Curable organopolysiloxane gel composition

Claim 1

A curable organopolysiloxane gel composition comprising: (A) 100 parts by weight of a diorganopolysiloxane which contains at least two silicon-bonded alkenyl groups in the molecule having a viscosity at 25°C of 50 to 100,000 centipoise and containing no more than 0.5 percent by weight of tetrameric to eicosameric cyclic diorganosiloxanes; (B) 1 to 50 parts by weight of an organopolysiloxane resin which contains silicon-bonded alkenyl groups and which is composed of the units R¹₃SiO 1/2 where R¹ = alkyl, R¹₂R²SiO 1/2 where R¹ = alkyl and R² = alkenyl, and SiO₂, the ratio between the total number of moles of R¹₃SiO 1/2 units and R¹₂R²SiO 1/2 units and the number of moles of SiO₂ units being within the range of 0.6:1 to 4.0:1; (C) an SiH-terminated diorganopolysiloxane with a viscosity of 1 to 1,000,000 centipoise at 25°C wherein component (C) is added in a quantity to provide values of 1:0.2 to 1:5.0 for the ratio between the total number of moles of alkenyl groups in components (A) and (B) and the number of moles of silicon-bonded hydrogen atoms in component (C); and (D) a hydrosilylation reaction catalyst.