non-stoichiometric compound material provides an interface between the semiconductive crystalline silicon material and the substrate, and in that the semiconductor device has at least one electrode which is provided on the semiconductive crystalline silicon material.
Claim 9
Independent Claim 28 words
A method as claimed in anyone of claims 5 to 8, further characterised in that the energy beam is of an ultraviolet wavelength generated by an excimer laser.
Claim 10
Independent Claim 35 words
A method as claimed in any one of the preceding claims, further characterised in that the insulating compound material is selected from the group of non-stoichiometric silicon nitride, non-stoichiometric silicon oxynitride, and non-stoichiometric silicon carbide.
Claim 11
Independent Claim 35 words
A method as claimed in any one of the preceding claims, further characterised in that the insulating compound material is deposited with a hydrogen content, part of which is retained in the crystalline silicon material.
Claim 12
Independent Claim 42 words
A method as claimed in anyone of the preceding claims, further characterised in that the semiconductor device is a thin-film transistor having a control electrode for controlling current flow through a part of the body portion of the semiconductive crystalline silicon material.

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