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EP0448151A1 Expired / Lapsed EP ⏱️ 0.0 years remaining

Method of manufacturing a semiconductor device comprising capacitors which form memory elements and comprise a ferroelectric dielectric material

Assignee: Koninklijke Philips NV
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Filing: 1991-03-12
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Granted: —
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Expires: 2011-03-12
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Abstract

Abstract A method of manufacturing a semiconductor device comprising a semiconductor body (3) with a surface (10) on which capacitors (2) are provided which form memory elements, with a lower electrode (11) comprising platinum, a ferroelectric dielectric material (12) and an upper electrode (13) is presented. In the method according to the invention, the electrodes (11, 13) comprising platinum are formed by the successive deposition on a surface of a first layer (19, 26) comprising a metal from the group titanium, zirconium, hafnium or an alloy of these metals, a second layer (20, 27) comprising platinum, and a third layer (21, 28) comprising a metal from the group titanium, zirconium, hafnium, or an alloy of these metals, upon which the semiconductor body is heated in an atmosphere containing oxygen. The first metal layer ensures a good adhesion of the electrode, the second layer acts as the electrode proper, while the third metal layer counteracts adverse effects of the first layer. Semiconductor devices having electrodes with good adhesion and a smooth surface can be manufactured in such a way. As a result, the semiconductor device is reliable, while switching of the capacitors (2) acting as memory elements between two polarization states takes place at a positive and a negative voltage of equal value.

Inventors

  • 👤 Robertus Adrianus Maria Wolters
  • 👤 Mathieu Joseph Emanuel Ulenaers

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-10-31 08:42
CPC Classifications
H; H10; H10B; H10B53/00; H10D; H10D1/00; H10D1/60; H10D1/68; H10D1/692; H10D1/682; H10D1/696

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 112 words
A method of manufacturing a semiconductor device comprising a semiconductor body with a surface on which capacitors are provided, which capacitors form memory elements and comprise a lower electrode comprising platinum, a ferroelectric dielectric material, and an upper electrode, characterized in that the lower electrode comprising platinum is formed by the successive deposition on the surface of a first layer comprising a metal from the group titanium, zirconium, hafnium, or an alloy of these metals, a second layer comprising platinum, and a third layer comprising a metal from the group titanium, zirconium, hafnium, or an alloy of these metals, upon which the semiconductor body is heated in an atmosphere which contains oxygen.
Claim 2
Dependent Claim 24 words
A method as claimed in Claim 1, characterized in that both the first metal layer and the third metal layer are made of titanium.
Claim 3
Dependent Claim 47 words
A method as claimed in Claim 1 or 2, characterized in that a ferroelectric dielectric material is provided after deposition of the lower electrode but before the heating stage, after which both the lower electrode and the ferroelectric dielectric material are heated in an atmosphere containing oxygen.
Claim 4
Dependent Claim 41 words
A method as claimed in Claim 3, characterized in that the lower electrode and the ferroelectric dielectric material are etched into a pattern after the lower electrode and the ferroelectric dielectric material have been provided and subjected to the heat treatment.
Claim 5
Dependent Claim 100 words
A method as claimed in Claim 1, 2, 3 or 4, characterized in that after the lower electrode and the ferroelectric dielectric material have been provided, an upper electrode is provided on the dielectric material by subsequent deposition on the surface of the dielectric material of a first layer comprising a metal from the group titanium, zirconium, hafnium, or an alloy of these metals, a second layer comprising platinum, and a third layer comprising a metal from the group titanium, zirconium, hafnium or an alloy of these metals, upon which the semiconductor body is heated in an atmosphere containing oxygen.
Claim 6
Dependent Claim 33 words
A method as claimed in Claim 5, characterized in that the first metal layer of the upper electrode and the third metal layer of the lower electrode are provided with the same composition.

References Cited (Backward Citations)

EP0114228A2 Cited
EP0404295A1 Cited

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