Patent EP0453237A2 successfully refreshed from Google Patents.
EP0453237A2
Expired / Lapsed
EP
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Photosensitive, heat-resistant resin composition and pattern formation process
Assignee: Fujitsu Ltd
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Filing: 1991-04-16
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Granted: —
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Expires: 2011-04-16
Abstract
Abstract The film forming, photosensitive, heat-resistant resin composition comprising a varnish of a polyimide precursor having no photosensitivity in itself, a polymerizable monomer or oligomer compatible with said varnish and capable of providing a high-heat-resistant polymer upon being polymerized and a polymerization initiator for said monomer or oligomer. The resin composition is useful for the production of circuit substrates and semiconductor devices for high-density mounting including multi-chip modules or the like, such as printed circuits, printed boards, wiring boards and electronic components, can effectively avoid a reduction of the layer thickness during the film formation, and ensures a low cost production process. The pattern formation process using the same resin composition is also disclosed.
Inventors
- 👤 Motoaki Tani
- 👤 Eiji Horikoshi
- 👤 Isao Watanabe
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 14:58
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/0011; H05K3/0017; H05K3/0023; G; G03; G03F; G03F7/00; G03F7/004; G03F7/027; G03F7/032; G03F7/037; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0212; H05K2203/00; H05K2203/07; H05K2203/0756; H05K2203/0773; H05K3/38; H05K3/381; H05K3/46; H05K3/4644; H05K3/467
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
47 words
A film forming, photosensitive, heat-resistant composition, characterised by comprising a varnish of polyimide precursor having no photosensitivity in itself, a polymerizable monomer or oligomer compatible with said varnish and capable of providing a high-heat-resistant polymer upon being polymerized and a polymerization initiator for said monomer or oligomer.
Claim 2
Dependent Claim
47 words
A film forming, photosensitive, heat-resistant composition, characterised by comprising a varnish of polyimide precursor having no photosensitivity in itself, a polymerizable monomer or oligomer compatible with said varnish and capable of providing a high-heat-resistant polymer upon being polymerized and a polymerization initiator for said monomer or oligomer.
Claim 3
Dependent Claim
38 words
A photosensitive, heat-resistant resin composition according to claim 1, in which said polyimide precursor is a precursor of a polyimide, a precursor of a modified polyimide, a precursor of a polybismaleimide or a precursor of a modified polybismaleimide.
Claim 4
Dependent Claim
26 words
A photosensitive, heat-resistant resin composition according to claim 1 or 2, in which said polymerizable monomer or oligomer is an acrylic or methacrylic monomer or oligomer.
Claim 5
Dependent Claim
27 words
A photosensitive, heat-resistant resin composition according to claim 1, 2 or 3, in which said monomer or oligomer has at least two functional groups in its molecule.
Claim 6
Dependent Claim
27 words
A photosensitive, heat-resistant resin composition according to claim 1 or 2, in which said polymerizable monomer or oligomer is a monomer or oligomer having an isocyanurate structure.
Claim 7
Dependent Claim
24 words
A photosensitive, heat-resistant resin composition according to claim 1 or 2, in which said polymerizable monomer or oligomer is a phosphazenic monomer or oligomer.
Claim 8
Dependent Claim
35 words
A photosensitive, heat-resistant resin composition according to claim 1 or 2, in which said polymerizable monomer or oligomer is a mixture of an acrylic or methacrylic monomer or oligomer with a phosphazenic monomer or oligomer.
Claim 9
Dependent Claim
41 words
A photosensitive, heat resistant resin composition according to claim 3, 4 or 7, in which said acrylic monomer or oligomer is a monomer or oligomer having an acryloyl or methacryloyl group at a terminal and/or a side chain in its molecule.
Claim 10
Dependent Claim
23 words
A photosensitive, heat-resistant resin composition according to claim 3, 4 or 7, in which said acrylic monomer or oligomer is an oligoester acrylate.
Claim 11
Dependent Claim
44 words
A photosensitive, heat-resistant resin composition according to any preceding claim, in which said polymerization initiator is a benzoin ether compound, a ketal compound, an acetophenone compound, a benzophenone compound, a thioxanthone compound, an organic peroxide, a N-phenylglycine, a triazine compound or an allene-iron complex.
Claim 12
Dependent Claim
105 words
A process for formation of a pattern, which comprises the steps of: coating a base material to be treated with a photosensitive, heat-resistant resin composition as claimed in any preceding claim; exposing the resultant coating of the photosensitive, heat-resistant resin composition to conditions capable of inducing a polymerization of said polymerizable monomer or oligomer in a predetermined pattern, thereby selectively polymerizing said monomer of oligomer; selectively removing a region of said coating other than that where a polymer of said monomer or oligomer has been formed; and heat-treating the residual coating to cause a cyclodehydration reaction and cure said polyimide precursor contained in the coating.
Claim 13
Dependent Claim
56 words
A process forformation of a pattern according to claim 11, in which said polymerization initiator is a photopolymerization initiator and the coating of said photosensitive, heat-resistant resin composition is exposed to a light pattern to induce-and advance a polymerization of said polymerizable monomer or oligomer through the action of a radical generated from said photopolymerization initiator.
Claim 14
Dependent Claim
58 words
A process for formation of a pattern according to claim 11, in which said polymerization initiator is a heat polymerization initiator and the coating of said photosensitive, heat-resistant resin composition is pattern- wise heated to induce and advance a polymerization of said polymerizable monomer or oligomer through the action of a radical generated from said heat polymerization initiator.
Claim 15
Dependent Claim
36 words
A process forformation of a pattern according to any one of claims 11 to 13, which is used for production of circuit substrates for high-density mounting including printed circuits, printed boards, wiring boards and electronic components.
Claim 16
Dependent Claim
169 words
A circuit board, which comprises a substrate and two or more electrically conductive layers applied over the substrate, the electrically conductive layer being insulated from each other through the upper and lower layer-insulating films, and being electrically connected with another electrically conductive layer through an interlayer conductor occupying a viahole in the layer-insulating film sandwiched therebetween, and in which the viahole-containing layer-insulating film has been prepared by the steps of: coating an electrically conductive layer as a base material with a photosensitive, heat-resistant resin composition as claimed in any one of claims 1 to 10; exposing the resultant coating of the photosensitive, heat-resistant resin composition to conditions capable of inducing a polymerization of said polymerizable monomer or oligomer in a predetermined pattern, thereby selectively polymerizing said monomer or oligomer; selectively removing a region of said coating other than that where a polymer of said monomer or oligomer has been formed; and heat-treating the residual coating to cause a cyclodehydration reaction and cure said polyimide precursor contained in the coating.
Claim 17
Dependent Claim
28 words
A circuit board according to claim 15, in which the substrate is a semiconductor substrate, a ceramic substrate, a metallic substrate, an inorganic substrate or an organic substrate.
References Cited (Backward Citations)
No citation records indexed.
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