Patent EP0506122A2 successfully refreshed from Google Patents.
EP0506122A2
Expired / Lapsed
EP
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Power module
Assignee: Panasonic Holdings Corp
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Filing: 1992-03-27
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Granted: —
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Expires: 2012-03-27
Abstract
Abstract In order to accomplish the miniaturization of a power module, the invention proposes such one which comprises a high frequency multi-stage power amplifier circuit which includes a chip part and a power amplifier semiconductor each mounted on a printed-circuit board that is firmly fixed to a heat radiation plate by fixing means like soldering, wherein there is arranged a microstrip line in an area of the printed-circuit board under a suface mounting type package in which said power amplifier semiconductor is mounted. <IMAGE> <IMAGE>
Inventors
- 👤 Osamu Ishikawa
- 👤 Yorito Ota
- 👤 Masahiro Maeda
- 👤 Chinatsu Azuma
- 👤 Manabu Yanagihara
- 👤 Katsunori Nishii
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-07 14:19
CPC Classifications
H; H10; H10W; H10W90/00; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0237; H05K1/0243; H05K1/0201; H05K1/0216; H05K1/023; H05K1/0231; H05K1/0286; H05K1/0293; H05K1/03; H05K1/05; H05K1/18; H05K1/182; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0305; H05K2201/09; H05K2201/09209; H05K2201/09218; H05K2201/09263; H05K2201/09654; H05K2201/09772; H05K2201/09818; H05K2201/0989; H05K2201/10; H05K2201/10007; H05K2201/10022; H05K2201/10166; H05K2201/10227; H05K2201/10363; H05K2201/10613; H05K2201/10621; H05K2201/10636; H05K2203/00; H05K2203/17; H05K2203/171; H05K3/00; H05K3/0058; H05K3/0061; H05K3/22; H05K3/222; H05K3/30; H05K3/32; H05K3/34; H05K3/3452; H10W90/701; H10W90/731; H10W90/734; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
69 words
A power module which comprises a high frequency multi-stage power amplifier circuit which includes chip parts and power amplifier semiconductors mounted on a printed-circuit board that is firmly fixed to a heat radiation plate by fixing means like soldering, characterized in that there is arranged a microstrip line in an area of said printed-circuit board under a suface mounting type package in which said power amplifier semiconductor is mounted.
Claim 2
Dependent Claim
71 words
A power module which comprises a high frequency multi-stage power amplifier circuit which includes chip parts and power amplifier semiconductors mounted on a printed-circuit board that is firmly fixed to a heat radiation plate by fixing means like soldering, characterized in that a higher harmonic series resonance circuit made up of a microstrip line and a capacitance chip part is configured in parallel with a load circuit of a last stage.
Claim 3
Dependent Claim
75 words
A power module which comprises a high frequency multi-stage power amplifier circuit which includes chip parts and power amplifier semiconductors mounted on a printed-circuit board that is firmly fixed to a heat radiation plate by fixing means like soldering, characterized in that a plurality of higher harmonic series resonance circuits each made up of a microstrip line and a capacitance chip part are connected in parallel with a load circuit of a last output stage.
Claim 4
Dependent Claim
68 words
A power module which comprises a high frequency multi-stage power amplifier circuit which includes chip parts and power amplifier semiconductors each mounted on a printed-circuit board that is firmly fixed to a heat radiation plate by fixing means like soldering, characterized in that a last-stage output bias circuit, and a higher harmonic series resonance circuit made up of a microstrip line and a capacitance chip part are shared.
Claim 5
Dependent Claim
51 words
A power module which comprises a high frequency multi-stage power amplifier circuit which includes chip parts and power amplifier semiconductors mounted on a printed-circuit board that is firmly fixed to a heat radiation plate by fixing means like soldering, characterized in that a resistor is inserted between amplifier stages in series.
Claim 6
Dependent Claim
113 words
A power module which comprises a high frequency multi-stage power amplifier circuit which includes chip parts and power amplifier semiconductors mounted on a printed-circuit board that is firmly fixed to a heat radiation plate by fixing means like soldering wherein a resist coating having an electrical insulating effect is applied to the surfaces of a microstrip line and said printed-circuit board, characterized in that there is provided an opening or a plurality of openings in said resist coating, said opening spreading to a turning area or a plurality of turning areas of said microstrip line formed by turning it, and connecting together the opposing microstrip portions in the vicinity of said turning area.
Claim 7
Dependent Claim
66 words
A power module according to Claim 6, wherein, in a resist coating having an electrical insulating effect is applied to the surfaces of a microstrip line and said printed-circuit board, there is provided an opening or a plurality of openings in said resist coating, said opening connecting together the opposing microstrip line portions in the vicinity of a turning area formed by turning said microstrip line.
Claim 8
Dependent Claim
77 words
A power module which comprises a high frequency multi-stage power amplifier circuit which includes chip parts and power amplifier semiconductors mounted on a printed-circuit board that is firmly fixed to a heat radiation plate by fixing means like soldering, characterized in that gate or base bias circuits, which are common to each amplifier stage and includes a base microstrip line, are connected together, and an outer leading terminal of a gate or base bias circuit is shared.
Claim 9
Dependent Claim
79 words
A power module which comprises a high frequency multi-stage power amplifier circuit which includes chip parts and power amplifier semiconductors mounted on a printed-circuit board that is firmly fixed to a heat radiation plate by fixing means like soldering, characterized in that drain or collector bias circuits, which are common to each amplifier stage and includes a drain or collector microstrip line, are connected together, and an outer leading terminal of a drain or collector bias circuit is shared.
Claim 10
Dependent Claim
97 words
A power module which comprises a high frequency multi-stage power amplifier circuit which includes chip parts and power amplifier semiconductors mounted on a printed-circuit board that is firmly fixed to a heat radiation plate by fixing means like soldering, characterized in that bias circuits, which are spaced each other, are common to each amplifier stage and includes a microstrip line, are connected together on the surface of said printed-circuit board by means of a short cut chip part, and a wiring patter made up of another microstrip line is passed under the said short cut chip part.
Claim 11
Dependent Claim
105 words
A power module which comprises a high frequency multi-stage power amplifier circuit which includes chip parts and power amplifier semiconductors mounted on a printed-circuit board that is firmly fixed to a heat radiation plate by fixing means like soldering, characterized in that a wiring pattern is formed on the underside of said printed-circuit board; said underside wiring pattern is drawn out upward so that is emerges from the surface of said printed-circuit board through a through hole defined in said printed-circuit board; and a part of said heat radiation plate corresponding to said wiring pattern formed on the underside of said printed-circuit board is removed.
Claim 12
Dependent Claim
97 words
A power module which comprises a high frequency multi-stage power amplifier circuit which includes chip parts and power amplifier semiconductors each mounted on a printed-circuit board that is firmly fixed to a heat radiation plate by fixing means like soldering, characterized in that a wiring pattern is formed on a part of a ground area on the underside of said printed-circuit board, and the underside of said printed-circuit board is firmly fixed to a metal heat radiation plate by fixing means like soldering with said wiring pattern covered with a resist coating having an electrical insulating effect.
Claim 13
Dependent Claim
77 words
A power module which comprises a high frequency multi-stage power amplifier circuit which includes chip parts and power amplifier semiconductors mounted on a printed-circuit board that is firmly fixed to a heat radiation plate by fixing means like soldering, characterized in that the line width of a 180 degree turning area of a bias circuit using a microstrip line formed on said printed-circuit board is made wider than that of a straight area of said bias circuit.
References Cited (Backward Citations)
No citation records indexed.
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