Laminated and grain boundary insulated type semiconductive ceramic capacitor and method of producing the same

Claim 1

A semiconductor-type laminated ceramic capacitor with a grain boundary-insulated structure comprising a plurality of inner electrodes on the surfaces of the grain boundary insulated, semiconductor type ceramic sheets, the terminal of each of said inner electrodes being extended to one edge of the corresponding ceramic sheet and said ceramic sheets being laminated so that said terminals of said inner electrodes come to the corresponding opposite edges of said ceramic sheets alternatively one by one; and outer electrodes electrically connected to said terminals of inner electrodes at opposite edges of each of said grain boundary insulated, semiconductor type ceramic sheets, wherein said ceramic sheets comprise of a material of the composition of Sr (1-x) Ca x TiO 3 containing excess Ti to make final molecular ratio of Ti to Sr (1-x) Ca x in the range of 0.95≦Sr (1-x) Ca x /Ti<1.00(where x is in the range of 0.001≦x≦0.2; at least one or more kinds of the compounds selected from Nb 2 0s, Ta 2 0s, V 2 0 3 , W 2 0 5 , Dy 2 0 3 , Nd 2 0 3 , Y 2 0 3 , La 2 0 3 or Ce0 2 are added to said ceramic material to make their relative molar content in the range from 0.05 to 2.0%; and Mn and Si are also included in said ceramic material to the amount of their combined relative molar content, converting into Mn0 2 and Si0 2 respectively, in the range of 0.2 to 5.0%.

Claim 5

A method for manufacturing semiconductor-type laminated ceramic capacitor with a grain boundary-insulated structure comprising the steps of calcinating starting material of mixed powder in air or in nitrogen atmosphere after grinding, mixing and drying said mixed powder; forming raw sheets by dispersing said calcinated powder in a solvent with organic binder and molding said dispersed powder, said calcinated powder being re-ground before dispersing and after calcinating; printing a pattern of inner electrode paste on the surfaces of said raw sheets, terminals of said inner electrodes being extended to each of the corresponding opposite edges of said raw sheets alternatively one by one (wherein patterns of inner electrodes are not printed on uppermost and lowermost parts of raw sheets); calcinating laminated body in air, said laminated body being formed by laminating and compressing said raw sheets on which surfaces patterns of inner electrode paste have been printed; sintering said laminated raw sheets in reducing atmosphere or in nitrogen atmosphere after calcination; re-oxidizing in air after sintering; and covering said edges of sintered ceramic sheets with outer electrode paste and baking after re-oxidation, terminals of inner electrodes being exposed to said edges, wherein: said starting material of mixed powder comprises of a material of the composition of Sr (1-x) Ca x TiO 3 containing excess Ti to make final molecular ratio of Ti to Sr (1-x) Ca x in the range of 0.95≦Sr (1-x)- Ca,/Ti<1.00 (where x is in the range of 0.001≦x≦0.2); at least one or more kinds of the compounds selected from NbzOs, Ta 2 0s, V 2 0s, W 2 0s, Dy 2 0 3 , Nd 2 0 3 , Y 2 0 3 , La 2 0 3 or Ce0 2 are added to said starting material to make their relative molar content in the range from 0.05 to 2.0%; and Mn and Si are also included in said starting material to the amount of their combined relative molar content, converting into Mn0 2 and Si0 2 respectively, in the range of 0.2 to 5.0%.

Claim 6

A method for manufacturing semiconductor-type laminated ceramic capacitor with a grain boundary-insulated structure comprising the steps of calcinating starting material of mixed powder in air or in nitrogen atmosphere after grinding, mixing and drying said mixed powder; forming raw sheets by dispersing said calcinated powder in a solvent with organic binder and molding said dispersed powder, said calcinated powder being re-ground before dispersing and after calcinating; printing a pattern of inner electrode paste on the surfaces of said raw sheets, terminals of said inner electrodes being extended to each of the corresponding opposite edges of said raw sheets alternatively one by one (wherein patterns of inner electrodes are not printed on uppermost and lowermost parts of raw sheets); calcinating laminated body in air, said laminated body being formed by laminating and compressing said raw sheets on which surfaces patterns of inner electrode paste have been printed; sintering said laminated raw sheets in reducing atmosphere or in nitrogen atmosphere after calcination; re-oxidizing in air after sintering; and covering said edges of sintered ceramic sheets with outer electrode paste and baking after re-oxidation, terminals of inner electrodes being exposed to said edges, wherein: said starting material of mixed powder comprises of a material of the composition of Sr (1-x) Ca x TiO 3 containing excess Ti to make final molecular ratio of Ti to Sr (1-x) Ca x in the range of 0.95≦Sr (1-x)- Ca,/Ti<1.00 (where x is in the range of 0.001≦x≦0.2); at least one or more kinds of the compounds selected from NbzOs, Ta 2 0s, V 2 0s, W 2 0s, Dy 2 0 3 , Nd 2 0 3 , Y 2 0 3 , La 2 0 3 or Ce0 2 are added to said starting material to make their relative molar content in the range from 0.05 to 2.0%; and Mn and Si are also included in said starting material to the amount of their combined relative molar content, converting into Mn0 2 and Si0 2 respectively, in the range of 0.2 to 5.0%.

