EP0476589A2 — Multi-layer wiring substrate and production there…

Claim 1

Independent Claim 132 words

A multi-layer wiring substrate for directly mounting chips or chip carriers obtained by laminating a plurality of circuit substrates via adhesive layers, each circuit substrate comprising an insulating layer at least one surface of which has a conductor circuit thereon, and at least one of said insulating layer and said adhesive layer being a cured product of an ether imide compound of the formula: wherein R i , R 2 , R 3 and R 4 are independently a hydrogen atom, a lower alkyl group, a lower alkoxy group, or a halogen atom; R 5 and R 6 are independently a hydrogen atom, a methyl group, an ethyl group, a trifluoromethyl group or a trichloromethyl group; and D is a residue of dicarboxylic acid having one or more ethylenically unsaturated double bonds.

Claim 2

Dependent Claim 132 words

A multi-layer wiring substrate for directly mounting chips or chip carriers obtained by laminating a plurality of circuit substrates via adhesive layers, each circuit substrate comprising an insulating layer at least one surface of which has a conductor circuit thereon, and at least one of said insulating layer and said adhesive layer being a cured product of an ether imide compound of the formula: wherein R i , R 2 , R 3 and R 4 are independently a hydrogen atom, a lower alkyl group, a lower alkoxy group, or a halogen atom; R 5 and R 6 are independently a hydrogen atom, a methyl group, an ethyl group, a trifluoromethyl group or a trichloromethyl group; and D is a residue of dicarboxylic acid having one or more ethylenically unsaturated double bonds.

Claim 3

Dependent Claim 32 words

A multi-layer wiring substrate according to Claim 1, wherein the cured product further comprises one or more member selected from the group consisting of aromatic cyanamide compounds, cyanurate compounds and cyanate compounds.

Claim 4

Dependent Claim 147 words

A multi-layer wiring substrate for directly mounting chips or chip carriers, which comprises a ceramic wiring substrate, an adhesive layer formed thereon, and a multi-layer substrate obtained by laminating a plurality of circuit substrates via adhesive layers, each circuit substrate comprising an insulating layer at least one surface of which has a conductor circuit thereon, and at least one of said insulating layer and said adhesive layer being a cured product of an ether imide compound of the formula: wherein R i , R 2 , R 3 and R 4 are independently a hydrogen atom, a lower alkyl group, a lower alkoxy group, or a halogen atom; R 5 and R 6 are independently a hydrogen atom, a methyl group, an ethyl group, a trifluoromethyl group or a trichloromethyl group; and D is a residue of dicarboxylic acid having one or more ethylenically unsaturated double bonds.

Claim 5

Dependent Claim 147 words

A multi-layer wiring substrate for directly mounting chips or chip carriers, which comprises a ceramic wiring substrate, an adhesive layer formed thereon, and a multi-layer substrate obtained by laminating a plurality of circuit substrates via adhesive layers, each circuit substrate comprising an insulating layer at least one surface of which has a conductor circuit thereon, and at least one of said insulating layer and said adhesive layer being a cured product of an ether imide compound of the formula: wherein R i , R 2 , R 3 and R 4 are independently a hydrogen atom, a lower alkyl group, a lower alkoxy group, or a halogen atom; R 5 and R 6 are independently a hydrogen atom, a methyl group, an ethyl group, a trifluoromethyl group or a trichloromethyl group; and D is a residue of dicarboxylic acid having one or more ethylenically unsaturated double bonds.

Claim 6

Dependent Claim 32 words

A multi-layer wiring substrate according to Claim 3, wherein the cured product further comprises one or more members selected from the group consisting of aromatic cyanamide compounds, cyanurate compounds and cyanate compounds.

Claim 7

Dependent Claim 114 words

A process for producing a multi-layer wiring substrate for directly mounting chips or chip carriers which comprises (a) placing an ether imide compound of the formula (I) described in Claim 1 or a composition containing the ether imide compound of the formula (I) on at least one roughened surface of an electrolytic copper foil, followed by heating at 250 ° C or lower under pressure to form a copper-clad laminate, (b) forming a circuit pattern on the copper-clad laminate by etching, (c) piling a plurality of circuit pattern formed copper-clad laminates via adhesive layers containing the ether imide compound of the formula (I) alternately, and (d) molding at 250 °C or lower under pressure.

Claim 8

Dependent Claim 52 words

A process according to Claim 5, wherein further comprises piling the multi-layer substrate obtained in the step (c) on a ceramic wiring substrate via an adhesive layer obtained from the ether imide compound of the formula (I) described in Claim 5, followed by molding at 250 ° C or lower under pressure.

Claim 9

Dependent Claim 43 words

A process according to Claim 5, wherein the ether imide compound of the formula (I) or the composition containing the ether imide compound of the formula (I) is used in the form of a varnish dissolved in an organic solvent, followed by drying.

Claim 10

Dependent Claim 46 words

A process according to Claim 6, wherein the ether imide compound of the compound of the formula (I) or the composition containing the ether imide compound of the formula (I) is used in the form of a varnish dissolved in an organic solvent, followed by drying.

Multi-layer wiring substrate and production thereof

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