Patent US4748847A successfully refreshed from Google Patents.
Patent EP0480754A2 successfully refreshed from Google Patents.
EP0480754A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Mounting device for mounting an electronic device on a substrate by the surface mounting technology
Assignee: Fujitsu Ltd
•
Filing: 1991-10-11
•
Granted: —
•
Expires: 2011-10-11
Abstract
Abstract A mounting device for mounting an electronic device on a substrate is described. The electronic device (3) has a plurality of interconnection pins (3a) for engagement with corresponding through-holes on an interconnection circuit board (1) for electric interconnection. The mounting device comprises a plate member (6) of an insulating material provided with a plurality of conter-bores (6b) on an upper major surface of the plate member in correspondence to the interconnection pins of the electronic device, a plurality of through-holes (6a) provided on the plate member in correspondence to each of the counter-bores in a concentric relationship to the counter-bore, and a plurality of solder rings (7) provided on the plurality of counter-bores.
Inventors
- 👤 Kenjiro c/o Fujitsu Limited Taniuchi
- 👤 Hideo c/o Fujitsu Limited Miyazawa
- 👤 Kouji c/o Fujitsu Limited Ishikawa
- 👤 Kouji c/o Fujitsu Limited Watanabe
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 13:34
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/301; H01; H01R; H01R43/00; H01R43/02; H01R43/0256; H05K3/32; H05K3/34; H05K3/3447; H01R12/00; H01R12/70; H01R12/71; H01R12/72; H01R12/722; H01R12/724; H05K2201/00; H05K2201/10; H05K2201/10007; H05K2201/10189; H05K2201/10227; H05K2201/10424; H05K2203/00; H05K2203/04; H05K2203/0415; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
173 words
A mounting device for mounting an electronic device (3, 4) on a substrate (1), said electronic device having a plurality of interconnection pins (3a) for electric interconnection; characterized in that said mounting device comprises: a plate member (6) of an insulating material having upper and lower major surfaces; a plurality of counter-bores (6b) provided on the upper major surface of said plate member in correspondence to said plurality of interconnection pins of the electronic device, each of said counter-bore having a first diameter and a bottom surface at a level below said top surface of said plate member; a plurality of through-holes (6a) provided on said plate member in correspondence to each of the counter-bores, each of said through-holes being provided concentric to the counter-bore corresponding thereto and having a second diameter that is smaller than said first diameter, each of said through-holes extending from said bottom surface of the corresponding counter-bore to the bottom surface of said plate member; and a plurality of solder rings (7) provided on said plurality of counter-bores.
Claim 2
Dependent Claim
54 words
A mounting device as claimed in claim 1 characterized in that each of said solder rings (7) has an outer diameter set to be accepted into said counter-bore on the plate member, each of said solder rings further having an inner diameter for allowing a passage of the interconnection pin of the electronic device.
Claim 3
Dependent Claim
36 words
A mounting device as claimed in claim 2 characterized in that said inner diameter of the solder ring (7) is set to establish a frictional engagement with the pin (3a) of the electronic device (3, 4).
Claim 4
Dependent Claim
47 words
A mounting device as claimed in claim 1 characterized in that said counter-bore (6b) has a depth, measured from the top surface of the plate member (6) to the bottom surface of the counter-bore (6b), that is set smaller than the a height of the solder ring.
Claim 5
Dependent Claim
78 words
A mounting device as claimed in claim 1 characterized in that said mounting device further comprises a cover plate (6′) having upper and lower major surfaces and provided on the upper major surface of the plate member (6) for holding the solder rings (7) accommodated in said counter-bores (6b), said cover plate being provided with a plurality of through-holes (6a′) in correspondence to said pins (3a) of the electronic device for allowing a passage of said pins therethrough.
Claim 6
Dependent Claim
37 words
A mounting device as claimed in claim 1 characterized in that said plate member (6) has a fixture (6x) to catch the cover plate that is provided on the upper major surface of the plate member (1).
Claim 7
Dependent Claim
28 words
A mounting device as claimed in claim 6 characterized in that said fixture comprises a catch (6x) that is formed around a rim of the plate member (6).
Claim 8
Dependent Claim
29 words
A mounting device as claimed in claim 1 characterized in that said plate member (13) has a fixture (13c) to connect the plate member to the electronic device (4).
Claim 9
Dependent Claim
35 words
A mounting device as claimed in claim 8 characterized in that said fixture comprises a side wall (6c) extending in an upward direction and formed in conformity with a shape of the electronic device (4).
Claim 10
Dependent Claim
19 words
A mounting device as claimed in claim 1 characterized in that said electronic device comprises a connector (3, 11).
Claim 11
Dependent Claim
19 words
A mounting device as claimed in claim 1 characterized in that said electronic device comprises an integrated circuit (4).
Claim 12
Dependent Claim
290 words
An electronic apparatus comprising a substrate (1) having upper and lower major surfaces, said substrate having a plurality of through holes (1a) extending from the upper major surface to the lower major surface and an interconnection pattern connected to the through holes, and an electronic device (3, 4) having a plurality of interconnection pins (3a) for external connection, characterized in that said electronic apparatus further comprises: a bracket (5) comprising: a plate member (6) of an insulating material having upper and lower major surfaces; a plurality of counter-bores (6b) provided on the upper major surface of said plate member in correspondence to said plurality of interconnection pins of the electronic device, each of said counter-bore having a first diameter and a bottom surface at a level below said top surface of said plate member; a plurality of through-holes (6a) provided on said plate member in correspondence to each of the counter-bores, each of said through-holes being provided concentric to the counter-bore corresponding thereto and having a second diameter that is smaller than said first diameter, each of said through-holes extending from said bottom surface of the corresponding counter-bore to the bottom surface of said plate member; and a plurality of solder pieces (7) provided on said plurality of counter-bores; said electronic device being attached to said bracket by the interconnection pins that are inserted into the corresponding through-holes on said plate member; said bracket being attached to said substrate by the interconnection pins that are inserted into the corresponding through-holes on said substrate via said through-holes on said plate member; said electronic device and said bracket being connected to said substrate by said solder pieces that have caused a reflowing and is connecting the interconnection pins to said interconnection pattern.
Claim 13
Independent Claim
281 words
A method for mounting an electronic device (3, 4) having a plurality of interconnection pins on a substrate, characterized by the steps of: attaching the electronic device to a bracket (5), said bracket comprising: a plate member (6) of an insulating material having upper and lower major surfaces; a plurality of counter-bores (6b) provided on the upper major surface of said plate member in correspondence to said plurality of interconnection pins of the electronic device, each of said counter-bore having a first diameter and a bottom surface at a level below said top surface of said plate member; a plurality of through-holes (6a) provided on said plate member in correspondence to each of the counter-bores, each of said through-holes being provided concentric to the counter-bore corresponding thereto and having a second diameter that is smaller than said first diameter, each of said through-holes extending from said bottom surface of the corresponding counter-bore to the bottom surface of said plate member; and a plurality of solder pieces (7) provided on said plurality of counter-bores; said step of attaching the electronic device to said bracket including a step of inserting the interconnection pins of the electronic device into the corresponding through-holes on the plate member; attaching the electronic device and said bracket to which said electronic device is attached, to said substrate, said substrate having a plurality of through-holes (1a) and an interconnection pattern connected to said through-holes; said step of attaching the electronic device including a step of inserting the interconnection pins of the electronic device into the corresponding through-holes on the substrate via said through-holes on the plate member; and causing a reflowing of the solder ring by applying a heat.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.