Method and apparatus for cleaning substrate

Abstract

Abstract A method and apparatus for treating substrates, wherein a substrate holder (3) in which the substrates (2) to be treated are put is mounted on a rotary table (5) with a rotary shaft (4) connected thereto in a treating chamber (1), an ozone-containing gas is fed into the treating chamber through an ozone feed nozzle (7) to fill therein with the ozone-containing gas, ultra-pure water is fed onto the substrates through an associated nozzle (9) while they are rotating, thereby treating them with the thin films of ultra-pure water formed on their surfaces, ultra-pure water alone is fed after removal of undesired materials to rinse the substrates, and the substrates are rotated after the interruption of ultra-pure water for spinning off the ultra-pure water and drying, thereby increasing the rate of removal-by-ozone of organic materials, deposits and the like from the substrates, like wafers.

Inventors

• 👤 Terumi C/O Chlorine Engineers Corp. Ltd Matsuoka

Bibliographic Details