Claim 11

A method for manufacturing semiconductor-type laminated ceramic capacitor with a grain boundary-insulated structure comprising the steps of calcinating starting material of mixed powder in air or in nitrogen atmosphere after grinding, mixing and drying said mixed powder; forming raw sheets by dispersing said calcinated powder in a solvent with organic binder and molding said dispersed powder, said calcinated powder being re-ground before dispersing and after calcinating; printing a pattern of inner electrode paste on the surface of said raw sheets, terminals of said inner electrodes being extended to ea ch of the corresponding opposite edges of said raw sheets alternatively one by one (wherein patterns of inner electrodes are not printed on uppermost and lowermost parts of raw sheets); calcinating laminated body in air, said laminated body being formed by laminating and compressing said raw sheets on which surfaces patterns of inner electrode paste have been printed; sintering said laminated raw sheets in reducing atmosphere or in nitrogen atmosphere after calcination; re-oxidizing in air after sintering; and covering said edges of sintered ceramic sheets with outer electrode paste and baking after re-oxidation, terminals of inner electrodes being exposed to said edges, wherein: said starting material of mixed powder comprises of a material of the composition of Sr (1-x) Ca x TiO 3 containing excess Ti to make final molecular ratio of Ti to Sr (1-x) Ca x in the range of 0.95≦Sr (1-x)- Ca c /Ti<1.00 (where x is in the range of 0.001≦x≦0.2); at least one or more kinds of the compounds of Nb 2 0 3 , Ta 2 0 5 , V 2 0 3 , W 2 O 5 , Dy 2 0 3 , Nd 2 0 3 , Y 2 0 3 , La 2 O 3 and Ce0 2 are added to said starting material to make their relative molar content in the range from 0.05 to 2.0%; Mn and Si are also included in said starting material to the amount of their combined relative molar content, converting into Mn0 2 and Si0 2 respectively, in the range of 0.2 to 5.0%; and Na 2 SiO 3 is further included in said ceramic material to make relative molar content in the range of 0.05 - 2.0%.

Claim 12

A method for manufacturing semiconductor-type laminated ceramic capacitor with a grain boundary-insulated structure comprising the steps of calcinating starting material of mixed powder in air or in nitrogen atmosphere after grinding, mixing and drying said mixed powder; forming raw sheets by dispersing said calcinated powder in a solvent with organic binder and molding said dispersed powder, said calcinated powder being re-ground before dispersing and after calcinating; printing a pattern of inner electrode paste on the surface of said raw sheets, terminals of said inner electrodes being extended to ea ch of the corresponding opposite edges of said raw sheets alternatively one by one (wherein patterns of inner electrodes are not printed on uppermost and lowermost parts of raw sheets); calcinating laminated body in air, said laminated body being formed by laminating and compressing said raw sheets on which surfaces patterns of inner electrode paste have been printed; sintering said laminated raw sheets in reducing atmosphere or in nitrogen atmosphere after calcination; re-oxidizing in air after sintering; and covering said edges of sintered ceramic sheets with outer electrode paste and baking after re-oxidation, terminals of inner electrodes being exposed to said edges, wherein: said starting material of mixed powder comprises of a material of the composition of Sr (1-x) Ca x TiO 3 containing excess Ti to make final molecular ratio of Ti to Sr (1-x) Ca x in the range of 0.95≦Sr (1-x)- Ca c /Ti<1.00 (where x is in the range of 0.001≦x≦0.2); at least one or more kinds of the compounds of Nb 2 0 3 , Ta 2 0 5 , V 2 0 3 , W 2 O 5 , Dy 2 0 3 , Nd 2 0 3 , Y 2 0 3 , La 2 O 3 and Ce0 2 are added to said starting material to make their relative molar content in the range from 0.05 to 2.0%; Mn and Si are also included in said starting material to the amount of their combined relative molar content, converting into Mn0 2 and Si0 2 respectively, in the range of 0.2 to 5.0%; and Na 2 SiO 3 is further included in said ceramic material to make relative molar content in the range of 0.05 - 2.0%.

