Patent EP0513743A2 successfully refreshed from Google Patents.
EP0513743A2
Expired / Lapsed
EP
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Semiconductor package for surface mounting
Assignee: Fujitsu Ltd
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Filing: 1992-05-12
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Granted: —
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Expires: 2012-05-12
Abstract
Abstract A semiconductor device (10) having a package (11) of a single in-line type comprises a semiconductor chip (15), a package body (11) that accommodates the semiconductor chip (15) therein and defined by a pair of opposing major surfaces (11a, 11b), a plurality of interconnection leads (14) held by the package body to extend substantially perpendicularly to a bottom surface (11 f ), wherein each of the interconnection leads consists of an inner lead part (14b) located inside the package body and an outer lead part (14a) located outside the package body, the outer lead part being bent laterally at a boundary between the inner part and outer part, in one of first and second directions that are opposite from each other and substantially perpendicular to the opposing major surfaces (11a, 11b) of the package body. The semiconductor device further includes a plurality of support legs (12a - 13b) extending laterally at the bottom surface (11 f ) of the package body for supporting the package body upright when the semiconductor device is placed on a substrate.
Inventors
- 👤 Sono c/o Fujitsu Limited Michio
- 👤 Kasai c/o Fujitsu Limited Junichi
- 👤 Yoshimoto C/O Fujitsu Limited Masanori
- 👤 Tsuji c/o Fujitsu Limited Kazuto
- 👤 Saito c/o Fujitsu Limited Kouji
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 14:45
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/427; H10W70/429; H10W90/00; H10W90/811; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09709; H05K2201/09781; H05K2201/10; H05K2201/10431; H05K2201/10439; H05K2201/10454; H05K2201/10507; H05K2201/10522; H05K2201/10568; H05K2201/10613; H05K2201/10621; H05K2201/10659; H05K2201/10696; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/3426; H10W72/00; H10W72/50; H10W72/531; H10W72/5363; H10W72/541; H10W72/5445; H10W72/551; H10W72/552; H10W72/5522; H10W72/90; H10W72/931; H10W72/932; H10W74/00; H10W90/701; H10W90/751; H10W90/756; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
237 words
A semiconductor device having a package of a single in-line type, comprising: a semiconductor chip (15); a package body (11) that accommodates said semiconductor chip therein, said package body being defined by a pair of opposing major surfaces (11a, 11b) and surrounded by a side wall (11c - 11f) connecting said pair of opposing major surfaces, said side wall including an edge part (11f) that extends substantially straight, when viewed in a direction perpendicular to said major surfaces, to form a substantially straight edge surface; and a plurality of interconnection leads (14) held by said package body to extend substantially perpendicularly to said edge surface, each of said interconnection leads being connected to said semiconductor chip electrically, each of said interconnection leads consisting of an inner lead part (14b) located inside said package body and an outer lead part (14a) located outside said package body, characterized in that: said outer lead part is bent laterally at a boundary between said inner part and outer part, in one of first and second directions that are opposite from each other and substantially perpendicular to said opposing major surfaces; and that there is provided a plurality of support legs (12a - 13b; 65, 66) provided on said package body in correspondence to said edge part to extend in said first and second directions, said support legs supporting said package body upright when said semiconductor device is placed on a substrate.
Claim 2
Dependent Claim
117 words
A semiconductor device as claimed in claim 1 characterized in that said plurality of support legs (12a - 13b) are held by said package body (11) to extend substantially perpendicularly to said edge surface (11 f ), each of said support legs consisting of an inner part located inside said package body and an outer part located outside said package body, said outer part of said support leg being bent laterally in one of said first and second directions at a boundary between said inner part and said outer part of said support leg, said outer end of said support legs being bent such that said package body is held upright when placed on said substrate (19).
Claim 3
Dependent Claim
51 words
A semiconductor device as claimed in claim 2 characterized in that said package body (11) comprises a resin, wherein said semiconductor chip (15), said inner lead part (14b) of said interconnection leads (14), and said inner part of said support legs (12a - 13b) are embedded in said resin package body.
