Patent EP0488186A1 successfully refreshed from Google Patents.
EP0488186A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Shape of bonding pad of semiconductor device bonded by wire bonding method
Assignee: Toshiba Corp
•
Filing: 1991-11-26
•
Granted: —
•
Expires: 2011-11-26
Abstract
Abstract A semiconductor chip (100) is die-bonded to a bed (101) of a lead frame. Bonding pads (102) are formed on the semiconductor chip (100) along its periphery. The bonding pads (102) have at least one obtuse-angle corner portion of corner portions facing a nearest side of the chip (100). Each of the bonding pads (102) is bonded to an inner lead portion (106) of the lead frame by a bonding wire (104).
Inventors
- 👤 Mitsuyuki c/o Intellectual Property Div. Kunieda
- 👤 Ikuo C/O Intellectual Property Div. Tsuchiya
- 👤 Junko c/o Intellectual Property Div. Maruyama
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-06 13:40
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/019; H10W72/90; H10W72/50; H10W72/071; H10W72/075; H10W72/07551; H10W72/07552; H10W72/07553; H10W72/07554; H10W72/521; H10W72/527; H10W72/531; H10W72/5363; H10W72/537; H10W72/541; H10W72/5449; H10W72/59; H10W72/931; H10W72/932; H10W72/934; H10W72/941; H10W72/944; H10W72/9445; H10W72/951; H10W72/952; H10W72/981; H10W72/983; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
58 words
A semiconductor device employing a wire bonding method for wiring a bonding pad formed on a semiconductor chip to an inner lead portion of a lead frame with a bonding wire, characterized in that: a planar shape of said bonding pad (102) has at least one obtuse-angle corner portion facing a nearest side of said semiconductor chip (100).
Claim 2
Dependent Claim
68 words
A semiconductor device employing a wire bonding method for wiring a bonding pad formed on a semiconductor chip to an inner lead portion of a lead frame with a bonding wire, characterized in that: a planar shape of a bonding pad (102) formed near a corner portion of said semiconductor chip (100) has at least one obtuse-angle corner portion facing a nearest side of said semiconductor chip (100).
Claim 3
Independent Claim
33 words
A device according to any one of claims 1 and 2, characterized in that said bonding pad (102) is formed in a region running along an outer periphery of said semiconductor chip (100).
Claim 4
Independent Claim
25 words
A device according to any one of claims 1 and 2, characterized in that a planar shape of said bonding pad (102) is a pentagon.
Claim 5
Independent Claim
25 words
A device according to any one of claims 1 and 2, characterized in that a planar shape of said bonding pad (102) is a hexagon.
Claim 6
Dependent Claim
157 words
A semiconductor device employing a wire bonding method for wiring a bonding pad formed on a semiconductor chip to an inner lead portion of a lead frame with a bonding wire, characterized by comprising: a first-level bonding pad (110) formed on said semiconductor chip (100); an insulating film (112) formed on said first-level bonding pad (110) and said semiconductor chip (100); an opening portion (103) formed in said insulating film (112) on said first-level bonding pad (110); and a second-level bonding pad (102) formed on said insulating film (112) and said first-level bonding pad (110) formed in said opening portion (103), said second-level bonding pad being formed such that a planar shape of said second-level bonding pad (102) has at least one obtuse-angle corner portion facing a nearest side of said semiconductor chip; wherein said second-level bonding pad (102) is electrically connected to an inner lead portion (106) of a lead frame by the bonding wire (104).
Claim 7
Dependent Claim
34 words
A device according to claim 6, characterized in that said first-level bonding pad (110) and said second-level bonding pad (102) are formed in a region running along an outer periphery of said semiconductor chip.
Claim 8
Dependent Claim
21 words
A device according to claim 6, characterized in that a planar shape of said first-level bonding pad (102) is a pentagon.
Claim 9
Dependent Claim
21 words
A device according to claim 6, characterized in that a planar shape of said second-level bonding pad (102) is a hexagon.
Claim 10
Dependent Claim
109 words
A semiconductor device employing a wire bonding method for wiring a bonding pad formed on a semiconductor chip to an inner lead portion of a lead frame with a bonding wire, characterized by comprising: a protection film (115) formed on said semiconductor chip (100) and said bonding pad (102); and an opening portion (114) formed in said protection film (115) on said bonding pad (102) such that at least one of corner portions facing a nearest side of said semiconductor chip (100) is an obtuse-angle portion; wherein said bonding pad (102) is electrically connected to an inner lead portion (106) of a lead frame through said opening portion (104).
Claim 11
Dependent Claim
27 words
A device according to claim 10, characterized in that said bonding pad (102) is formed in a region along an outer periphery of said semiconductor chip (100).
Claim 12
Dependent Claim
19 words
A device according to claim 10, characterized in that a shape of said opening portion (114) is a pentagon.
Claim 13
Dependent Claim
19 words
A device according to claim 10, characterized in that a shape of said opening portion (114) is a hexagon.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.