Patent EP0555660A2 successfully refreshed from Google Patents.
EP0555660A2
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Apparatus for interlayer planarization of semiconductor material
Assignee: Rodel Inc
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Filing: 1993-01-18
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Granted: —
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Expires: 2013-01-18
Abstract
Abstract A pad for planarizing the surface of a semiconductor wafer. The pad includes at least two layers. One layer has an hydrostatic modulus which is different from the hydrostatic modulus of the other pad.
Inventors
- 👤 Thomas C. Hyde
- 👤 John V.H. Roberts
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-08 18:47
CPC Classifications
B; B24; B24B; B24B37/00; B24B37/11; B24B37/20; B24B37/22; H; H10; H10P; H10P50/00
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
364 words
Apparatus for planarizing a piece of material including a macroscopically flat subsurface, at least a pair of features each connected to said subsurface, each having an outer surface spaced away from said subsurface, each extending a substantially equal distance away from said subsurface, being spaced apart a distance of less than five hundred microns, a coating extending over and covering said features and said subsurface, the outer surface of said coating comprising a work surface which is macroscopically flat, said apparatus including (a) planarizing pad means including (i) a base, (ii) a first layer of resilient material connected to said base and having an outer surface spaced apart from said base and having a hydrostatic modulus which is less than 250 psi per psi of compressive pressure when a selected compressive pressure in the range of about four psi to twenty psi is applied to said first layer, (iii) a second layer of resilient material connected to at least a portion of said outer surface, having a planarizing surface spaced apart from said outer surface to contact and abrade said coating to expose said upper surface, and having a hydrostatic modulus greater than the hydrostatic modulus of said first layer when said selected compressive pressure is applied to said second layer, and (iv) a liquid slurry polishing media on said planarizing surface of said second layer; (b) retaining means for holding said piece of material with said work surface disposed against and contacting at least one of the pair consisting of (i) said planarizing surface, and, (ii) said slurry media; and, (c) motive power means for moving at least one of said planarizing pad means and said retaining means with respect to the other of said pad means and said retaining means such that movement of said one of said pad means and said holding means causes said slurry and said planarizing surface to contact and abrade said work surface; said planarizing surface microscopically planarizing at least said work surface to expose said outer surfaces of said features such that said work surface and said outer surfaces are generally microscopically flat and co-planar, said outer surfaces each terminate at and abut said work surface.
Claim 2
Dependent Claim
84 words
The apparatus of Claim 1 wherein (a) each of said features includes at least one side surface extending outwardly from said subsurface and terminating at said outer surface; (b) said coating (i) before said subsurface is planarized with said pad means, extends over and covers said side surfaces, (ii) after said subsurface is planarized to exposes said outer surfaces, extends over and covers said side surfaces, and (iii) has a minimum thickness greater than said distance which said features extend away from said subsurface.
Claim 3
Dependent Claim
25 words
The apparatus of Claim 2 wherein said distance which said features extend away from said subsurface is in the range of 0.3 to 2.0 microns.
Claim 4
Dependent Claim
27 words
The apparatus of Claim 3 wherein said material is a semiconductor material and said features each have a width in the range of 0.3 to 2.0 microns.
Claim 5
Dependent Claim
117 words
A polishing pad for use with a planarization apparatus, said pad comprising (a) a resilient base material having a hydrostatic modulus which is less than about 250 psi per psi of compressive pressure when a selected compressive pressure in the range of about four psi to twenty psi is applied to said first layer of material; and, (b) a second planarizing layer having a hydrostatic modulus greater than about 400 psi per psi of compressive pressure when said selected compressive pressure is applied to said second layer of material; said pad being capable of being mounted on said planarizing apparatus to act alone or in conjunction with a slurry to planarize the work surface of a workpiece.
Claim 6
Dependent Claim
46 words
The polishing pad of Claim 5 wherein said second layer is comprised of a material having a planarizing surface which contacts at least one of the pair comprising (a) said work surface, and (b) when said pad is used in conjunction with said slurry, said slurry.
Claim 7
Dependent Claim
264 words
Apparatus for planarizing a work surface of a piece of material, said work surface being macroscopically flat and microscopically flat such that said work surface deviates at all points from the median plane passing through said work surface by an amount less than about four microns, said apparatus including (a) planarizing pad means including (i) a base, (ii) a first layer of resilient material connected to said base and having an outer surface spaced apart from said base and having a hydrostatic modulus which is less than 250 psi per psi of compressive pressure when a selected compressive pressure in excess of about four psi is applied to said first layer of material, (iii) a second layer of resilient material connected to at least a portion of said outer surface, having a planarizing surface spaced apart from said outer surface, and having a hydrostatic modulus greater than the hydrostatic modulus of said first layer when said selected compressive pressure is applied to said second layer of material, and (iv) a slurry media on said planarizing surface of said second layer; (b) retaining means for holding said piece of material with said work surface disposed against and contacting at least one of the pair consisting of (i) said planarizing surface, and, (ii) said slurry media; (c) motive power means for moving at least one of said pad means and said retaining means with respect to the other such that movement of said one of said pad means and said holding means causes said slurry and said planarizing surface to contact and abrade said work surface.
Claim 8
Dependent Claim
22 words
The apparatus of Claim 7, wherein the total combined area of said first and second areas is less than sixteen square millimeters.
Claim 9
Dependent Claim
135 words
A polishing pad for use with a planarization apparatus comprising (a) a resilient base material being at least .015" thick and having at least 30% of its volume composed of voids such that the base material is volume compressible and will compress at least 5% under a load of 10 psi, (b) an intermediate layer at least .003" thick which is essentially volume incompressible, (c) a top planarizing layer at least .005" thick, having at least 25% of its volume composed of voids such that the planarizing layer is volume compressible and will compress at least 5% under a load of 100 psi., said polishing pad being capable of being mounted on a suitable apparatus for planarization and by acting alone or in conjunction with a slurry to produce a planar surface on a workpiece.
Claim 10
Dependent Claim
27 words
The polishing pad of claim 8 wherein at least some of the voids in the top planarizing layer are formed by the incorporation of micro-spheres containing gas.
Claim 11
Dependent Claim
27 words
The polishing pad of claim 9 wherein at least some of the voids in the resilient base layer are formed by the incorporation of micro-spheres containing gas.
Claim 12
Dependent Claim
123 words
A polishing pad for use with a planarization apparatus comprising (a) a resilient base material being at least .015" thick and having at least 30% of its volume composed of voids such that the base material is volume compressible and will compress at least 5% under a load of 10 psi; and, (b) a top planarizing layer at least .005" thick, having at least 25% of its volume composed of voids such that the planarizing layer is volume compressible and will compress at least 5% under a load of 100 psi.; said polishing pad being capable of being mounted on a suitable apparatus for planarization and by acting alone or in conjunction with a slurry to produce a planar surface on a workpiece.
References Cited (Backward Citations)
No citation records indexed.
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