Semiconductor device and a method of fabricating the same
Abstract
Abstract A semiconductor device comprises a semiconductor substrate (1) provided with a collector region (62) a base region (60) and an emitter region (61) in a lateral arrangement. Respective portions having peak impurity concentrations of the collector region and the emitter region are formed within the semiconductor substrate. A method of fabricating a semiconductor device comprises a step of forming a collector region of a second conduction type and a emitter region of a second conduction type in a lateral arrangement in a semiconductor substrate serving as a base region of a first conduction type by using a first mask provided with a pair of openings, and a step of forming heavily doped regions of the second conduction type so as to be connected respectively to the collector region and the emitter region by using a second mask provided with a pair of openings separated from each other by a distance greater than the distance between the openings of the first mask.
Inventors
- 👤 Takayuki C/O Sony Corporation Gomi
- 👤 Minoru C/O Sony Corporation Nakamura
- 👤 Hiroaki C/O Sony Corporation Anmo
- 👤 Norikazu C/O Sony Corporation Ohuchi
- 👤 Hiroyuki C/O Sony Corporation Miwa
- 👤 Akio C/O Sony Corporation Kayanuma
- 👤 Koji C/O Sony Corporation Kobayashi
Bibliographic Details
Claims Analysis
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