Patent EP0462596A1 successfully refreshed from Google Patents.
EP0462596A1
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Method and apparatus for packaging a semiconductor device
Assignee: Sumitomo Electric Industries Ltd
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Filing: 1991-06-19
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Granted: —
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Expires: 2011-06-19
Abstract
Abstract There is disclosed a method and an apparatus for packaging a semiconductor flip chip (1) in a substrate (3) by face-down bonding in which a coherent light is irradiated to a bonding head (2) and the substrate and the light reflected by the bonding head and the substrate are interferenced with each other. The adjustment of the inclination of the bonding head (2) against the substrate (3) is performed by the observation of the interference fringe caused by the interference between the lights reflected by the bonding head (2) and the substrate (3).
Inventors
- 👤 Masanori C/O Yokohama Works Nishiguchi
- 👤 Atsushi C/O Yokohama Works Miki
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 21:48
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0446; H10P72/50; H10P72/53; H10W; H10W72/00; H10W72/071; H10W72/072; H10W72/0711; H10W72/07173; H10W72/07178; H10W72/07221; H10W72/07223; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/20; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49131; Y10T29/53; Y10T29/53087; Y10T29/53091; Y10T29/5313; Y10T29/53174; Y10T29/53191
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
187 words
An apparatus for packaging a semiconductor device comprising: bonding head having a holding plane adapted to hold a semiconductor device having a bump electrode formed on a front surface thereof by sucking a rear surface thereof and a light reflective plane formed around the holding plane; a stage opposed to said holding plane adapted to hold a substrate on which the semiconductor device is to be face-down bonded; irradiation means for irradiating a coherent light to the light reflective plane and said stage; observing means for causing a light reflected by the light reflective plane to interfere with a light reflected by a the substrate held by said stage, of the light irradiated by said irradiating means, to observe an interference state therebetween to detect the inclination between the semiconductor chip against the substrate; and adjusting means for moving the bonding head against said stage to adjust parallelism between the plane on which the bump electrode of the sucked semiconductor device is formed and the plane of the substrate to which the semiconductor device is to be bonded and face-down bonding the semiconductor device to the substrate.
Claim 2
Dependent Claim
44 words
An apparatus according to CLAIM 1, wherein said irradiation means is disposed opposite side of said bonding head through said stage and said stage has a through-hole such that said coherent light may be irradiated to said light reflective plane through said through hole.
Claim 3
Dependent Claim
75 words
An apparatus according to CLAIM 2, wherein said irradiation means comprises a half-mirror inclined against said stage at angle 45 and a light source for generating the coherent light such that the coherent light from said light source passes said half-mirror said light reflective plane and said substrate, and lights respectively reflected by them may be interfered with each radiated to be irradiated to guide the reflected lights to said observing means by said half-mirror.
Claim 4
Dependent Claim
39 words
An apparatus according to CLAIM 1, wherein said irradiation means is disposed in the same side of said bonding head against said stage such that the coherent light may be irradiated to the substrate from said bonding head side.
Claim 5
Dependent Claim
80 words
An apparatus according to CLAIM 4, wherein said irradiation means comprising half-mirrors of which reflective planes are arranged to have angel 90 therebetween and a light source for generating a coherent light such that a light from said light source is guided to said light reflection plane and a light reflected by said light reflective plane and a light reflected by the substrate, of said light reflected by said light reflective plane are interfered to guide to said observing means.
Claim 6
Independent Claim
173 words
A method for packaging a semiconductor device comprising the steps of: holding a semiconductor device having a bump electrode formed on a front surface thereof by sucking a rear surface thereof to a sucking surface on a bonding head; irradiating a coherent light to a light reflective plane of the bonding head formed around the sucking surface and a light reflective substrate to which the semiconductor device is to be bonded and held on a stage disposed facing to the bonding head; interfering a light reflected by the substrate and a light reflected by the light reflective light plane, of the light irradiated in said irradiative step to detect an interference fringe; and moving the bonding head in accordance with a state of the interference fringe detected in said detection step, adjusting a parallelism between the plane on which the bump electrode of the sucked semiconductor device is formed and the plane of the substrate to which the semiconductor device is to be bonded and face-down bonding the semiconductor device to the substrate.
Claim 7
Dependent Claim
27 words
A method according to CLAIM 6, wherein the substrate is a light transmissive substrate and the coherent light is irradiated from a rear side of the substrate.
Claim 8
Dependent Claim
36 words
A method according to CLAIM 7, wherein a light passing through the substrate and thereafter reflected by the light reflective plane and a light reflected by the substrate are interfered with each other to be observed.
Claim 9
Dependent Claim
27 words
A method according to CLAIM 6, wherein the substrate is light reflection substrate and the coherent light is irradiated from a substrate mount side of the substrate.
Claim 10
Dependent Claim
39 words
A method according to CLAIM 9, wherein a light reflected by the light reflection plane and a light reflected by the substrate and thereafter reflected by the light reflection plane, of the coherent light are interfered with each other.
References Cited (Backward Citations)
US4896206A
Cited
US4899921A
Cited
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