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EP0510607B1 Expired / Lapsed EP ⏱️ 0.0 years remaining

Semiconductor memory device

Assignee: Canon Inc
•
Filing: 1992-04-22
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Granted: 1998-02-04
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Expires: 2012-04-22
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Abstract

No abstract record available.

Inventors

  • 👤 Mamoru C/O Canon Kabushiki Kaisha Miyawaki
  • 👤 Akira C/O Canon Kabushiki Kaisha Ishizaki
  • 👤 Genzo c/o Canon Kabushiki Kaisha Monma
  • 👤 Hiroshi C/O Canon Kabushiki Kaisha Yuzurihara
  • 👤 Tetsunobu C/O Canon Kabushiki Kaisha Kohchi

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-09 09:15
CPC Classifications
H; H10; H10D; H10D30/00; H10D30/60; H10D30/62; H10D30/6211; H10B; H10B12/00; H10B12/30; H10B69/00; H10D30/01; H10D30/021; H10D30/024; H10D84/00; H10D84/01; H10D84/0123; H10D84/0126; H10D84/0149; H10D84/02; H10D84/03; H10D84/038

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 171 words
A semiconductor memory device comprising: an insulated gate type transistor including a source electrode region (1008; 1030) and a drain electrode region (1006; 1017) and a channel region (1021) provided between said source and drain electrode regions (1008, 1006; 1030, 1017), and a gate electrode (1007; 1023; 1068, 1069) provided on said channel region (1021) with a gate insulator (1022) provided therebetween; and an electrically breakable memory element (1009'; 1031'; 1041') provided on one of said source and drain electrode regions (1008, 1006; 1030, 1017); characterized in that a semiconductor region (1016) is provided below and in contact with said channel region (1022), said semiconductor region (1016) having the same conductivity type as that of said channel region (1021) and a higher impurity concentration than said channel region (1021); and said gate electrode (1007; 1023; 1068, 1069) and said semiconductor region (1016) provided adjacent to said channel region (1021) in combination enclose at least four surfaces of said channel region (1021) which run in a direction in which carriers are mobilized.
Claim 2
Dependent Claim 55 words
A semiconductor memory device according to claim 1, characterized by further comprising a second semiconductor region (1080) provided on the surface of said channel region (1021) which is remote from said semiconductor region (1016) and has the same conductivity type as said channel region (1021) and a higher impurity concentration than said channel region (1021).
Claim 3
Dependent Claim 70 words
A semiconductor memory according to claim 1, characterized by further comprising a third semiconductor region (1085) provided between said source and drain electrode regions (1008, 1006; 1030, 1017) and said channel region (1021), said third semiconductor region (1085) having the same conductivity type as said source and drain electrode regions (1008, 1006; 1030, 1017) and a lower impurity concentration than said source and drain electrode regions (1008, 1006; 1030, 1017).
Claim 4
Dependent Claim 44 words
A semiconductor memory device according to any of the preceding claims 1 to 3, characterized in that said memory element (1009'; 1031'; 1041') has a semiconductor layer; and writing is performed by breaking a junction between said semiconductor layer and another layer adjoining thereto.
Claim 5
Dependent Claim 37 words
A semiconductor memory device according to any of the preceding claims 1 to 4, characterized by further comprising an interconnection for a power source which runs in a direction of the source and drain of said transistor.
Claim 6
Dependent Claim 40 words
A semiconductor memory device according to any of the preceding claims 1 to 4, characterized in that an interconnection for a power source is disposed in a direction which crosses a direction of the source and drain of said transistor.
Claim 7
Dependent Claim 98 words
A semiconductor memory device, characterized in that a plurality of memory devices according to any of the preceding claims 1 to 4 is provided, said plurality of memory devices being matrix connected to each other by a plurality of first interconnections (1001, 1001' 1001'') which are common to the gate electrodes of said plurality of memory devices, and a plurality of second interconnections (1002, 1002', 1002''; 1025; 1032; 1082) which are common to the memory elements of said plurality of memory devices, a power source line being disposed between adjacent second interconnections (1002, 1002', 1002''; 1025; 1032; 1082).
Claim 8
Dependent Claim 27 words
A semiconductor memory device according to claim 1, characterized in that said semiconductor region (1016) has a portion sandwiched between a part of said gate electrode (1023).

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