EP0456426A1
Expired / Lapsed
EP
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Vacuum type wafer holder
Assignee: Canon Inc
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Filing: 1991-05-03
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Granted: —
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Expires: 2011-05-03
Abstract
Abstract A wafer holding device of vacuum attraction type, includes a structural member (1) having a protrusion (2) for supporting a wafer; and elastic members (3') made of a material having an elasticity modulus smaller than that of the wafer and that of the structural member, the elastic members being distributed on a wafer attraction plane of the structural member.
Inventors
- 👤 Eiji C/O Canon Kabushiki Kaisha Sakamoto
- 👤 Ryuichi C/O Canon Kabushiki Kaisha Ebinuma
- 👤 Shinichi C/O Canon Kabushiki Kaisha Hara
- 👤 Mitsuji C/O Canon Kabushiki Kaisha Marumo
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 02:22
CPC Classifications
C; C30; C30B; C30B31/00; C30B31/06; C30B31/14; C30B25/00; C30B25/02; C30B25/12; H; H10; H10P; H10P72/00; H10P72/70; H10P72/78; Y; Y10; Y10T; Y10T279/00; Y10T279/11
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
52 words
A wafer holding device, comprising: a structural member having a protrusion for supporting a wafer; and elastic members made of a material having an elasticity modulus smaller than that of the wafer and that of the structural member, the elastic members being distributed on a wafer attraction plane of the structural member.
Claim 2
Dependent Claim
23 words
A device according to Claim 1, wherein, when the wafer is not attracted to the device, each elastic member projects beyond the protrusion.
Claim 3
Dependent Claim
25 words
A device according to Claim 1, wherein the protrusion includes a plurality of pins and wherein each elastic member surrounds corresponding one of the pins.
Claim 4
Dependent Claim
16 words
A device according to Claim 1, wherein the protrusion and the elastic members are disposed symmetrically.
Claim 5
Independent Claim
111 words
A method of manufacture of semiconductor devices, comprising the steps of: preparing a wafer holding device for holding a wafer through vacuum attraction, the holding device including a structural member with a protrusion and elastic members distributed on a wafer attraction plane of the holding device, wherein each elastic member is made of a material having an elasticity modulus smaller than that of the protrusion; placing the wafer on the wafer holding device so that it is held by the holding device; and applying an exposure energy to the wafer held by the wafer holding device so that a pattern for manufacture of a semiconductor device is transferred to the wafer.
Claim 6
Dependent Claim
25 words
A method according to Claim 5, wherein, when the wafer is not attracted to the wafer holding device, the elastic member projects beyond the protrusion.
References Cited (Backward Citations)
EP0298564A1
Cited
EP0323902A2
Cited
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