Patent EP0516096A2 successfully refreshed from Google Patents.
EP0516096A2
Expired / Lapsed
EP
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Semiconductor device unit having holder and method of mounting semiconductor devices using holder
Assignee: Fujitsu Ltd
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Filing: 1992-05-27
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Granted: —
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Expires: 2012-05-27
Abstract
Abstract A semiconductor device unit includes a holder (3, 13, 63, 73, 83) having a plurality of holding parts (6, 16, 66, 76, 86), and a plurality of semiconductor devices (2, 2₁-2₃) held by the holding parts of the holder. Each of the semiconductor devices have a generally parallelepiped shape with top and bottom surfaces and at least one side surface provided with leads (5) which are exposed when the semiconductor device is held by the holding part of the holder.
Inventors
- 👤 Norio C/O Fujitsu Limited Taniguchi
- 👤 Junichi C/O Fujitsu Limited Kasai
- 👤 Kazuto C/O Fujitsu Limited Tsuji
- 👤 Michio c/o Fujitsu Limited Sono
- 👤 Masanori c/o Fujitsu Limited Yoshimoto
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 05:15
CPC Classifications
H; H10; H10W; H10W90/00; H05; H05K; H05K3/00; H05K3/30; H05K3/301; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/461; H10W78/00; H10W70/60; H10W90/20; H10W90/288; Y; Y10; Y10S; Y10S269/00; Y10S269/903
Claims Analysis
Total Claims: 36
Claim 1
Independent Claim
87 words
A semiconductor device unit characterized in that there are provided: a holder (3, 13, 63, 73, 83) having a plurality of holding parts (6, 16, 66, 76, 86); and a plurality of semiconductor devices (2, 2₁-2₃) held by the holding parts of said holder, and that each of said semiconductor devices have a generally parallelepiped shape with top and bottom surfaces and at least one side surface provided with leads (5) which are exposed when the semiconductor device is held by the holding part of the holder.
Claim 2
Dependent Claim
43 words
The semiconductor device unit as claimed in claim 1, characterized in that the holding parts (6, 16, 66, 76, 86) of said holder (3, 13, 63, 73, 83) hold said semiconductor devices (2, 2₁-2₃) in a vertical arrangement and parallel to each other.
Claim 3
Dependent Claim
54 words
The semiconductor device unit as claimed in claim 1 or 2, characterized in that the holding parts (6, 16, 66, 76, 86) of said holder (3, 13, 63, 73, 83) have a slot structure such that at least one side surface of each semiconductor device (2, 2₁-2₃) provided with the leads (5) is exposed.
Claim 4
Dependent Claim
46 words
The semiconductor device unit as claimed in claim 1 or 2, characterized in that the holding parts (16) of said holder (13) have a well structure such that only one side surface of each semiconductor device (2, 2₁, 2₂) provided with the leads (5) is exposed.
Claim 5
Dependent Claim
52 words
The semiconductor device unit as claimed in claim 1 or 2, characterized in that the holding parts (66) of said holder (63) have a slot structure such that only an end part of each semiconductor device (2, 2₁, 2₂) excluding the end provided with the leads (5) is held by said holder.
Claim 6
Dependent Claim
52 words
The semiconductor device unit as claimed in claim 1 or 2, characterized in that the holding parts (6, 76, 86) of said holder (3, 73, 83) have a slot structure such that two side surfaces of each semiconductor device (2, 2₁-2₃) and including the side surface provided with the leads are exposed.
Claim 7
Dependent Claim
62 words
The semiconductor device unit as claimed in claim 6, characterized in that the semiconductor device (2, 2₁, 2₂) has a cooling fin (44) which extends outwardly from a first side surface of the semiconductor device, and the first side surface of the semiconductor device is one of the two side surfaces exposed via the holding part (6) which has the slot structure.
Claim 8
Dependent Claim
66 words
The semiconductor device unit as claimed in claim 6, characterized in that an end part of the semiconductor device (2, 2₁-2₃) including a first side surface of the semiconductor device projects from said holder (3, 73, 83), and the first side surface of the semiconductor device is one of the two side surfaces exposed via the holding part (3, 73, 83) which has the slot structure.
