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EP0554622A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Apparatus and method for testing bare dies

Assignee: BAE Systems Electronics Ltd
•
Filing: 1992-12-21
•
Granted: —
•
Expires: 2012-12-21
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Abstract

Abstract A bare die testing apparatus comprising a multilayer interconnection structure 10 having a testing station 11 for testing the bare die 20, testing circuits and components 12 arranged in said structure adjacent the testing station 11, said testing station 11 having a plurality of microbumps 17 of conductive material soldered onto wettable metallization pads 18 located on interconnection trace terminations of the interconnection structure, said terminations being connected through the interconnections of the multilayer structure to said testing circuits and components 12. The microbumps 17 are distributed in a pattern corresponding to the pattern of contact pads 19 on a bare die 20 to be tested. A method of testing bare dies by the bare-die testing apparatus embodying the invention, the method including optically aligning the contact pads 19 of a bare die 20 under test with the microbumps 17 of the testing station 11, contacting the aligned contact pads 19 of the bare die 20 with the corresponding microbumps 17 of the testing station 11 and applying appropriate pressure on to bare die 20 to ensure desired low contact resitstance between the mcrobumps 17 and the contact pads 14.

Inventors

  • 👤 David John Pedder

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-01 13:25
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/073; G01R1/07307

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 94 words
A bare die testing apparatus comprising a multilayer interconnection structure having a testing station for testing the bare die, testing circuits and components arranged in said structure adjacent the testing station, said testing station having a plurality of microbumps of conductive material soldered onto wettable metallization pads located on interconnection trace terminations of the interconnection structure, said terminations being connected through the interconnections of the multilayer structure to said testing circuits and components, said microbumps being distributed to a pattern corresponding to the pattern of contact pads on a bare die to be tested.
Claim 2
Dependent Claim 37 words
An apparatus as claimed in Claim 1, in which the multilayer interconnection structure is formed by a thin film technology and includes a ground plane, a power plane and at least one layer for signal trace routing.
Claim 3
Independent Claim 25 words
An apparatus as claimed in Claims 1 or 2, in which the multilayer structure is a multilayer aluminium-polyimide metallisation structure formed on a silicon substrate.
Claim 4
Independent Claim 43 words
An apparatus as claimed in any one of Claims 1 to 3, in which the microbumps of the testing station are micro-spheres of copper or copper alloy plated with nickel or gold, the micro-sphere being soldered and self-aligned to said wettable metallization pads.
Claim 5
Independent Claim 45 words
An apparatus as claimed in anyone of Claims 1 to 3, in which the microbumps of the testing station are plated or vapour deposited solder bumps of gold-tin eutectic composition, the reflow of the solder bumps providing a desired radius of curvature of the microbumps.
Claim 6
Independent Claim 79 words
A method of testing bare dies by a bare-die testing apparatus as claimed in any one of Claims 1 to 5, including optically aligning the contact pads of a bare die under test with the microbumps of the testing station, contacting the aligned contact pads of the bare die with the corresponding microbumps of the testing station and applying appropriate pressure on to the bare die to ensure desired low contact resistance between the microbumps and the contact pads.

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