Patent EP0550013A2 successfully refreshed from Google Patents.
EP0550013A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Semiconductor device and method of producing the same
Assignee: Kyushu Fujitsu Electronics Ltd
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Filing: 1992-12-23
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Granted: —
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Expires: 2012-12-23
Abstract
Abstract A semiconductor device includes a semiconductor chip (1) having top and bottom surfaces, upper leads (11) electrically coupled to the semiconductor chip, where a first gap is formed between the upper leads and the top surface (1a) of the semiconductor chip, lower leads (12) electrically coupled to the semiconductor chip, where a second gap is formed between the lower leads and the bottom surface of the semiconductor chip, and an encapsulating resin (2) which encapsulates the semiconductor chip so as to maintain the first and second gaps.
Inventors
- 👤 Mitsutaka C/O Fujitsu Limited Sato
- 👤 Junichi C/O Fujitsu Limited Kasai
- 👤 Masanori c/o Fujitsu Limited Yoshimoto
- 👤 Kouichi c/o KYUSHU FUJITSU ELE. LTD. Takeshita
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-25 23:06
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/04; H10W70/048; H10W70/40; H10W70/411; H10W70/415; H10W70/421; H10W70/424; H10W70/427; H10W70/433; H10W74/00; H10W74/01; H10W74/016; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/07178; H10W72/073; H10W72/07331; H10W72/07337; H10W72/07351; H10W72/07352; H10W72/075; H10W72/07521; H10W72/30; H10W72/321; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/851; H10W72/853; H10W72/865; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 40
Claim 1
Independent Claim
97 words
A semiconductor device comprising a semiconductor chip (1) having top and bottom surfaces, and upper leads (11) electrically coupled to the semiconductor chip, characterized in that a first gap is formed between the upper leads (11) and the top surface (1a) of the semiconductor chip (1); and that there are provided: lower leads (12) electrically coupled to the semiconductor chip (1), a second gap being formed between the lower leads and the bottom surface of the semiconductor chip; and an encapsulating resin (2) which encapsulates the semiconductor chip so as to maintain the first and second gaps.
Claim 2
Dependent Claim
59 words
The semiconductor device as claimed in claim 1, characterized in that said lower leads (12) include a stage (13) on which the semiconductor chip (1) is mounted, said stage having a different height position compared to a height position of the lower leads so as to maintain the second gap, said stage being encapsulated by the encapsulating resin (2).
Claim 3
Dependent Claim
24 words
The semiconductor device as claimed in claim 1 or 2, characterized in that said encapsulating resin (2) completely fills the first and second gaps.
Claim 4
Dependent Claim
35 words
The semiconductor device as claimed in any of claims 1 to 3, characterized in that said upper leads (11) are used as signals lines and said lower leads (12) are used as power source lines.
Claim 5
Dependent Claim
30 words
The semiconductor device as claimed in any of claims 1 to 4, characterized in that said upper leads (11) and said lower leads (12) are made of mutually different materials.
Claim 6
Dependent Claim
35 words
The semiconductor device as claimed in any of claims 1 to 5, characterized in that said upper leads (11) and said lower leads (12) are approximately parallel to each other within said encapsulating resin (2).
Claim 7
Dependent Claim
136 words
A semiconductor device comprising a stage (13, 51a, 51b, 56, 59) having top and bottom surfaces; a semiconductor chip (1) which is mounted on the top surface of the stage, said semiconductor chip having a circuit forming surface (1a); a plurality of leads respectively having inner and outer leads (4, 5); and an encapsulating resin (2) which encapsulates the semiconductor chip and the inner leads so that the outer leads (5) extend outwardly of the encapsulating resin, characterized in that: each of said inner leads (4) have tip ends which are located above the circuit forming surface (1a) of the semiconductor chip (1) and are electrically coupled to the semiconductor chip; a gap is formed between the inner leads and the circuit forming surface of the semiconductor chip; and said encapsulating resin (2) maintains the gap.
Claim 8
Dependent Claim
47 words
The semiconductor device as claimed in claim 7, characterized in that there is further provided a shock absorbing member (100) which is provided on the tip end of each inner lead (4) on a surface which confronts the circuit forming surface (1a) of the semiconductor chip (1).
Claim 9
Dependent Claim
38 words
The semiconductor device as claimed in claim 7 or 8, characterized in that said stage (13) is made up of an approximately rectangular plate having a size which is slightly larger than that of the semiconductor chip (1).
Claim 10
Dependent Claim
33 words
The semiconductor device as claimed in claim 7 or 8, characterized in that said stage (51a, 51b, 56, 59) has an arbitrary shape for supporting only a part of the semiconductor chip (1).