Claim 4
Dependent Claim
29 words
A semiconductor device as claimed in claim 1 characterized in that each outer lead part (14a) of said interconnection leads is bent alternately in said first and second directions.
Claim 5
Dependent Claim
27 words
A semiconductor device as claimed in claim 1 characterized in that said outer lead parts of said interconnection leads (51) are all bent in a same direction.
Claim 6
Dependent Claim
76 words
A semiconductor device as claimed in claim 1 characterized in that said interconnection leads are grouped into a plurality of lead groups each including a plurality of interconnection leads (41₋₁, 41₋₂; 41₋₃, 41₋₄; 41₋₅, 41₋₆) located adjacent with each other, said outer lead part extending in a same direction for those interconnection leads that belong to the same lead group, wherein a direction of extension of said outer leads is changed alternately in each lead group.
Claim 7
Dependent Claim
28 words
A semiconductor device as claimed in claim 1 characterized in that said semiconductor chip (15) is connected to each of said interconnection leads by a bonding wire (17).
Claim 8
Dependent Claim
28 words
A semiconductor device as claimed in claim 1 characterized in that said semiconductor chip (15) is connected to each of said interconnection leads by a tape lead (18).
Claim 9
Dependent Claim
49 words
A semiconductor device as claimed in claim 2 characterized in that said package body (11) further comprises a stage member (13c) embedded in said package body for supporting said semiconductor chip (15) thereon, said support legs (12a - 13b) being formed as a unitary body with said stage member.
Claim 10
Dependent Claim
53 words
A semiconductor device as claimed in claim 9 characterized in that said semiconductor device includes an additional semiconductor chip (33), said stage member having first and second, mutually opposing major surfaces, said semiconductor chip and said additional semiconductor chip being provided on said first and second major surfaces of said stage member respectively.
Claim 11
Dependent Claim
89 words
A semiconductor device as claimed in claim 9 characterized in that each of said stage member (13c), said support legs (12a - 13b) and said interconnection leads (14) comprises a composite conductor body comprising a first layer (27c) of a copper alloy and a second layer (27a, 27b) of an iron alloy stacked with each other, said first layer having a first thickness t while said second layer having a second thickness T, wherein there holds a relationship 0.3 ≦ t/T ≦ 2 between the first and second thicknesses.
Claim 12
Dependent Claim
49 words
A semiconductor device as claimed in claim 11 characterized in that said composite conductor body has first and second opposing major surfaces separated with each other by an overall thickness W, wherein there holds a relationship 0.4 ≦ t/W ≦ 0.7 between the first thickness and the overall thickness.
Claim 13
Dependent Claim
27 words
A semiconductor device as claimed in claim 11 characterized in that said copper alloy contains Cu, Sn and Zn, while said iron alloy contains Fe and Ni.
Claim 14
Dependent Claim
29 words
A semiconductor device as claimed in claim 9 characterized in that said stage member (13c) is provided with an opening (28a - 28f) for dispersing a stress applied thereto.
Claim 15
Dependent Claim
54 words
A semiconductor device as claimed in claim 2 characterized in that said semiconductor device further comprises a reinforce member (63) provided in correspondence to each of said support legs, said reinforce member being provided to support said package body against a tilting by making a contact with said major surfaces of said package body.
Claim 16
Dependent Claim
29 words
A semiconductor device as claimed in claim 1 characterized in that said plurality of support legs (65, 66) are provided as a unitary body with said package body (11).
Claim 17
Dependent Claim
32 words
A semiconductor device as claimed in claim 1 characterized in that said package body is provided with a projection (73) on each of said major surfaces such that the projections protrude laterally.
Claim 18
Dependent Claim
32 words
A semiconductor device as claimed in claim 1 characterized in that said outer lead part (14a) of said interconnection leads extend beyond said major surfaces (11a, 11b) of the package body (11).
Claim 19
Dependent Claim
35 words
A semiconductor device as claimed in claim 1 characterized in that said outer lead part (14a) of said interconnection leads (14) and said support legs (12a - 13b) are provided substantially on a same plane.
References Cited (Backward Citations)
No citation records indexed.
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