EP0489428A1
Expired / Lapsed
EP
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Formation of heat-resistant dielectric coatings
Assignee: Shin-Etsu Chemical Co Ltd
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Filing: 1991-12-04
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Granted: —
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Expires: 2011-12-04
Abstract
Abstract Heat resistant, dielectric coatings are formed by applying a heat resistant coating composition comprising an organic silicon polymer, a silazane compound, and an inorganic filler to a substrate, and baking the coating in ammoniacal atmosphere at 200 to 1000°C. Similarly, heat resistant, dielectric coatings are formed by applying the same composition as above to a substrate, baking a first coating layer in air, applying an organic silicon polymer base coating composition to the first coating layer, and baking a second coating layer in ammonical atmosphere.
Inventors
- 👤 Yoshihumi Takeda
- 👤 Toshinobu Ishihara
- 👤 Ken'ichi Ito
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 14:05
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/02; C23C18/12; C23C18/1204; C23C18/122; B; B05; B05D; B05D3/00; B05D3/04; C04; C04B; C04B41/00; C04B41/009; C04B41/45; C04B41/50; C04B41/5053; C04B41/5062; C04B41/5066; C04B41/52; C04B41/80; C04B41/81; C04B41/85; C04B41/87; C04B41/89; C09; C09D; C09D183/00; C09D183/16; C23C18/1208; C23C18/1212; C23C18/1225; C23C18/125; C23C18/1275; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31652; Y10T428/31663
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
54 words
A method for forming a heat resistant, dielectric coating comprising the steps of applying a heat resistant coating composition comprising an organic silicon polymer, a silazane compound, and an inorganic filler to a substrate, and baking the coating in an atmosphere of ammonia gas or a mixture of ammonia gas and an inert gas.
Claim 2
Dependent Claim
37 words
The method of claim 1 wherein said coating composition contains about 5 to about 40% by weight of silazane compound and about 10 to about 70% by weight of inorganic filler, the remainder being organic silicon polymer.
Claim 3
Dependent Claim
17 words
The method of claim 1 wherein the baking step is at a temperature of 200 to 1000°C.
Claim 4
Independent Claim
74 words
A method for forming a heat resistant, dielectric coating comprising the steps of applying a first coating composition comprising an organic silicon polymer, a silazane compound, and an inorganic filler to a substrate, baking the first composition to form a first coating layer, applying a second coating composition comprising an organic silicon polymer to the first coating layer, and baking the second composition to form a second coating layer on the first coating layer.
Claim 5
Dependent Claim
32 words
The method of claim 4 wherein the step of baking the second composition is carried out in an atmosphere of ammonia gas or a mixture of ammonia gas and an inert gas.
Claim 6
Dependent Claim
37 words
The method of claim 4 wherein said coating composition contains about 5 to about 40% by weight of silazane compound and about 10 to about 70% by weight of inorganic filler, the remainder being organic silicon polymer.
Claim 7
Dependent Claim
26 words
The method of claim 4 wherein the step of baking the first composition is carried out in air at a temperature of at least about 200°C.
Claim 8
Dependent Claim
23 words
The method of claim 4 wherein the step of baking the second composition is carried out at a temperature of 400 to 800°C.
References Cited (Backward Citations)
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