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Patterning method using an inorganic masking layer

Assignee: Panasonic Holdings Corp
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Filing: 1991-07-05
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Granted: —
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Expires: 2011-07-05
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Abstract

Abstract A patterning method which comprises forming a photosensitive inorganic semiconductor layer on a semiconductor substrate and irradiating the photosensitive inorganic semiconductor layer which is kept in contact with an electrolyte with light of energy greater than the band gap of the semiconductor layer. Thus, a portion of the semiconductor layer which has been exposed or unexposed to light is dissolved into the electrolyte, thereby producing a desired pattern on the substrate. <IMAGE>

Inventors

  • 👤 Shigeo Kondo

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-09 04:03
CPC Classifications
H; H10; H10P; H10P50/00; H10P50/69; H10P50/691; H10P50/692; H10P50/60; H10P50/61; H10P50/613; Y; Y10; Y10S; Y10S438/00; Y10S438/942; Y10S438/945

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 51 words
A patterning method comprising the steps of: forming a photosensitive inorganic semiconductor layer on a semiconductor substrate; and irradiating the photosensitive inorganic semiconductor layer which is kept in contact with an electrolyte with light having energy greater than the band gap of the photosensitive inorganic semiconductor layer to form a pattern.
Claim 2
Dependent Claim 16 words
A patterning method according to claim 1, wherein the electrolyte is an electroless plating catalytic solution.
Claim 3
Dependent Claim 14 words
A patterning method according to claim 1, wherein the electrolyte is a polymer electrolyte.
Claim 4
Dependent Claim 14 words
A patterning method according to claim 1, wherein the pattern is an etching pattern.
Claim 5
Dependent Claim 14 words
A patterning method according to claim 1, wherein the pattern is a wiring pattern.

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