Semiconductor package for flip-chip mounting process

Claim 1

A semiconductor chip for mounting on a package substrate by a flip-chip process, comprising: a plurality of electrode pads (22) of a first group provided on a major surface (21a) of said semiconductor chip (20) for external electrical connection, each of said electrode pads of said first group having a first lateral size and connected electrically to an active part (201a) of said semiconductor chip, said electrode pads of said first group being provided in rows and columns on said major surface of said semiconductor chip; each of said electrode pads of said first group being covered by a solder bump (22) that projects from said major surface of said semiconductor chip with a first distance (H); characterized in that the semiconductor chip further comprises: a plurality of electrode pads (23) of a second group each having a second lateral size substantially larger than said first lateral size and provided on said major surface (21a) of said semiconductor chip in electrical connection with an active part of said semiconductor chip that is used for a burn-in process; each of said electrode pads of said second group being formed of a conductor material having a melting point higher than said solder bump (22) and projecting from said major surface of said semiconductor chip with a second distance (h) that is substantially smaller than said first distance. each of said electrode pads (23) of said second group being connected electrically to a corresponding electrode pad (22) of said first group.