Patent EP0466937A1 successfully refreshed from Google Patents.
EP0466937A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Plastic carrier tape and cover tape for electronic component chip
Assignee: Sumitomo Bakelite Co Ltd
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Filing: 1991-02-05
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Granted: —
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Expires: 2011-02-05
Abstract
Abstract A covering tape used for the heat sealing of a plastic carrier tape provided with contiguous pockets for housing electronic component chips, wherein the outer layer comprises a biaxially oriented film made from any of polyester, polypropylene and nylon, while the adhesive layer comprises one or more thermoplastic resins selected from among polyurethane, acrylic, polyvinyl chloride, ethylene-vinyl acetate and polyester resins and, dispersed therein, one or more fine conductive powders selected from among tin oxide, zinc oxide, titanium oxide, carbon black and organosilicon compounds.
Inventors
- 👤 Shigeru Maeda
- 👤 Tomoharu Sumitomo Miyamoto
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 12:01
CPC Classifications
B; B65; B65D; B65D73/00; B65D73/02; H; H05; H05K; H05K13/00; H05K13/0084; Y; Y10; Y10T; Y10T428/00; Y10T428/25; Y10T428/256; Y10T428/28; Y10T428/2804; Y10T428/2813; Y10T428/2817; Y10T428/2826; Y10T428/2848; Y10T428/2852; Y10T428/2878; Y10T428/2891; Y10T428/2896
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
86 words
A cover tape used for packaging of chip type electronic parts, which is heat-sealable to a plastic carrier tape having at given intervals pockets for accomodation of chip type electronic parts, characterized in that the outer layer is a biaxially oriented film consisting of polyester, polypropylene or nylon and the adhesion layer consists of a dispersion of conductive fine powders in a thermoplastic resin, said conductive fine powders consisting of tin oxide, zinc oxide, titanium oxide, carbon black or a Si-based organic compound, or their combination.
Claim 2
Dependent Claim
86 words
A cover tape used for packaging of chip type electronic parts, which is heat-sealable to a plastic carrier tape having at given intervals pockets for accomodation of chip type electronic parts, characterized in that the outer layer is a biaxially oriented film consisting of polyester, polypropylene or nylon and the adhesion layer consists of a dispersion of conductive fine powders in a thermoplastic resin, said conductive fine powders consisting of tin oxide, zinc oxide, titanium oxide, carbon black or a Si-based organic compound, or their combination.
Claim 3
Dependent Claim
42 words
A cover tape used for packaging of chip type electronic parts according to Claim 1, wherein the thermoplastic resin of the adhesion layer consists of polyurethane resin, acrylic resin, polyvinyl chloride resin, ethylene-vinyl acetate copolymer resin or polyester resin, or their combination.
Claim 4
Dependent Claim
58 words
A cover tape used for packaging of chip type electronic parts according to Claim 1 or 2, wherein the amount of the conductive fine powders added is 10-100 parts by weight per 100 parts by weight of the thermoplastic resin of the adhesion layer and the surface resistance of the adhesion layer is 10 13 DID or less.
Claim 5
Dependent Claim
56 words
A cover tape used for packaging of chip type electronic parts according to Claim 1, 2 or 3, wherein the adhesion strength between the adhesion layer of the cover tape and the sealing surface of the carrier tape is larger than the interlaminar adhesion strength between the outer layer and adhesion layer of the cover tape.
Claim 6
Dependent Claim
40 words
A cover tape used for packaging of chip type electronic parts according to Claim 4, wherein the interlaminar adhesion strength between the outer layer and adhesion layer of the cover tape is 10-120 g per 1 mm of sealing width.
Claim 7
Dependent Claim
33 words
A cover tape used for packaging of chip type electronic parts according to Claim 1, 2, 3, 4 or 5, wherein the visible light transmittance of the cover tape is 10% or more.
Claim 8
Dependent Claim
105 words
A cover tape used for packaging of chip type electronic parts, which is heat-sealable to a plastic carrier tape having at given intervals pockets for accommodation of chip type electronic parts, characterized in that the outer layer is a biaxially oriented film consisting of polyester, polypropylene or nylon, the intermediate layer consists of a polyolefin which is polyethylene, ethylene-vinyl acetate copolymer, ionomer, polypropylene or their modification product, and the adhesion layer consists of a dispersion of conductive fine powders in a thermoplastic resin, said conductive fine powders consisting of tin oxide, zinc oxide, titanium oxide, carbon black or a Si-based organic compound, or their combination.
Claim 9
Dependent Claim
105 words
A cover tape used for packaging of chip type electronic parts, which is heat-sealable to a plastic carrier tape having at given intervals pockets for accommodation of chip type electronic parts, characterized in that the outer layer is a biaxially oriented film consisting of polyester, polypropylene or nylon, the intermediate layer consists of a polyolefin which is polyethylene, ethylene-vinyl acetate copolymer, ionomer, polypropylene or their modification product, and the adhesion layer consists of a dispersion of conductive fine powders in a thermoplastic resin, said conductive fine powders consisting of tin oxide, zinc oxide, titanium oxide, carbon black or a Si-based organic compound, or their combination.
Claim 10
Dependent Claim
42 words
A cover tape used for packaging of chip type electronic parts according to Claim 7, wherein the thermoplastic resin of the adhesion layer consists of polyurethane resin, acrylic resin, polyvinyl chloride resin, ethylene-vinyl acetate copolymer resin or polyester resin, or their combination.
Claim 11
Dependent Claim
58 words
A cover tape used for packaging of chip type electronic parts according to Claim 7 or 8, wherein the amount of the conductive fine powders added is 10-100 parts by weight per 100 parts by weight of the thermoplastic resin of the adhesion layer and the surface resistance of the adhesion layer is 10 13 DID or less.
Claim 12
Dependent Claim
56 words
A cover tape used for packaging of chip type electronic parts according to Claim 7, 8 or 9, wherein the adhesion strength between the adhesion layer of the cover tape and the sealing surface of the carrier tape is larger than the interlaminar adhesion strength between the intermediate layer and adhesion layer of the cover tape.
Claim 13
Dependent Claim
40 words
A cover tape used for packaging of chip type electronic parts according to Claim 10, wherein the interlaminar adhesion strength between the intermediate layer and adhesion layer of the cover tape is 10-120 g per 1 mm of sealing width.
Claim 14
Dependent Claim
33 words
A cover tape used for packaging of chip type electronic parts according to Claim 7, 8, 9, 10 or 11, wherein the visible light transmittance of the cover tape is 10% or more.
References Cited (Backward Citations)
No citation records indexed.
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