Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
130 words
An integrated circuit assembly (300) comprising: an integrated circuit carrier (102); at least one integrated circuit chip (104) in a flip-chip arrangement relative to said carrier; a connection pillar (376) electrically and mechanically connecting said carrier and said chip, said connection pillar having an axis defining an axial direction, said pillar spacing said chip and said carrier in said axial direction; and flexible attachment means for attaching said pillar to at least one element of the set consisting of said carrier and said chip so that said pillar can move in said axial direction and tilt with respect to said axial direction; whereby, when said carrier and said chip undergo differential thermal expansion said pillar moves to reduce shear strain in planes orthogonal to said axial direction along said pillar.
Claim 2
Dependent Claim
130 words
An integrated circuit assembly (300) comprising: an integrated circuit carrier (102); at least one integrated circuit chip (104) in a flip-chip arrangement relative to said carrier; a connection pillar (376) electrically and mechanically connecting said carrier and said chip, said connection pillar having an axis defining an axial direction, said pillar spacing said chip and said carrier in said axial direction; and flexible attachment means for attaching said pillar to at least one element of the set consisting of said carrier and said chip so that said pillar can move in said axial direction and tilt with respect to said axial direction; whereby, when said carrier and said chip undergo differential thermal expansion said pillar moves to reduce shear strain in planes orthogonal to said axial direction along said pillar.
Claim 3
Dependent Claim
37 words
The assembly of Claim 1 wherein said connection pillar comprises a first post (222) attached to said carrier, a second post (216) attached to said chip, and a solder bump (228) attaching said first and second posts.
Claim 4
Dependent Claim
26 words
The assembly of Claim 1 or 2 wherein said flexible attachment means provides for flexibly attaching said pillar to both of said carrier and said chip.
Claim 5
Dependent Claim
35 words
The assembly of Claim 1, 2 or 3 wherein said flexible attachment means includes a cavity (368) formed in said element and a flexible membrane (370) formed over said cavity and attaching to said pillar.
Claim 6
Independent Claim
66 words
A method of fabricating an integrated assembly (300), said method comprising: attaching a pillar (376) to an integrated circuit (102) and an integrated circuit chip (104) in a flip-chip arrangement so that said carrier and said chip are spaced by said pillar, said attaching involving a flexible joint between said pillar and at least one element of the set consisting of said carrier and said chip.
Claim 7
Independent Claim
66 words
A method of fabricating an integrated assembly (300), said method comprising: attaching a pillar (376) to an integrated circuit (102) and an integrated circuit chip (104) in a flip-chip arrangement so that said carrier and said chip are spaced by said pillar, said attaching involving a flexible joint between said pillar and at least one element of the set consisting of said carrier and said chip.
Claim 8
Independent Claim
68 words
A method of fabricating an integrated circuit assembly (300), said method comprising the steps of: forming cavities (368) in an integrated circuit chip (104) and an integrated circuit carrier (102); forming membranes (370) over said cavities; forming posts (222 and 216) over respective said membranes; and soldering at least one of said posts formed on said carrier to at least one of said posts formed on said chip.
Claim 9
Independent Claim
68 words
A method of fabricating an integrated circuit assembly (300), said method comprising the steps of: forming cavities (368) in an integrated circuit chip (104) and an integrated circuit carrier (102); forming membranes (370) over said cavities; forming posts (222 and 216) over respective said membranes; and soldering at least one of said posts formed on said carrier to at least one of said posts formed on said chip.
Claim 10
Independent Claim
118 words
A method of fabricating a membrane prober assembly (500), said method comprising the steps of: forming a cavity (368) in an integrated circuit chip (104); forming a membrane (370) over said cavity; forming a post (216) over said membrane of said chip; forming a cavity (568) in an integrated circuit test carrier (502); forming a membrane (570) over said cavity of said test carrier; forming a post (522) over said membrane of said test carrier; forming a test post (584) consisting of said post of said test carrier and a test bump (582); and engaging at least one of said posts formed on said chip with at least one of said test posts formed on said test carrier.
Claim 11
Independent Claim
118 words
A method of fabricating a membrane prober assembly (500), said method comprising the steps of: forming a cavity (368) in an integrated circuit chip (104); forming a membrane (370) over said cavity; forming a post (216) over said membrane of said chip; forming a cavity (568) in an integrated circuit test carrier (502); forming a membrane (570) over said cavity of said test carrier; forming a post (522) over said membrane of said test carrier; forming a test post (584) consisting of said post of said test carrier and a test bump (582); and engaging at least one of said posts formed on said chip with at least one of said test posts formed on said test carrier.