EP0472199A1
Expired / Lapsed
EP
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Method of manufacturing plastic molded semiconductor device and apparatus for manufacturing the same
Assignee: Toshiba Corp
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Filing: 1991-08-22
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Granted: —
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Expires: 2011-08-22
Abstract
Abstract A manufacturing apparatus and a method of manufacturing a plastic molded semiconductor device comprising the steps of mounting semiconductor elements (2) on element mount portions (1b) of a lead frame (1), connecting the elements (2) and the lead frame (1) by means of metal lead wires (3), holding lead portions (1 a) of the lead frame (1) by a pair of metal molds (5a, 5b) and positioning the element mount portions (1 b) within a molding space of the metal molds, holding the opposite end portion of the lead frame by spring-biased hold pins (7a, 7b, 70a, 70b) provided at the metal molds from the both surfaces thereof, and releasing by the molding pressure of a plastic material injected into the molding space of the metal molds that the hold pins hold the opposite end portion (1 d) of the frame (1) and completely molding the lead frame except for the lead portions (1a) and the semiconductor elements (2) as the result of the fact that the plastic material flows into the molding space during the above releasing.
Inventors
- 👤 Shinjiro Kojima
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 09:10
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; B; B29; B29C; B29C45/00; B29C45/14; B29C45/14065; B29C45/14073; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W70/00; H10W70/40; H10W70/481; H10W72/00; H10W72/01; H10W72/0198; H10W74/016; H10W90/00; H10W90/811; B29C2045/14081; H10W72/50; H10W72/551; H10W72/552; H10W74/10; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
236 words
A method of manufacturing a plastic molded semiconductor device, comprising the steps of mounting semiconductor elements (2) on element mount portions (1 b) of a lead frame (1), connecting said elements and lead portions (1 a) of said lead frame by means of metal lead wires (3), and plastic-molding the entirety of said lead frame and said elements connected except for said front end portion of said lead portion (1 a), said method comprising the steps of: holding said lead portions (1 a) of said lead frame (1) by means of a pair of metal molds prior to plastic molding, holding the opposite end portions (1 d) of said lead portions (1 a) of said lead frame (7) by means of a pair of hold pins (7a, 7b, 70a, 70b) having a predetermined working force in a direction to hold said opposite end portion (1 d) thereof and each including a pressure receiving portion formed thereat for releasing the holding by a reaction force in an opposite direction to the above-mentioned direction, and molding plastic material into portions (C) between said front end portions and said lead frame when said hold pins release holding of said opposite end portions of said lead frame (1) as the result of the fact that said pressure receiving portions receive a molding pressure produced by injection of said plastic material into a cavity defined or formed within said metal molds.
Claim 2
Independent Claim
236 words
A method of manufacturing a plastic molded semiconductor device, comprising the steps of mounting semiconductor elements (2) on element mount portions (1 b) of a lead frame (1), connecting said elements and lead portions (1 a) of said lead frame by means of metal lead wires (3), and plastic-molding the entirety of said lead frame and said elements connected except for said front end portion of said lead portion (1 a), said method comprising the steps of: holding said lead portions (1 a) of said lead frame (1) by means of a pair of metal molds prior to plastic molding, holding the opposite end portions (1 d) of said lead portions (1 a) of said lead frame (7) by means of a pair of hold pins (7a, 7b, 70a, 70b) having a predetermined working force in a direction to hold said opposite end portion (1 d) thereof and each including a pressure receiving portion formed thereat for releasing the holding by a reaction force in an opposite direction to the above-mentioned direction, and molding plastic material into portions (C) between said front end portions and said lead frame when said hold pins release holding of said opposite end portions of said lead frame (1) as the result of the fact that said pressure receiving portions receive a molding pressure produced by injection of said plastic material into a cavity defined or formed within said metal molds.
Claim 3
Dependent Claim
77 words
A method of manufacturing a semiconductor device as set forth in claim 1, wherein said holding step is comprised of a step of carrying out holding by said hold pins each comprised of a stepped pin (7a, 7b) including a stepped portion comprised of a pressure receiving surface substantially in parallel to the both surfaces of said opposite end portion of said lead frame (1) and a projection projected from the center of said pressure receiving surface.
Claim 4
Dependent Claim
60 words
A method of manufacturing a semiconductor device as set forth in claim 2, wherein said holding step is comprised of a step of holding said opposite end portion (1d) of said lead frame (1) from the both surfaces thereof by a spring resilient force of said hold pins (7a, 7b) movably attached through springs (8a, 8b) to said metal molds.
Claim 5
Dependent Claim
80 words
A method of manufacturing a semiconductor device as set forth in claim 3, wherein said plastic material molding step is comprised of a step such that said pressure receiving surface receives molding pressure by molding of the plastic material (4), so said pressure receiving surface is away from said opposite end portion (1d) by the molding pressure against said spring resilient force, whereby said plastic material flows into a gap thus formed to mold said opposite end portion (1 d).