Claim 9
Dependent Claim
41 words
The semiconductor device unit as claimed in any of claims 1 to 8, characterized in that there is further provided a cooling part (24, 34, 54) provided on said holder (3) for radiating heat generated from each semiconductor device (2, 2₁-2₃).
Claim 10
Dependent Claim
29 words
The semiconductor device unit as claimed in claim 9, characterized in that said cooling part (24, 34, 54) covers at least one predetermined outer surface of said holder (3).
Claim 11
Dependent Claim
37 words
The semiconductor device unit as claimed in claim 9, characterized in that said cooling part (34, 54) comprises a plurality of pins (34, 54a) which project from at least one predetermined outer surface of said holder (3).
Claim 12
Dependent Claim
54 words
The semiconductor device unit as claimed in any of claims 9 to 11, characterized in that said holder (3) is made of a material selected from a group consisting of metals and plastics, and said cooling part (24, 34, 54) is made of a material selected from a group consisting of metals and plastics.
Claim 13
Dependent Claim
29 words
The semiconductor device unit as claimed in claim 12, characterized in that said holder (3) and said cooling part (24, 34, 54) are integrally formed from the same material.
Claim 14
Dependent Claim
36 words
The semiconductor device unit as claimed in any of claims 1 to 13, characterized in that each holding part (6, 16, 66, 76) of said holder (3, 13, 63, 73) holds one semiconductor device (2, 2₁-2₃).
Claim 15
Dependent Claim
32 words
The semiconductor device unit as claimed in any of claims 1 to 13, characterized in that each holding part (86) of said holder (83) holds a plurality of semiconductor devices (2, 2₁-2₃).
Claim 16
Dependent Claim
55 words
The semiconductor device unit as claimed in any of claims 1 to 15, characterized in that the holding parts (76) of said holder (73) include first holding parts (76 V ) for vertically holding the semiconductor devices (2, 2₁-2₃) and second holding parts (76 H ) for horizontally holding the semiconductor devices (2, 2₁, 2₂).
Claim 17
Dependent Claim
40 words
The semiconductor device unit as claimed in claim 16, characterized in that the semiconductor device (2₃) held by the first holding part (76 V ) of said holder (73) has the leads (5) provided on two adjacent side surfaces thereof.
Claim 18
Dependent Claim
55 words
The semiconductor device unit as claimed in any of claims 1 to 17, characterized in that walls of said holder (3, 13, 63, 73, 83) defining the holding part (6, 16, 66, 76, 86) make contiguous contact with at least the top and bottom surfaces of the semiconductor device (2, 2₁-2₃) which is held thereby.
Claim 19
Dependent Claim
58 words
The semiconductor device unit as claimed in claim 18, characterized in that a lubricant is coated on at least one of the walls of said holder (3, 13, 63, 73, 83) defining the holding part (6, 16, 66, 76, 86) and at least the top and bottom surfaces of the semiconductor device (2, 2₁-2₃) which is held thereby.
Claim 20
Dependent Claim
41 words
The semiconductor device unit as claimed in any of claims 1 to 19, characterized in that the leads (5) of the semiconductor device (2, 2₂, 2₃) has a shape selected from a group consisting of an L-shape and a loop shape.
Claim 21
Dependent Claim
35 words
The semiconductor device unit as claimed in any of claims 1 to 19, characterized in that the leads (5) of the semiconductor device (2₁) are arranged in a zigzag pattern on the side surface thereof.
Claim 22
Dependent Claim
37 words
The semiconductor device unit as claimed in any of claims 1 to 21, characterized in that each of said semiconductor devices (2, 2₁-2₃) have a thickness such that the semiconductor device does not stand vertically by itself.
Claim 23
Independent Claim
90 words
A method of mounting a plurality of semiconductor devices (2, 2₁-2₃) having leads (5) provided on at least one side surface thereof onto a circuit substrate (7), characterized in that said method comprises the steps of: (a) holding the semiconductor devices (2, 2₁-2₃) in holding parts (6, 16, 66, 76, 86) of a holder (3, 13, 63, 73, 83) so that the leads (5) are exposed; and (b) mounting the semiconductor devices held by the holder onto the circuit substrate (7) by connecting the exposed leads to the circuit substrate.
