Patent EP0441572A2 successfully refreshed from Google Patents.
EP0441572A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Power semiconductor device with heat dissipating property
Assignee: NGK Insulators Ltd
•
Filing: 1991-02-04
•
Granted: —
•
Expires: 2011-02-04
Abstract
Abstract A power semiconductor device such as power thyristor including a semiconductor substrate (1) which is clamped by first and second conductive members (3,9) serving as the electrodes as well as heat sinks, and a plurality of heat pipes (5,6) whose ends are inserted directly into the conductive members (3,9). A plurality of semiconductor substrates and temperature compensating plates are alternatively stacked one on another and conductive members are provided on outermost temperature compensating plates to form an assembly. The assembly is hermetically sealed by an insulating package (4) formed by an insulator having a corrugated outer surface such that outer surfaces of the conductive members are exposed out of the package. Alternatively, one or more heat pipes are inserted into the insulating package such that electrically insulating cooling medium filled in the heat pipes can be directly made into contact with the semiconductor substrates.
Inventors
- 👤 Chihiro Ishibashi
- 👤 Hiroyuki Abe
- 👤 Susumu Matsuoka
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 18:59
CPC Classifications
F; F28; F28D; F28D15/00; F28D15/02; F28D15/0275; F28F; F28F1/00; F28F1/10; F28F1/12; F28F1/24; F28F1/32; H; H10; H10W; H10W40/00; H10W40/70; H10W40/73; H10W72/00
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
100 words
A power semiconductor device with heat dissipating property comprising: a semiconductor element having a semiconductor substrate; a first electrically conductive member arranged on one surface of the semiconductor substrate; a second electrically conductive member arranged on the other surface of the semiconductor substrate; at least one first heat pipe having one end inserted into said first electrically conductive member; at least one second heat pipe having one end inserted into said second electrically conductive member; a plurality of first cooling fins arranged on said first heat pipe; and a plurality of second cooling fins arranged in said second heat pipe.
Claim 2
Dependent Claim
69 words
A power semiconductor device according to claim 1, wherein two first heat pipes are inserted into said first conductive member such that these first heat pipes are aligned with each other in a first direction, and two second heat pipes are inserted into said second conductive member such that these second heat pipes are aligned with each other in a second direction which is parallel with the first direction.
Claim 3
Dependent Claim
25 words
A power semiconductor device according to claim 2, wherein said first and second directions are parallel with a plane in which said semiconductor substrate extends.
Claim 4
Dependent Claim
68 words
A power semiconductor device according to claim 3, wherein each of said first and second heat pipes includes an insulating pipe portion and a metal pipe portion, and said first and second cooling fins are commonly formed by cooling fins which are coupled with the metal pipe portions of the first and second heat pipes extending from the same side of the first and second conductive members, respectively.
Claim 5
Dependent Claim
52 words
A power semiconductor device according to any one of claims 1 to 4, further comprising a first temperature compensating plate arranged between the one surface of semiconductor substrate and the first conductive member, and a second temperature compensating plate arranged between the other surface of semiconductor substrate and the second conductive member.
Claim 6
Dependent Claim
29 words
A power semiconductor device according to claim 5, wherein an assembly of the semiconductor substrate and first and second temperature compensating plates is hermetically sealed by an insulating package.
Claim 7
Dependent Claim
22 words
A power semiconductor device according to claim 6, wherein said insulating package is formed by an insulator having a corrugated outer surface.
Claim 8
Dependent Claim
91 words
A power semiconductor device with heat dissipating property comprising: a semiconductor element having a semiconductor substrate; an insulating package arranged to hermetically seal the semiconductor substrate to form a space between the semiconductor substrate and the insulating package a heat pipe having one end inserted into said insulating package such that an inner space of the heat pipe is communicated with said space; an electrically insulating cooling medium filled in said spaces formed within the insulating package and heat pipe; and a plurality of cooling fins provided on the heat pipe.
Claim 9
Dependent Claim
51 words
A power semiconductor device according to claim 8, wherein said heat pipe includes an insulating pipe portion having one end coupled with the insulating package and a metal pipe portion coupled with the other end of the insulating pipe portion, and said cooling fins are provided on said metal pipe portion.
Claim 10
Dependent Claim
23 words
A power semiconductor device according to claim 9, wherein said insulating pipe portion is formed by an insulator having a corrugated outer surface.
Claim 11
Dependent Claim
97 words
A power semiconductor device according to claim 8, further comprising a first temperature compensating plate arranged on one surface of the semiconductor substrate, first electrically conductive member applied on an outer surface of the first temperature compensating plate, a second temperature compensating plate provided on the other surface of the semiconductor substrate, and a second electrically conductive member applied on an outer surface of the second temperature compensating plate, whereby said insulating package is arranged on the first and second conductive members such that outer surfaces of these conductive members are exposed out of the insulating package.
Claim 12
Dependent Claim
109 words
A power semiconductor device with heat dissipating property comprising: a plurality of semiconductor elements each having a semiconductor substrate, said semiconductor substrates being stacked one on another; a plurality of heat compensating plates, each said semiconductor substrate being between two said heat compensating plates in the stack a first electrically conductive member arranged on one surface of an assembly of said semiconductor substrates and heat compensating plates; a second electrically conductive member arranged on the other surface of said assembly; and an insulating package in which said assembly is hermetically sealed such that outer surfaces of said first and second conductive members are exposed out of the insulating package.