Claim 6
Dependent Claim
132 words
A method of manufacturing a semiconductor device as set forth in claim 1, wherein said hold pins are each comprised of a tapered pin (70a, 70b) such that the bottom end side thereof is provided at said metal molds through a spring (8a, 8b), and the front end side thereof serves as a flat surface substantially in parallel to the both surfaces of said opposite end portion through a conic surface (71 a, 71 b) serving as a pressure receiving tapered surface, said holding step being comprised of a step of holding said both surfaces of said opposite end portion (1d) by said flat surfaces of said hold pins (70a, 70b) as the result of the fact that each hold pin is biased by a resilient force of said spring (8a, 8b).
Claim 7
Dependent Claim
90 words
A method of manufacturing a semiconductor device as set forth in claim 5, wherein said plastic material molding step is comprised of a step such that each of said pressure tapered surfaces receives a molding pressure by injection of plastic material, so said pressure tapered surface (71a, 71 b) is away from said each opposite end portion by said molding pressure against a resilient force of said each spring (8a, 8b), whereby said plastic material (4) flows into a gap thus formed to mold said opposite end portion (1 d).
Claim 8
Independent Claim
151 words
An apparatus for manufacturing a plastic molded semiconductor device comprising a pair of metal molds (5a, 5b) for holding lead portions (1 a) of a lead frame (1) on which semiconductor elements (2) are mounted, and a plastic material injection mechanism for injecting plastic material (4) into the surrounding portion of said lead frame (1) held by said metal molds (5a, 5b), wherein there are provided a pair of hold pins (7a, 7b, 70a, 70b) respectively attached to said metal molds (5a, 5b) through springs (8a, 8b), said hold pins (7a, 7b, 70a, 70b) being adapted to hold the opposite end portions (1 d) of said lead portions (1 a) of said lead frame (1) by a predetermined working force of said springs (8a, 8b) prior to plastic molding, and each including a pressure receiving surface formed thereat to receive a working force in an opposite direction to said holding direction.
Claim 9
Independent Claim
151 words
An apparatus for manufacturing a plastic molded semiconductor device comprising a pair of metal molds (5a, 5b) for holding lead portions (1 a) of a lead frame (1) on which semiconductor elements (2) are mounted, and a plastic material injection mechanism for injecting plastic material (4) into the surrounding portion of said lead frame (1) held by said metal molds (5a, 5b), wherein there are provided a pair of hold pins (7a, 7b, 70a, 70b) respectively attached to said metal molds (5a, 5b) through springs (8a, 8b), said hold pins (7a, 7b, 70a, 70b) being adapted to hold the opposite end portions (1 d) of said lead portions (1 a) of said lead frame (1) by a predetermined working force of said springs (8a, 8b) prior to plastic molding, and each including a pressure receiving surface formed thereat to receive a working force in an opposite direction to said holding direction.
Claim 10
Dependent Claim
145 words
An apparatus for manufacturing a semiconductor device as set forth in claim 7, wherein said hold pin (7a, 7b, 70a, 70b) is comprised of a cylindrical shaft portion slidably accommodated in a hole bored at a position corresponding to said opposite end portion (1 d) of said lead frame (1) in said metal molds; a bottom end portion adapted so that the other end side of said spring (8a, 8b) held on one end side thereof by a stopper (9a, 9b) attached at a hole opening portion so as to cover said hole is in contact with said bottom end portion, and a front end portion projected into a plastic material molding space defined or formed within said metal molds (5a, 5b) by a resilient spring force to hold said opposite end portion (1 d) of said lead frame (1) from the both surfaces thereof.
Claim 11
Dependent Claim
82 words
An apparatus for manufacturing a semiconductor device as set forth in claim 8, wherein said hold pin is comprised of a stepped pin (7a, 7b) having a stepped portion including a pressure receiving surface serving as said pressure receiving portion comprised of an end surfaces of said shaft portion respectively in parallel to the both surfaces of said lead frame end portion, and a projection having a diameter smaller than that of said shaft portion and projected from the end surface thereof.
Claim 12
Dependent Claim
48 words
An apparatus for manufacturing a semiconductor device as set forth in claim 8, wherein said hold pin is comprised of a tapered pin (70a, 70b) such that the extreme end of said front end portion (71a, 71 b) is formed tapered to serve as a pressure receiving surface.
Claim 13
Dependent Claim
97 words
An apparatus for manufacturing a semiconductor device as set forth in claim 9 or 10, wherein said hold pins (7a, 7b, 70a, 70b) are such that a molding pressure of plastic material injected onto said pressure receiving surfaces or said pressure tapered surfaces (71 a, 71 b) formed at said front end portions is applied, whereby said hold pins are moved by a predetermined distance (C) from the both surfaces of said opposite end portion (1 d) of said lead frame (1) against a resilient force of said spring (8a, 8b), thus to release said holding state.
References Cited (Backward Citations)
GB2103534A
Cited
EP0257681A2
Cited
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