Patent EP0484906A2 successfully refreshed from Google Patents.
EP0484906A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Head mounting device
Assignee: BRIER TECHNOLOGY
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Filing: 1991-11-06
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Granted: —
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Expires: 2011-11-06
Abstract
Abstract A head mounting assembly utilizing a specially designed printed circuit board ("PCB") for supporting a read/write head (235) for a floppy disk drive computer memory unit is presented. The PCB flexure replaces the metal flexure of the prior art. The PCB flexure is configured so as to provide a similar degree of flexibility as the metal flexure of the prior art. The electrical leads of the read/write head (235) are connected to first ends (295) of conductive strips (280) formed on the surface of the PCB flexure. The other ends (280) of the conductive strips are connected to the disk drive's electronics package by means of a single flexible circuit. Additional electronic components such as preamplifier may be mounted on the PCT flexure itself or on the flexible circuit limiting the amount of noise and other interference that may degenerate the signals passing from the read/write head to the disk drive's electronics.
Inventors
- 👤 John F. Bizjak
- 👤 Joseph Cardona
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-08 16:30
CPC Classifications
G; G11; G11B; G11B33/00; G11B33/12; G11B33/121; G11B33/122; G11B5/00; G11B5/48; G11B5/4806; G11B5/486; G11B7/00; G11B7/08; H; H01; H01R; H01R12/00; H01R12/50; H01R12/59; H05; H05K; H05K3/00; H05K3/36; H05K3/361; H05K3/363
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
33 words
A flexure (275) for supporting a transducer (235) adjacent to a memory medium (220) characterized by a low conductivity resilient substrate; and a high conductivity region (280, 290, 295) formed on said subtrate.
Claim 2
Dependent Claim
15 words
The flexure of claim 1 characterized in that the transducer comprises a read/write head (235).
Claim 3
Dependent Claim
63 words
The flexure of claim 2 characterized by a transducer mounting region to which the read/write head (235) is mounted and an external support mounting region by which the flexure (275) is mounted to an external support (225, 230) and wherein said high conductivity region forms an electrical connection (280) between said read/write head mounting region (295) and an external electrical contact region (290).
Claim 4
Dependent Claim
70 words
An assembly for supporting a read/write head (235) adjacent to a memory medium (220) characterized by: a support arm (225, 230) movable adjacent to said memory medium (220); a flexure (275) affixed to said support arm (225, 230) for supporting said read/write head (235) adjacent to said memory medium (220), said flexure comprising: a low conductivity resilient substrate; and a high conductivity region (280, 290, 295) formed on said substrate.
Claim 5
Dependent Claim
68 words
The read/write head supporting assembly of claim 4 characterized in that the flexure (275) comprises a read/write head mounting region to which the read/write head is mounted and an external support mounting region by which the flexure is mounted to the support arm, and wherein said high conductivity region forms an electrical connection between said read/write head mounting region and an external electrical contact region of said flexure.
Claim 6
Dependent Claim
40 words
The device of claim 3 or 5 characterized by a flexible circuit means comprising conductive element means, said conductive element means being electrically connected to said external electrical contact region (290) of said high conductivity region formed on said substrate.
Claim 7
Independent Claim
22 words
The device according to any of claims 1 to 6 characterized in that said substrate comprises a wafer of resin impregnated fiberglass.
Claim 8
Independent Claim
19 words
The device according to any of claims 1 to 6 characterized in that said substrate comprises a ceramic wafer.
Claim 9
Independent Claim
21 words
The device according to any of claims 1 to 6 characterized in that said substrate comprises a wafer of PCB material.
Claim 10
Independent Claim
20 words
The device according to claims 1 to 9 characterized by electrical component means (260) connected to said high conductivity region.
Claim 11
Dependent Claim
20 words
The device of claim 10 characterized in that said electrical component means (260) comprises preamplifier (300) or signal conditioning means.
Claim 12
Independent Claim
22 words
The device according to any of claims 2 to 11 characterized in that said read/write head (235) comprises electromagnetic read/write head means.
Claim 13
Independent Claim
21 words
The device according to any of claims 2 to 11 characterized in that said read/write head comprises optical read/write head means.
Claim 14
Independent Claim
19 words
The device according to any of claims 4 to 13 characterized by carriage means for supporting said support arm.
Claim 15
Dependent Claim
18 words
The device of claim 14 characterized in that said support arm is movably attached to said carriage means.
Claim 16
Dependent Claim
34 words
A flexure (275) for resiliently supporting a component (235) requiring external electrical connections (280) characterized by a low conductivity resilient substrate; and a high conductivity region formed on said substrate for providing electrical connections.
References Cited (Backward Citations)
No citation records indexed.
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