Claim 13
Dependent Claim
22 words
A power semiconductor device according to claim 12, wherein said insulating package is formed by an insulator having a corrugated outer surface.
Claim 14
Dependent Claim
144 words
A power semiconductor device with heat dissipating property comprising: a plurality of semiconductor elements each having semiconductor substrates, said semiconductor substrates being stacked one on another; a plurality of temperature compensating plates, each said semiconductor substrate being between two said temperature compensating plates in the stack; a first electrically conductive member arranged on one surface of an assembly of the semiconductor substrates and temperature compensating plates; a second electrically conductive member arranged on the other surface of said assembly; an insulating package in which an assembly of said semiconductor substrates, temperature compensating plates and first and second conductive members being hermetically sealed such that outer surfaces of said first and second conductive members are exposed out of said insulating package; at least one heat pipe having one end inserted into said insulating package; and a plurality of cooling fins provided on said heat pipe.
Claim 15
Dependent Claim
22 words
A power semiconductor device according to claim 14, wherein said insulating package is formed by an insulator having a corrugated outer surface.
Claim 16
Dependent Claim
83 words
A power semiconductor device according to any one of claims 14 and 15, wherein said insulating package is arranged such that a space is formed between the insulating package and said assembly of the semiconductor substrates, temperature compensating plates and conductive members, one ends of a plurality of heat pipes are coupled with the insulating package such that inner spaces of these heat pipes are communicated with said space, and cooling medium filled in the heat pipe is made of electrically insulating material.
Claim 17
Dependent Claim
53 words
A power semiconductor device according to claim 16, further comprising a heat sink arranged at a middle of said assembly of the semiconductor substrates and temperature compensating plates and having a hole formed therein, an opening of said hole being opposed to an opening of an inner space of a first heat pipe.
Claim 18
Dependent Claim
92 words
A power semiconductor device according to claim 17, wherein each of said first and second conductive members has a hole formed therein, and the device further comprises a second heat pipe arranged such that an opening of an inner space of the second heat pipe is opposed to an opening of the hole formed in the first conductive member, and a third heat pipe arranged such that an opening of an inner space of the third heat pipe is opposed to an opening of the hole formed in the second conductive member.
Claim 19
Dependent Claim
80 words
A power semiconductor device according to claim 18, wherein said first, second and third heat pipes are extended from the same side of the insulating package in the same direction, each of said first, second and third heat pipes includes an insulating pipe portion and a metal pipe portion, and said cooling fins provided on these heat pipes are commonly formed by cooling fins which are coupled with the metal pipe portions of the first, second and third heat pipes.
Claim 20
Dependent Claim
47 words
A power semiconductor device according to any one of claims 14 and 15, further comprising a heat sink arranged at a middle of said assembly of the semiconductor substrates and temperature compensating plates, whereby one end of a first heat pipe is inserted into said heat sink.
Claim 21
Dependent Claim
39 words
A power semiconductor device according to claim 20, further comprising a second heat pipe whose one end is inserted into the first conductive member and a third heat pipe whose one end is inserted into the second conductive member.
Claim 22
Dependent Claim
80 words
A power semiconductor device according to claim 21, wherein said first, second and third heat pipes are extended from the same side of the insulating package in the same direction, each of said first, second and third heat pipes includes an insulating pipe portion and a metal pipe portion, and said cooling fins provided on these heat pipes are commonly formed by cooling fins which are coupled with the metal pipe portions of the first, second and third heat pipes.
Claim 23
Dependent Claim
86 words
A power semiconductor device according to claim 20, wherein said insulating package is consisting of a first package half which seals a portion of the assembly of the semiconductor substrates, temperature compensating plates and conductive members which situates on one side of said heat sink, and a second package half which seals a portion of said assembly situating on the other side of said heat sink independently from said first package half, and said first heat pipe is clamped between said first and second package halves.
Claim 24
Dependent Claim
54 words
A power semiconductor device according to claim 23, wherein further comprising a second heat pipe whose one end is inserted into the first conductive member by means of the first package half and a third heat pipe whose one end is inserted into the second conductive member by means of the second package half.
Claim 25
Dependent Claim
80 words
A power semiconductor device according to claim 24, wherein said first, second and third heat pipes are extended from the same side of the insulating package in the same direction, each of said first, second and third heat pipes includes an insulating pipe portion and a metal pipe portion, and said cooling fins provided on these heat pipes are commonly formed by cooling fins which are coupled with the metal pipe portions of the first, second and third heat pipes.
Claim 26
Dependent Claim
71 words
A power semiconductor device according to claim 23, further comprising a first outermost heat sink provided on the outer surface of the first conductive member, a second outermost heat sink provided on the outer surface of the second conductive member, a second heat pipe whose one end is inserted into said first outermost heat sink, and a third heat pipe whose one end is inserted into said second outermost heat sink.
Claim 27
Dependent Claim
72 words
A power semiconductor device according to claim 26, wherein said first, second and third heat pipes are extended in the same direction, each of said first, second and third heat pipes includes an insulating pipe portion and a metal pipe portion, and said cooling fins provided on these heat pipes are commonly formed by cooling fins which are coupled with the metal pipe portions of the first, second and third heat pipes.
Claim 28
Dependent Claim
71 words
A power semiconductor device according to claim 20, further comprising a first outermost heat sink provided on the outer surface of the first conductive member, a second outermost heat sink provided on the outer surface of the second conductive member, a second heat pipe whose one end is inserted into said first outermost heat sink, and a third heat pipe whose one end is inserted into said second outermost heat sink.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.