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EP0480750A2
Expired / Lapsed
EP
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Liquid cooling system for LSI packages
Assignee: NEC Corp
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Filing: 1991-10-11
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Granted: —
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Expires: 2011-10-11
Abstract
Abstract In a liquid cooling system for a printed circuit board (1) on which integrated circuit packages (2) are mounted, heat sinks (3) are secured respectively to the packages in heat transfer contact therewith. Nozzles (8) are provided in positions corresponding to the heat sinks. A housing (5) is tightly sealed to the printed circuit board to enclose the packages, heat sinks and nozzles in a cooling chamber. A feed pump (12) pressurizes working liquid cooled by a heat exchanger (11) and supplies the pressurized liquid to the nozzles for ejecting liquid droplets to the heat sinks. A liquid suction pump (15) is connected to an outlet (9) of the housing for draining liquid coolant to the heat exchanger. A vapour suction pump (32) can be connected to a second outlet (30) of the housing for sucking vaporized coolant to the heat exchanger. The cooling chamber is maintained at a sub-atmospheric pressure to promote nucleate boiling of the working liquid by means of a pressure regulating system controlling the pumping and responsive to liquid flow. In an alternative embodiment (Figure 7) liquid is sucked in through nozzles adjacent the heat sinks.
Inventors
- 👤 Tsukasa C/O Nec Corporation Mizuno
- 👤 Hirokazo c/o NEC Corporation Miyazaki
- 👤 Kazuhiko C/O Nec Corporation Umezawa
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-01 23:12
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/40; H10W40/47; H10W40/475; H05; H05K; H05K7/00; H05K7/20; H05K7/2029; H05K7/20345; H10W40/70; H10W40/73; H10W40/77; H10W40/776; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; Y; Y10; Y10S; Y10S165/00; Y10S165/908
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
114 words
A liquid cooling system for a printed circuit board on which a plurality of integrated circuit packages are mounted and a plurality of heat sinks are secured respectively to said packages in heat transfer contact therewith, comprising: a plurality of nozzles located in positions corresponding to said heat sinks and coupled to a source of pressurized coolant for ejecting droplets of the coolant to the corresponding heat sinks; and a housing tightly sealed to said printed circuit board to define a cooling chamber therewith so that said packages, said heat sinks and said nozzles are contained in said chamber, said housing having an outlet for allowing heated coolant to be discharged to the outside.
Claim 2
Dependent Claim
35 words
A liquid cooling system as claimed in claim 1, further comprising a relief valve coupled to said outlet of said housing to control the inside of said cooling chamber substantially at a constant pressure level.
Claim 3
Dependent Claim
38 words
A liquid cooling system as claimed in claim 2, wherein said housing is provided with safety fuse means for opening the inside of said housing to the outside when said cooling chamber reaches a predetermined temperature or pressure.
Claim 4
Dependent Claim
21 words
A liquid cooling system as claimed in claim 1, wherein said heat sinks and said nozzles are submerged in coolant liquid.
Claim 5
Dependent Claim
21 words
A liquid cooling system as claimed in claim 2, wherein said heat sinks and said nozzles are submerged in coolant liquid.
Claim 6
Dependent Claim
166 words
A liquid cooling system for a printed circuit board on which a plurality of integrated circuit packages are mounted and a plurality of heat sinks are secured respectively to said packages in heat transfer contact therewith, comprising: heat exchange means for producing pressurized coolant; a plurality of nozzles located in positions corresponding to said heat sinks and coupled to said heat exchange means for ejecting droplets of coolant to the corresponding heat sinks; a housing tightly sealed to said printed circuit board to define a cooling chamber therewith so that said packages, said heat sinks and said nozzles are contained in said chamber, said housing having a liquid outlet opening and a vapor outlet opening; liquid discharge means communicated to said cooling chamber through said liquid outlet opening for draining liquid coolant from said housing to said heat exchange means; and vapor discharge means communicated to said cooling chamber through said vapor outlet opening for sucking vaporized coolant from said housing to said heat exchange means.
Claim 7
Dependent Claim
21 words
A liquid cooling system as claimed in claim 6, wherein said heat sinks and said nozzles are submerged in coolant liquid.
Claim 8
Dependent Claim
163 words
A liquid cooling system for a printed circuit board on which a plurality of integrated circuit packages are mounted and a plurality of heat sinks are secured respectively to said packages in heat transfer contact therewith, comprising: a plurality of suction pipes located in positions corresponding to said heat sinks and communicated to a common suction point; heat exchange means for producing pressurized coolant; a housing tightly sealed to said printed circuit board to define a cooling chamber therewith so that said packages, said heat sinks and said suction pipes are submerged in liquid coolant in said chamber, said housing having an inlet opening connected to an outlet of said heat exchange means and an outlet opening connected to said common suction point of said suction pipes; and liquid discharge means connected to said outlet opening of the housing for sucking coolant in a liquid state as well as a vaporized state from said housing to an inlet of said heat exchange means.
Claim 9
Dependent Claim
180 words
A liquid cooling system for a printed circuit board on which a plurality of integrated circuit packages are mounted and a plurality of heat sinks are secured respectively to said packages in heat transfer contact therewith, comprising: a heat exchanger for supplying coolant; a housing tightly sealed to said printed circuit board to define a cooling chamber therewith so that said packages and said heat sinks are contained in said chamber; a feed pump connected to said heat exchanger for supplying a flow of pressurized coolant to an inlet of said housing; a suction pump connected to an outlet of the housing for discharging coolant from said housing to said heat exchanger; first detector means for sensing a coolant flow supplied from said feed pump to said housing; second detector means for sensing a coolant flow discharged from said housing by said suction pump; and control means responsive to the coolant flows detected by said first and second detector means for controlling said suction pump so that a difference which exists between said coolant flows is reduced to a minimum.
