Patent US5216491A successfully refreshed from Google Patents.
Patent EP0488053A1 successfully refreshed from Google Patents.
EP0488053A1
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EP
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Method for manufacturing a semiconductor chip
Assignee: Tokyo Seimitsu Co Ltd
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Filing: 1991-11-21
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Granted: —
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Expires: 2011-11-21
Abstract
Abstract Semiconductor chip manufacturing method and device by which dicing data specific to the wafertype is stored on a media travelling with/on/attached to wafer(s) and being read out at dicing station by reading means, automatically setting-up the dicing euqipments. Use of bar code as such media.
Inventors
- 👤 Toshiyuki Tanaka
- 👤 Masaharu Nakamura
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 06:37
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/70; H10P72/74; H10P72/7402; H10W; H10W46/00; H10P72/7416; H10W46/101; H10W46/103; H10W46/106; H10W46/401; H10W46/601
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
162 words
In a semiconductor chip manufacturing method comprising the steps of storing dicing data corresponding to the kinds of wafers (24A), when data indicating the kind of the wafer (24A) is input, reading out the dicing data corresponding to the data input, and cutting the wafer (24A) set at a given position to a desired shape in accordance with the dicing data to thereby manufacture a semiconductor chip, the improvement comprising the steps of: providing read means (26) for inputting said data indicating said kind of said wafer (24A); recording a symbol (18, 24A, 28A) indicating said kind of said wafer in a member (14, 16, 24, 28) moving together with said wafer (24A) in a chip manufacturing process as an identification symbol readable by said read means (26); and, prior to input of said data indicating said kind of said wafer, allowing said read means (26) to read said identification symbol (18, 24B, 28A) recorded in said member (14, 16, 24, 28).
Claim 2
Dependent Claim
36 words
A semiconductor chip manufacturing method as set forth in Claim 1, wherein said identification symbol (18, 24B, 28A) is a bar code (18, 24B, 28A) and said read means (26) is a bar code reader (26).
Claim 3
Dependent Claim
194 words
In a semiconductor chip manufacturing method comprising the steps of storing dicing data corresponding to the kinds of wafers (24A), when data indicating the kinds of the wafer (24A) is input, reading out the dicing data corresponding to the data input, and cutting the wafer (24A) set at a given position to a desired shape in accordance with the dicing data to thereby manufacture a semiconductor chip, the improvement comprising the steps of: providing read means (26) for inputting said data indicating said kind of said wafer (24A); previously registering the names (44) of wafers (24A) respectively to be marked on members (14, 16, 24, 28) moving together with said wafers (24A) and identification symbols (42) respectively corresponding to said names (44) and readable by said read means (26) in a table (40); when each of said data indicating said kinds of said wafer is input, searching out one of said identification symbols (42) corresponding one of said names from said table (40) in accordance with the wafer name marked in one of said members (14, 16, 24, 28); and, allowing said read means (26) to read out the identification symbol (42) searched out.
Claim 4
Dependent Claim
32 words
A semiconductor chip manufacturing method as set forth in Claim 3, wherein said identification symbol (44) is a bar cord (44) and said read means (26) is a bar code reader (26).
Claim 5
Dependent Claim
128 words
In a semiconductor chip manufacturing device which stores dicing data corresponding to the kinds of wafers (24A), when data indicating the kind of the wafer (24A) is input, reading out the dicing data corresponding to the data input, and cutting the wafer (24A) set at a given position to a desired shape in accordance with the dicing data to thereby manufacture a semiconductor chip, the improvement comprising: read means (26) for inputting said data indicating said kind of said wafer (24A); and, a member (14, 16, 24, 28) moving together with said wafer (24A) in a chip manufacturing process and having a symbol (18, 24B, 28A) indicating said kind of said wafer (24A) recorded thereon, said symbol serving as an identification symbol readable by said read means (26).
Claim 6
Dependent Claim
78 words
A semiconductor chip manufacturing device as set forth in Claim in 5, wherein said member (14, 16, 24, 28) on which said identification symbol (18, 24B, 28A) is recorded is one of a storage case (24) for storing a wafer (24A) therein, a card (28) for identifying a wafer to be attached to said storage case (24), a frame (14) for holding said wafer (10), and a tape (16) for attaching said wafer (10) to said frame (14).
Claim 7
Dependent Claim
36 words
A semiconductor chip manufacturing device as set forth in Claim 6, wherein said read means (26) is a bar code reader (26) and said identification symbol (18, 24B, 28A) is a bar code (18, 24B, 28A).
References Cited (Backward Citations)
EP0132520B1
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EP0249762A1
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