Claim 11
Dependent Claim
74 words
The semiconductor device as claimed in any of claims 7 to 10, characterized in that there is further provided a stage support part (130a, 130b) which extends outwardly from the stage (13) in the same plane as the stage for supporting the stage during production stages, said stage support part having a height position different from that of the outer leads (5) and having an end which is exposed from the encapsulating resin (2).
Claim 12
Dependent Claim
33 words
The semiconductor device as claimed in claim 11, characterized in that at least an arbitrary one of said inner leads (4) has a part which extends over the stage support part (130a, 130b).
Claim 13
Dependent Claim
22 words
The semiconductor device as claimed in any of claims 7 to 12, characterized in that said gap is less than 0.1 mm.
Claim 14
Dependent Claim
31 words
The semiconductor device as claimed in any of claims 7 to 13, characterized in that said encapsulating resin (2) further encapsulates the stage (13, 51a, 51b, 56, 59) in its entirety.
Claim 15
Dependent Claim
49 words
The semiconductor device as claimed in any of claims 7 to 13, characterized in that at least a part of the bottom surface of said stage (13) is exposed from the encapsulating resin (2), so that heat generated from the semiconductor chip (1) is radiated via the exposed part.
Claim 16
Dependent Claim
39 words
The semiconductor device as claimed in any of claims 7 to 15, characterized in that said encapsulating resin (2) completely fills the gap between the inner leads (4) and the circuit forming surface (1a) of the semiconductor chip (1).
Claim 17
Dependent Claim
44 words
The semiconductor device as claimed in any of claims 7 to 16, characterized in that said encapsulating resin (2) has an outer size which is approximately the same as that of the semiconductor chip (1) but slightly larger than that of the semiconductor chip.
Claim 18
Dependent Claim
35 words
The semiconductor device as claimed in any of claims 7 to 17, characterized in that said stage (13, 51a, 51b, 56, 59) is approximately parallel to the inner leads (4) within said encapsulating resin (2).
Claim 19
Independent Claim
129 words
A method of producing a semiconductor device which includes a semiconductor chip (1) mounted on a stage (13) which is integrally formed on lower leads (12), upper leads (11) which is separated from the lower leads, and an encapsulating resin (2) which encapsulates the semiconductor chip, characterized in that said method comprises the steps of: (a) overlapping the upper leads (11) on top of the lower leads (12) via a spacer (140) which is interposed between the upper leads and the stage and has a thickness greater than that of the semiconductor chip (1), so that a gap is formed between the upper leads and the semiconductor chip; (b) encapsulating the semiconductor chip (1) by the encapsulating resin (2); and (c) removing the spacer (140) after said step (b).
Claim 20
Dependent Claim
24 words
The method as claimed in claim 19, characterized in that different materials are used for the upper leads (11) and the lower leads (12).
Claim 21
Dependent Claim
48 words
The method as claimed in claim 19 or 20, characterized in that said step (a) overlaps the upper leads (11) on top of the lower leads (12) via the spacer (140) so that the upper leads are approximately parallel to the lower leads within the encapsulating resin (2).
Claim 22
Dependent Claim
45 words
The method as claimed in claim 21, characterized in that said step (a) overlaps the upper leads (11) on top of the lower leads (12) via the spacer (140) so that the upper leads and the lower leads make contact outside the encapsulating resin (2).
Claim 23
Independent Claim
123 words
A method of producing a semiconductor device comprising the steps of: (a) mounting a semiconductor chip (1) on a stage (13, 51a, 15b, 56, 59), said semiconductor chip having a circuit forming surface (1a); (b) electrically connecting each of inner leads (4) having tip ends which are located above the circuit forming surface (1a) of the semiconductor chip (1) to the semiconductor chip, said inner leads forming leads together with outer leads (5); and (c) encapsulating the semiconductor chip (1) and the inner leads (4) by an encapsulating resin (2) in a state where a predetermined gap is formed between the inner leads and the circuit forming surface of the semiconductor chip, so that the outer leads extend outwardly of the encapsulating resin.
Claim 24
Dependent Claim
42 words
The method as claimed in claim 23, characterized in that said step (c) forms the encapsulating resin (2) to a size which is approximately the same as that of the semiconductor chip (1) but slight larger than that of the semiconductor chip.
Claim 25
Dependent Claim
60 words
The method as claimed in claim 23 or 24, characterized in that the stage (13, 51a, 51b, 56, 59) is supported by stage support parts (130a, 130b) which extend outwardly of the stage during said steps (a), (b) and (c), and a height position of the inner leads (4) during said step (b) is higher than that of the stage.
Claim 26
Dependent Claim
41 words
The method as claimed in claim 25, characterized in that there is further provided the step step of: (d) cutting the stage support parts (130a, 130b) extending outwardly of the encapsulating resin (2) and the outer leads (5) to predetermined lengths.