Claim 10
Dependent Claim
39 words
A liquid cooling system as claimed in claim 9, further comprising a plurality of nozzles located in positions corresponding to said heat sinks and coupled to said feed pump for ejecting droplets of coolant to the corresponding heat sinks.
Claim 11
Dependent Claim
46 words
A liquid cooling system as claimed in claim 9, further comprising a plurality of suction pipes located in positions corresponding to said heat sinks and communicated to said suction pump, and wherein said packages, said heat sinks and said suction pipes are submerged in liquid coolant.
Claim 12
Dependent Claim
23 words
A liquid cooling system as claimed in claim 9, wherein each of said first and second detector means is a flow volume detector.
Claim 13
Dependent Claim
22 words
A liquid cooling system as claimed in claim 9, wherein each of said first and second detector means is a pressure detector.
Claim 14
Dependent Claim
134 words
A liquid cooling system as claimed in claim 9, wherein said first detector means comprises a first flow volume detector and a first flow pressure detector connected in series with each other between said feed pump and the inlet of said housing and said first detector means comprises a second flow volume detector and a second flow pressure detector connected in series with each other between the outlet of said housing and said suction pump, and wherein said control means is responsive to a first difference between flow volumes detected respectively by said first and second flow volume detectors and responsive to a second difference between flow pressures detected respectively by said first and second flow pressure detectors for controlling said suction pump so that said first and second differences reduce to a minimum.
Claim 15
Dependent Claim
169 words
A liquid cooling system for a printed circuit board on which a plurality of integrated circuit packages are mounted and a plurality of heat sinks are secured respectively to said packages in heat transfer contact therewith, comprising: a heat exchanger for supplying coolant; a housing tightly sealed to said printed circuit board to define a cooling chamber therewith so that said packages and said heat sinks are contained in said chamber; a feed pump connected to said heat exchanger for supplying a flow of pressurized coolant to an inlet of said housing; a suction pump connected to an outlet of the housing for discharging coolant from said housing to said heat exchanger; detector means connected to the inlet or outlet of said housing for detecting a coolant flow; setting means for setting a reference flow; and control means responsive to a difference between the coolant flow detected by said detector means and said reference flow for controlling said suction pump so that said difference is reduced to a minimum.
Claim 16
Dependent Claim
39 words
A liquid cooling system as claimed in claim 15, further comprising a plurality of nozzles located in positions corresponding to said heat sinks and coupled to said feed pump for ejecting droplets of coolant to the corresponding heat sinks.
Claim 17
Dependent Claim
46 words
A liquid cooling system as claimed in claim 15, further comprising a plurality of suction pipes located in positions corresponding to said heat sinks and communicated to said suction pump, and wherein said packages, said heat sinks and said suction pipes are submerged in liquid coolant.
Claim 18
Dependent Claim
147 words
A liquid cooling system for a printed circuit board on which a plurality of integrated circuit packages are mounted and a plurality of heat sinks are secured respectively to said packages in heat transfer contact therewith, comprising: a housing tightly sealed to said printed circuit board to define a cooling chamber therewith so that said packages and said heat sinks are contained in said chamber; a heat exchanger for supplying coolant; a reservoir for receiving the coolant from said heat exchanger; means for measuring a volume of coolant in said reservoir; a feed pump connected to said reservoir for supplying a flow of pressurized coolant therefrom to said housing; a suction pump for discharging coolant from said housing to said heat exchanger; and control means responsive to the measured volume for controlling said suction pump so that the volume of coolant in said reservoir is maintained constant.
Claim 19
Dependent Claim
39 words
A liquid cooling system as claimed in claim 18, further comprising a plurality of nozzles located in positions corresponding to said heat sinks and coupled to said feed pump for ejecting droplet of coolant to the corresponding heat sinks.
Claim 20
Dependent Claim
46 words
A liquid cooling system as claimed in claim 18, further comprising a plurality of suction pipes located in positions corresponding to said heat sinks and communicated to said suction pump, and wherein said packages, said heat sinks and said suction pipes are submerged in liquid coolant.
Claim 21
Dependent Claim
165 words
A liquid cooling system for a printed circuit board on which a plurality of integrated circuit packages are mounted and a plurality of heat sinks are secured respectively to said packages in heat transfer contact therewith, comprising: a housing tightly sealed to said printed circuit board to define a cooling chamber therewith so that said packages and said heat sinks are contained in said chamber; a heat exchanger for supplying coolant; a feed pump for supplying pressurized coolant from the heat exchanger to said housing; a suction pump for discharging coolant from said housing to said heat exchanger; detector means for detecting a coolant flow into said housing; a conversion table storing set of first values representative of possible coolant flows into said housing and second values optimum coolant flows out of said housing; and control means responsive to the detected coolant flow for recalling one of said second values from the conversion table and controlling said suction pump according to the recalled second value.
Claim 22
Dependent Claim
93 words
A liquid cooling system for a printed circuit board on which a plurality of integrated circuit packages are mounted and a plurality of heat sinks are secured respectively to said packages in heat transfert contact therewith, comprising: a plurality of orifices locates in positions corresponding to said heat sinks and through which can flow coolant which passes adjacent the corresponding heat sinks; and a housing tightly sealed to said printed circuit board to define a cooling chamber therewith so that said packages, said heat sinks and said orifices are contained in said chamber.
References Cited (Backward Citations)
No citation records indexed.
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