Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
195 words
A method of manufacturing a multilayer wiring board in which interlayer connection is made between a circuit electric circuit and a second electric circuit, both electric circuits being formed on a substrate (1), comprising the steps of applying a metal layer (2) onto said substrate (1) and a photoresist (3) onto said metal layer (2) and then partially removing said photoresist (3) to produce a resist hole (4), said method being characterised by the steps of: selectively exposing the remaining photoresist in accordance with a desired pattern for said first electric circuit; forming a conductive pillar (5) in said resist hole (4); removing the exposed remaining photoresist to reveal corresponding regions of said metal layer (2) and etching said regions to partly expose the substrate (1) and to form said first electric circuit (6); removing all remaining photoresist and applying an insulation layer (7) onto said first electric circuit (6), the exposed substrate, and said conductive pillar (5), such that only one end of said conductive pillar remains exposed; and applying a second metal layer (8) onto said insulation layer (7) and the exposed end of said conductive pillar to form said second electric circuit.
Claim 2
Dependent Claim
192 words
A method as claimed in Claim 1, comprising steps of: blanket coating said metal layer (2) onto said substrate (1); blanket coating said photoresist (3) onto said metal layer(2); exposing and developing said photoresist (3) to remove a portion of said photoresist thus defining a resist hole (4); selectively exposing the residual photoresist remaining after the exposure and development step to define a desired circuit pattern in accordance with said first electric circuit; forming said conductive pillar (5) in said resist hole (4); developing and removing the exposed residual photoresist; etching the metal layer exposed by the development of said residual photoresist to form said first electric circuit; removing said photoresist from on the metal layer constituting said first electric circuit; blanket coating an organic insulation layer (7) on said first electric circuit (6), the substrate exposed by etching and said conductive pillar (5); flattening the surface of said organic insulation layer (7) to expose one end of said conductive pillar (5); and depositing another metal layer (8) or an electronic part (10) on the exposed surface of said organic insulation layer and said conductive pillar to form said second electric circuit.
Claim 3
Dependent Claim
186 words
A method as claimed in Claim 1, comprising steps of: blanket coating said metal layer (2) onto said substrate (1); blanket coating said photoresist (3) onto said metal layer (2); exposing and developing said photoresist (3) to remove a portion of said photoresist thus defining a resist hole (4); forming said conductive pillar (5) in said resist hole (4); selectively exposing and developing the residual photoresist remaining after the exposure and development step to define a desired circuit pattern in accordance with said first electric circuit; etching the metal layer exposed by the development of said residual photoresist to form said first electric circuit; removing said photoresist from on the metal layer constituting said first electric circuit; blanket coating an organic insulation layer (7) on said first electric circuit (6), the substrate exposed by etching and said conductive pillar (5); flattening the surface of said insulation layer (7) to expose one end of said conductive pillar (5); and depositing another metal layer (8) or electronic part (10) on the exposed surface of said organic insulation layer and said conductive pillar to form said second electric circuit.
Claim 4
Independent Claim
16 words
A method as claimed in any preceding Claim, wherein said photoresist (3) is a positive photoresist.
Claim 5
Independent Claim
51 words
A method as claimed in any preceding claim, wherein, if said conductive pillar consists of the same material as said metal layer, a protective film consisting of a different material to that of said metal layer and conductive pillar is formed on the conductive pillar before said metal layer is etched.
Claim 6
Independent Claim
21 words
A method as claimed in any preceding Claim, wherein said metal layer (2) and second metal layer (8) are copper layers.
Claim 7
Dependent Claim
39 words
A method as claimed in Claim 5, wherein said metal layer (2) and conductive pillar (5) are made of copper, and said protective film comprises either tin, solder plating, an electrodeposited coat film, or an electrodeposited positive photoresist film.
Claim 8
Independent Claim
16 words
A method as claimed in any preceding claim, wherein said conductive pillar is formed by electro-plating.
Claim 9
Dependent Claim
15 words
A multilayer wiring board produced according to a method as claimed in any preceding claim.