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EP0476150A1 Expired / Lapsed EP ⏱️ 0.0 years remaining

Curable resin composition

Assignee: Kanegafuchi Chemical Industry Co Ltd
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Filing: 1991-04-03
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Granted: —
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Expires: 2011-04-03
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Abstract

Abstract A curable resin composition which is lowly viscous and easy to handle before curing and is excellent in tensile characteristics and also resistant to chemicals and water after curing. The composition comprises an oxypropylene polymer which has at least one group containing a silicon atom having a hydroxyl or hydrolyzable group bonded thereto, a Mw/Mn of 1.6 or less, and a number-average molecular weight of 6,000 or above, and an epoxy resin.

Inventors

  • 👤 Masayuki Fujita
  • 👤 Michihide Homma
  • 👤 Hiroshi Wakabayashi

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-08 13:06
CPC Classifications
C; C08; C08L; C08L63/00; C08G; C08G65/00; C08G65/02; C08G65/32; C08G65/329; C08G65/336; C08L71/00; C08L71/02

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 72 words
A curable resin composition which comprises: (A) an oxypropylene polymer which contains, in its main polymer chain, a repeating unit of the formula and which has at least one silicon atom-containing group with a hydroxyl group or a hydrolyzable group being bound to the silicon atom and has an Mw/Mn ratio of not more than 1.6 and a number average molecular weight of not less than 6,000, and (B) an epoxy resin.
Claim 2
Dependent Claim 23 words
A curable resin composition as claimed in Claim 1, wherein the component (A) polymer has an Mw/Mn ratio of not more than 1.5.
Claim 3
Dependent Claim 26 words
A curable resin composition as claimed in Claim 1 or 2, wherein the component (A) polymer has a number average molecular weight of 6,000 to 30,000.
Claim 4
Dependent Claim 26 words
A curable resin composition as claimed in any of Claims 1 to 3, wherein the silicon atom-containing group occurs at the terminal of the molecular chain.

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