EP0257681A2
Expired / Lapsed
EP
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Method for manufacturing plastic encapsulated semiconductor devices and devices obtained thereby
Assignee: STMicroelectronics SRL
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Filing: 1987-07-30
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Granted: —
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Expires: 2007-07-30
Abstract
Abstract The correct position of the metallic plate supporting the semiconductor chips in the mold used for encapsulation, is performed by at least a pair of locating pins and by locators present in the mold referred to the lead 5 connected to the plate. The ends of the locating pins are spaced, in the final phase of encapsulation, with respect to the surfaces of the plate, whereas in the initial phase they result directly connected to the said metallic surfaces or indirectly connected through the 10 interposition of insulating thicknessings.
Inventors
- 👤 Antonio Perniciaro Spatrisano
- 👤 Marino Cellai
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-06 15:02
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; B; B29; B29C; B29C33/00; B29C33/12; B29C33/123; B29C45/00; B29C45/14; B29C45/14065; B29C45/14073; B29C70/00; B29C70/68; B29C70/72; H10W72/00; H10W72/01; H10W72/0198; H10W74/01; H10W74/016; B29C2045/14122; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49158; Y10T29/49169; Y10T29/49171; Y10T29/49172
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
153 words
Method for manufacturing a plastic encapsulated semiconductor device, comprising: - a semiconductor chip, - a metallic plate (31) serving both as an electrode and as a heat sink, having a first surface soldered to the said semiconductor chip, - a plastic encapsulating housing which causes a thin and uniform plastic layer on the second surface of the plate (31), - a lead (38) connected to plate (31) and where, during the encapsulation, the correct position of plate (31) in the encapsulating mold is performed by at least a pair of locating pins and locators present in the mold referred to the said lead (38), characterized by the fact that the ends of the locating pins are spaced, in the final phase of encapsulation, with respect to the metallic surfaces of plate (31), whereas in the initial phase are directly connected to the said metallic surfaces or indirectly connected through interposition of insulating thicknessings.
Claim 2
Dependent Claim
153 words
Method for manufacturing a plastic encapsulated semiconductor device, comprising: - a semiconductor chip, - a metallic plate (31) serving both as an electrode and as a heat sink, having a first surface soldered to the said semiconductor chip, - a plastic encapsulating housing which causes a thin and uniform plastic layer on the second surface of the plate (31), - a lead (38) connected to plate (31) and where, during the encapsulation, the correct position of plate (31) in the encapsulating mold is performed by at least a pair of locating pins and locators present in the mold referred to the said lead (38), characterized by the fact that the ends of the locating pins are spaced, in the final phase of encapsulation, with respect to the metallic surfaces of plate (31), whereas in the initial phase are directly connected to the said metallic surfaces or indirectly connected through interposition of insulating thicknessings.
Claim 3
Dependent Claim
73 words
Method as claimed in claim 1, characterized by the fact that the locating pins may be withdrawn and their ends, during encapsulation, are kept in connection with said plate (31) as long as the plastic has filled the mold, whereas, before starting the thermosetting reaction, they are withdrawn and at the same time the injection of the encapsulating plastic continues as long as the room previously taken by the pins is not filled.
Claim 4
Dependent Claim
111 words
Method as claimed in claim 1, characterized by the fact that: - one or more thermoplastic nails (91) are inserted into one or more holes made in the plate (31) before the encapsulation begins; - the ends of said nails are successively so riveted as to fix the nails themselves to the plate (31) and as to give a shape and preferred sizes to said ends; - during the encapsulation, the correct position of plate (31) in the mold is assured by both locators of the mold referred to lead (38) and pairs of pins (110,111) fixed to the mold, which are referred to the ends of the said nails (91).
Claim 5
Dependent Claim
20 words
Electrically insulated and plastic encapsulated semiconductor devices manufactured according to a method as claimed in any of the preceding claims.
References Cited (Backward Citations)
No citation records indexed.
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