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EP0433695A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Integrated circuit device and method to prevent cracking during surface mount
Assignee: Texas Instruments Inc
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Filing: 1990-11-23
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Granted: —
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Expires: 2010-11-23
Abstract
Abstract A semiconductor package device (20) is disclosed. In one embodiment, attached by its active face to a lead-on-chip leadframe (23) having leadfingers (25), is an integrated circuit (21). The integrated circuit (21) has a polyimide coating (29) on its backside. An encapsulating material (26) surrounds the integrated circuit (21) and the lead-on-chip leadframe (13) so that the leadfingers (25) are exposed. The polyimide coating (29) on the backside of the integrated circuit (21) helps to reduce package cracking arising from mounting the device to a printed circuit board by reflow solder.
Inventors
- 👤 Thiam B. Lim
- 👤 Tadashi Saitoh
- 👤 Boon Q. Seow
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 10:43
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/421; H10W70/424; H10W70/427; H10W70/429; H10W74/00; H10W74/10; H10W74/111; H10W74/121; H10W72/00; H10W72/071; H10W72/073; H10W72/075; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/851; H10W72/853; H10W72/865; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
41 words
A semiconductor integrated circuit adapted for mounting to a lead-on-chip leadframe comprising: an integrated circuit having an active face and a backside, the active face attached to a lead-on-chip leadframe; and a polyimide coating on the backside of the integrated circuit.
Claim 2
Dependent Claim
18 words
The semiconductor integrated circuit of claim 1 wherein the polyimide coating ranges from about 6 to 75 microns.
Claim 3
Dependent Claim
41 words
A semiconductor integrated circuit adapted for mounting to a chip-on-lead leadframe comprising: an integrated circuit having an active face and a backside, the active face attached to a chip-on-lead leadframe; and a polyimide coating on the backside of the integrated circuit.
Claim 4
Dependent Claim
18 words
The semiconductor integrated circuit of claim 3 wherein the polyimide coating ranges from about 6 to 75 micorns.
Claim 5
Dependent Claim
41 words
A semiconductor integrated circuit adapted for mounting to a tabpak tape comprising: an integrated circuit having an active face and a backside, the active face attached to the tabpak tape; and a polyimide coating on the backside of the integrated circuit.
Claim 6
Dependent Claim
18 words
The semiconductor integrated circuit of claim 5 wherein the polyimide coating ranges from about 6 to 75 microns.
Claim 7
Dependent Claim
39 words
A semiconductor package device comprising: a lead-on-chip leadframe having leadfingers; an integrated circuit having an active face and a backside, the active face attached to the lead-on-chip leadframe; and a polyimide coating on the backside of the integrated circuit.
Claim 8
Dependent Claim
25 words
The semiconductor package device of claim 7 further comprising: encapsulating material surrounding the integrated circuit and the lead-on-chip leadframe so that the leadfingers are exposed.
Claim 9
Dependent Claim
13 words
The semiconductor package device of claim 8 wherein the encapsulating material is plastic.
Claim 10
Dependent Claim
18 words
The semiconductor package device of claim 9 wherein the polyimide coating ranges from about 6 to 75 microns.
Claim 11
Dependent Claim
39 words
A semiconductor package device comprising: a chip-on-lead leadframe having leadfingers; an integrated circuit having an active face and a backside, the active face attached to the chip-on-lead leadframe; and a polyimide coating on the backside of the integrated circuit.
Claim 12
Dependent Claim
26 words
The semiconductor package device of claim 11. further comprising: an encapsulating material surrounding the integrated circuit and the chip-on-lead leadframe so that the leadfingers are exposed.
Claim 13
Dependent Claim
13 words
The semiconductor package device of claim 12 wherein the encapsulating material is plastic.
Claim 14
Dependent Claim
18 words
The semiconductor package device of claim 13 wherein the polyimide coating ranges from about 6 to 75 microns.
Claim 15
Dependent Claim
46 words
A semiconductor package device comprising: a tabpak tape having leadfingers; an integrated circuit having an active face and a backside, the active face attached to the tabpak tape so that the leadfingers are exposed; and a polyimide coating on the backside coating of the integrated circuit.
Claim 16
Dependent Claim
26 words
The semiconductor package device of claim 15 further comprising: an encapsulating material surrounding the integrated circuit and the tabpak tape so that the leadfingers are exposed.
Claim 17
Dependent Claim
18 words
The semiconductor package device of claim 16 wherein the polyimide coating ranges from about 6 to 75 microns.
Claim 18
Dependent Claim
39 words
A semiconductor package device comprising: a flip-chip leadframe having leadfingers; an integrated circuit having an active face and a backside, the active face attached to the flip-chip leadframe; and a polyimide coating on the backside of the integrated circuit.
Claim 19
Dependent Claim
26 words
The semiconductor package device of claim 18 further comprising: an encapsulating material surrounding the integrated circuit and the flip-chip leadframe so that the leadfingers are exposed.
Claim 20
Dependent Claim
13 words
The semiconductor package device of claim 19 wherein the encapsulating material is plastic.
Claim 21
Dependent Claim
18 words
The semiconductor package device of claim 20 wherein the polyimide coating ranges from about 6 to 75 microns.
Claim 22
Independent Claim
56 words
A method of making a semiconductor package device comprising the steps of: attaching the active face of a semiconductor integrated circuit to a lead-on-chip leadframe having leadfingers; applying a polyimide coating to the backside of the semiconductor integrated circuit; and encapsulating the semiconductor integrated circuit and the lead-on-chip leadframe with a material leaving the leadfingers exposed.
Claim 23
Independent Claim
56 words
A method of making a semiconductor package device comprising the steps of: attaching the active face of a semiconductor integrated circuit to a chip-on-lead leadframe having leadfingers; applying a polyimide coating to the backside of the semiconductor integrated circuit; and encapsulating the semiconductor integrated circuit and the chip-on-lead leadframe with a material leaving the leadfingers exposed.
Claim 24
Independent Claim
56 words
A method of making a semiconductor package device comprising the steps of: attaching the active face of a semiconductor integrated circuit to a tabpak tape having leadfingers; applying a polyimide coating to the backside of the semiconductor integrated circuit; and encapsulating the semiconductor integrated circuit and the tabpak tape with a material leaving the leadfingers exposed.
References Cited (Backward Citations)
No citation records indexed.
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