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EP0447884A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Semiconductor device having a low temperature UV-cured epoxy seal and method for making the same

Assignee: Motorola Solutions Inc
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Filing: 1991-03-07
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Granted: —
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Expires: 2011-03-07
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Abstract

Abstract A semiconductor device (10) having a package sealed by a UV-curable, thixotropic, acrylated epoxy (26) and a method for sealing the package are disclosed. The package is sealed at room temperature by polymer cross-linking of the epoxy (26) which is initiated by exposure of at least a portion of the epoxy to ultraviolet (UV) frequency radiation. In accordance with one embodiment of the invention, a base (12) is provided having an electronic component (14) attached to the base (12) at a predetermined location. A lid (24) having a layer of UV-curable epoxy (26) screen-printed to a bonding portion (34) is positioned onto the base (12) enclosing the electronic component (14) within a cavity (30) formed by the union of the base (12) and the lid (24). The lid (24) is sealed to the base (12) at room temperature by irradiating an exposed edge portion of the epoxy layer with UV frequency radiation. The formation of the seal at room temperature avoids thermal damage to temperature sensitive materials in both the package and the enclosed electronic component (14).

Inventors

  • 👤 Maurice S. Karpman

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-04 15:25
CPC Classifications
H; H10; H10W; H10W95/00; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/40; H10W74/47; H10W76/00; H10W76/60; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W90/00; H10W90/701; H10W90/751; H10W90/756

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 141 words
A semiconductor device (10) comprising: a base (12) having an electronic component (14) attached thereto; an adhesive material (20) overlying a lead mounting portion (32) of the base (12); a plurality of metal package leads (18) partially embedded in the adhesive material (20) extending outwardly from a position proximate the electronic component (14) for electrically coupling the electronic component (14) to a mounting substrate; a plurality of device leads (22) electrically connecting the electronic component (14) to the plurality of package leads (18); and closure means (24) for covering the electronic component (14), the plurality of device leads (22) and at least a portion of each of the plurality of package leads (18), the closure means (24) including at least one UV-curable epoxy material (26), whereby the closure means (24) enables the semiconductor device (10) to be sealed at room temperature.
Claim 2
Dependent Claim 26 words
The semiconductor device of claim 1 wherein the closure means (24) comprises a lid (24) bonded to the base (12) by the UV-curable epoxy material (26).
Claim 3
Dependent Claim 18 words
The semiconductor device (10) of claim 2 wherein the lid (24) is constructed from a UV transmitting material.
Claim 4
Dependent Claim 29 words
The semiconductor device (10) of claim 2 wherein the lid (24) is constructed from a material selected from the group consisting of alumina, aluminum nitride, aluminum, copper and brass.
Claim 5
Dependent Claim 47 words
The semiconductor device (10) of claim 1 wherein the closure means comprises a body of UV-curable epoxy material (26) disposed on the base (12) forming a protective seal enclosing the electronic component (14) and at least a portion of each of the plurality of package leads (18).
Claim 6
Independent Claim 89 words
A method for fabricating a semiconductor device (10) comprising: providing a base (12) having an electronic component (14) attached thereto; screen printing a layer of UV-curable epoxy (26) onto a bonding portion (26) of a lid (24); positioning the lid (24) onto the base (12) such that an area of UV-curable epoxy is outwardly exposed between the base (12) and the lid (24); and irradiating the outwardly exposed area with UV frequency radiation to cure the layer of UV-curable epoxy (26) sealing the lid (24) to the base (12).
Claim 7
Dependent Claim 30 words
The method of claim 6 wherein said irradiating comprises directing a beam of UV radiation having a wavelength of about 320 to 380 nm to the outwardly exposed edge area.
Claim 8
Dependent Claim 29 words
The method of claim 6 wherein the step of irradiating comprises passing the outwardly exposed area of UV-curable epoxy through a UV radiation field in a continuous linear operation.

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