Claim 24
Dependent Claim
37 words
The method as claimed in claim 23, characterized in that said step (a) uses a holder (3, 13, 63, 73, 83) which holds the semiconductor devices (2, 2₁-2₃) in a vertical arrangement and parallel to each other.
Claim 25
Dependent Claim
55 words
The method as claimed in claim 23 or 24, characterized in that said step (a) uses a holder (3, 13, 63, 73, 83) having holding parts (6, 16, 66, 76, 86) with a slot structure such that at least one side surface of each semiconductor device (2, 2₁-2₃) provided with the leads (5) is exposed.
Claim 26
Dependent Claim
52 words
The method as claimed in claim 23 or 24, characterized in that said step (a) uses a holder (63) having holding parts (66) with a slot structure such that only an end part of each semiconductor device (2, 2₁-2₃) excluding the end provided with the leads (5) is held by the holder.
Claim 27
Dependent Claim
54 words
The method as claimed in claim 23 or 24, characterized in that said step (a) uses a holder (3, 73, 83) having holding parts (6, 76, 86) with a slot structure such that two side surfaces of each semiconductor device (2, 2₁-2₃) and including the side surface provided with the leads (5) are exposed.
Claim 28
Independent Claim
39 words
The method as claimed in any of claims 23 to 27, characterized in that said step (a) uses a holder (3) provided with a cooling part (24, 34, 54) for radiating heat generated from each semiconductor device (2, 2₁-2₃).
Claim 29
Independent Claim
42 words
The method as claimed in any of claims 23 to 28, characterized in that said step (a) uses a holder (3, 13, 63, 73) such that each holding part (6, 16, 66, 76) of the holder holds one semiconductor device (2, 2₁-2₃).
Claim 30
Independent Claim
38 words
The method as claimed in any of claims 23 to 28, characterized in that said step (a) uses a holder (83) such that each holding part (86) of the holder holds a plurality of semiconductor devices (2, 2₁-2₃).
Claim 31
Independent Claim
52 words
The method as claimed in any of claims 23 to 30, characterized in that said step (a) uses a holder (73) including first holding parts (76 V ) for vertically holding the semiconductor devices (2, 2₁-2₃) and second holding parts (76 H ) for horizontally holding the semiconductor devices (2, 2₁, 2₂).
Claim 32
Dependent Claim
41 words
The method as claimed in claim 31, characterized in that said step (a) holds by the first holding part (76 V ) of the holder (73) a semiconductor device (2₃) having the leads (5) provided on two adjacent side surfaces thereof.
Claim 33
Independent Claim
70 words
The method as claimed in any of claims 23 to 32, characterized in that said step (a) holds the semiconductor devices (2, 2₁-2₃) in the holding parts (6, 16, 66, 76, 86) of the holder (3, 13, 63, 73, 83) so that walls of the holder defining the holding part make contiguous contact with at least top and bottom surfaces of the semiconductor device (2, 2₁-2₃) which is held thereby.
Claim 34
Dependent Claim
59 words
The method as claimed in claim 33, characterized in that said step (a) includes coating a lubricant on at least one of the walls of the holder (3, 13, 63, 73, 83) defining the holding part (6, 16, 66, 76, 86) and at least the top and bottom surfaces of the semiconductor device (2, 2₁-2₃) which is held thereby.
Claim 35
Independent Claim
47 words
The method as claimed in any of claims 23 to 34, characterized in that said step (b) mounts the semiconductor devices (2, 2₁-2₃) held by the holder (3, 13, 63, 73, 83) onto the circuit substrate (7) by soldering the exposed leads (5) to the circuit substrate.
Claim 36
Independent Claim
40 words
The method as claimed in any of claims 23 to 35, characterized in that each of the semiconductor devices (2, 2₁-2₃) have a thickness such that the semiconductor device does not stand vertically by itself on the circuit substrate (7).
References Cited (Backward Citations)
No citation records indexed.
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