Claim 27
Independent Claim
131 words
The method as claimed in any of claims 23 to 26, characterized in that: said step (a) uses a stage frame (9) which includes a first frame (15₁), the stage (13, 51a, 51b, 56, 59) and stage support parts (130a, 130b) which connect the stage to the first frame, said stage support parts having a bent part (10) such that a height position of the stage is lower than that of the first frame by a distance corresponding to a thickness of the semiconductor chip (1); and said step (b) uses a lead frame (8) which includes a second frame (15₂) and the leads which connect to the second frame via the outer leads (5), and places the lead frame on top of the stage frame before making the electrical connections.
Claim 28
Dependent Claim
57 words
The method as claimed in claim 27, characterized in that both the stage frame (9) and the lead frame (8) include positioning holes (16) in the respective first and second frames (15₁, 15₂), and said step (b) aligns the lead frame relative to the stage frame by aligning the positioning holes in the first and second frames.
Claim 29
Dependent Claim
56 words
The method as claimed in claim 28, characterized in that there is further provided the step of: (d) removing the encapsulating resin (2) from the stage frame (9) and the lead frame (8) by cutting the stage support parts (130a, 130b) extending outwardly of the encapsulating resin (2) and the outer leads (5) to predetermined lengths.
Claim 30
Independent Claim
47 words
The method as claimed in any of claims 27 to 29, characterized in that the bent part (10) of the stage support part (130a, 130b) includes a part which is thinner than other parts for absorbing expansion and contraction of the stage (13, 51a, 51b, 56, 59).
Claim 31
Independent Claim
78 words
The method as claimed in any of claims 27 to 30, characterized in that said step (c) uses upper and lower dies (24, 23) which respectively sandwich the lead frame (8) and the stage frame (9) and injects the encapsulating resin (2) into a space defined by the upper and lower dies, said upper and lower dies correcting an error in the height position of the stage (13, 51a, 51b, 56, 59) relative to the first frame (15₁).
Claim 32
Dependent Claim
56 words
The method as claimed in claim 31, characterized in that said step (a) uses a stage frame (9) in which the bent part (10) of the stage support part (130a, 130b) includes means for absorbing stress caused by the upper and lower dies (24, 23) which respectively sandwich the lead frame (8) and the stage frame.
Claim 33
Dependent Claim
99 words
The method as claimed in claim 31 or 32, characterized in that said step (b) uses a spacer (140) which is interposed between the stage frame (9) and the lead frame (8) in a region outside a region where the encapsulating resin (2) is formed in said step (c) so as to maintain the stage (13, 51a, 51b, 56, 59) approximately parallel to the inner leads (4) within the encapsulating resin, said upper and lower dies (24, 23) correcting the error in the height position of the stage relative to the first frame (15₁) in cooperation with the spacer.
Claim 34
Dependent Claim
46 words
The method as claimed in claim 27, characterized in that said step (b) positions the lead frame (8) relative to the stage frame (9) so that the stage (13, 51a, 51b, 56, 59) is approximately parallel to the inner leads (4) within the encapsulating resin (2).
Claim 35
Dependent Claim
69 words
The method as claimed in claim 34, characterized in that said step (b) uses a spacer (140) which is interposed between the stage frame (9) and the lead frame (8) in a region outside a region where the encapsulating resin (2) is formed in said step (c) so as to maintain the stage (13, 51a, 51b, 56, 59) approximately parallel to the inner leads (4) within the encapsulating resin.
Claim 36
Dependent Claim
51 words
The method as claimed in claim 35, characterized in that said step (b) positions the lead frame (8) on the stage frame (9) so that the lead frame makes contact with the stage frame in the region outside the region where the encapsulating resin (2) is formed in said step (c).
Claim 37
Independent Claim
74 words
The method as claimed in any of claims 23 to 35 or 36, characterized in that a shock absorbing member (100) is provided on the tip end of each inner lead (4) on a surface confronting the circuit forming surface (1a) of the semiconductor chip (1), and said step (b) pushes the inner leads against the circuit forming surface to stabilize the inner leads when electrically connecting the inner leads to the semiconductor chip.
Claim 38
Independent Claim
27 words
The method as claimed in any of claims 23 to 37, characterized in that said step (c) completely fills the predetermined gap by the encapsulating resin (2).
Claim 39
Independent Claim
40 words
The method as claimed in any of claims 23 to 38, characterized in that said step (c) makes the encapsulation so that at least a part of a bottom surface of the stage (13, 51a, 51b, 56, 59) is exposed.
Claim 40
Dependent Claim
43 words
The method as claimed in claim 23, characterized in that said step (b) positions the inner leads (4) relative to the stage (13, 51a, 51b, 56, 59) so that the stage is approximately parallel to the inner leads within the encapsulating resin (2).
References Cited (Backward Citations)
No citation records indexed.
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