Claim 15

A method for manufacturing semiconductor-type laminated ceramic capacitor with a grain boundary-insulated structure comprising the steps of calcinating starting material of mixed powder in air or in nitrogen atmosphere after grinding, mixing and drying said mixed powder; forming a raw sheets by dispersing said calcinated powder in a solvent with organic binder and molding said dispersed powder, said calcinated powder being re-ground before dispersing and after calcinating; printing a pattern of inner electrode paste on the surfaces of said raw sheets, terminals of said inner electrodes being extended to each of the corresponding opposite edges of said raw sheets alternatively one by one (wherein patterns of inner electrodes are not printed on uppermost and lowermost parts of raw sheets); calcinating laminated body in air, said laminated body being formed by laminating and compressing said raw sheets on which surfaces patterns of inner electrode paste has been printed; sintering said laminated raw sheets in reducing atmosphere or in nitrogen atmosphere after calcination; re-oxidizing in air after sintering; and covering said edges of sintered ceramic sheets with outer electrode paste and baking after re-oxidation, terminals of inner electrodes being exposed to said edges, wherein: said starting material of mixed powder comprises of a material of the composition of Sr (1-x) Ca x TiO 3 containing excess Ti to make final molecular ratio of Ti to Sr (1-x) Ca x in the range of 0.95≦Sr (1-x)- Ca x /Ti<1.00 (where x is in the range of 0.001≦x≦0.2); at least one or more kinds of the compounds selected from Nb 2 0 5 , Ta 2 0 5 , V 2 0 5 , W 2 0 5 , Dy 2 0 3 , Nd 2 0 3 , Y 2 0 3 , La 2 O 3 or Ce0 2 are added to said starting material to make their relative molar content in the range from 0.05 to 2.0%; Mn and Si are also included in said starting material to the amount of their combined relative molar content, converting into Mn0 2 and SiO 2 respectively, in the range of 0.2 to 5.0%; and Al 2 O 3 is further included in said ceramic material to make relative molar content in the range of 0.01 - 2.0%.

Claim 16

A method for manufacturing semiconductor-type laminated ceramic capacitor with a grain boundary-insulated structure comprising the steps of calcinating starting material of mixed powder in air or in nitrogen atmosphere after grinding, mixing and drying said mixed powder; forming a raw sheets by dispersing said calcinated powder in a solvent with organic binder and molding said dispersed powder, said calcinated powder being re-ground before dispersing and after calcinating; printing a pattern of inner electrode paste on the surfaces of said raw sheets, terminals of said inner electrodes being extended to each of the corresponding opposite edges of said raw sheets alternatively one by one (wherein patterns of inner electrodes are not printed on uppermost and lowermost parts of raw sheets); calcinating laminated body in air, said laminated body being formed by laminating and compressing said raw sheets on which surfaces patterns of inner electrode paste has been printed; sintering said laminated raw sheets in reducing atmosphere or in nitrogen atmosphere after calcination; re-oxidizing in air after sintering; and covering said edges of sintered ceramic sheets with outer electrode paste and baking after re-oxidation, terminals of inner electrodes being exposed to said edges, wherein: said starting material of mixed powder comprises of a material of the composition of Sr (1-x) Ca x TiO 3 containing excess Ti to make final molecular ratio of Ti to Sr (1-x) Ca x in the range of 0.95≦Sr (1-x)- Ca x /Ti<1.00 (where x is in the range of 0.001≦x≦0.2); at least one or more kinds of the compounds selected from Nb 2 0 5 , Ta 2 0 5 , V 2 0 5 , W 2 0 5 , Dy 2 0 3 , Nd 2 0 3 , Y 2 0 3 , La 2 O 3 or Ce0 2 are added to said starting material to make their relative molar content in the range from 0.05 to 2.0%; Mn and Si are also included in said starting material to the amount of their combined relative molar content, converting into Mn0 2 and SiO 2 respectively, in the range of 0.2 to 5.0%; and Al 2 O 3 is further included in said ceramic material to make relative molar content in the range of 0.01 - 2.0%.

Claim 19

A method for manufacturing semiconductor-type laminated ceramic capacitor with a grain boundary-insulated structure comprising the steps of calcinating starting material of mixed powder in air or in nitrogen atmosphere after grinding, mixing and drying said mixed powder; forming raw sheets by dispersing said calcinated powder in a solvent with organic binder and molding said dispersed powder, said calcinated powder being re-ground before dispersing and after calcinating; printing a pattern of inner electrode paste on the surfaces of said raw sheets, terminals of said inner electrodes being extended to each of the corresponding opposite edges of said raw sheet alternatively one by one (wherein patterns of inner electrodes are not printed on uppermost and lowermost parts of raw sheets); calcinating laminated body in air, said laminated body being formed by laminating and compressing said raw sheets on which surface patterns of inner electrode paste have been printed; sintering said laminated raw sheets in reducing atmosphere or in nitrogen atmosphere after calcination; re-oxidizing in air after sintering; and covering said edges of sintered ceramic sheets with outer electrode paste and baking after re-oxidation, terminals of inner electrodes being exposed to said edges, wherein: said starting material of mixed powder comprises of a material of the composition of Sr (1-x) Ca x TiO 3 containing excess Ti to make final molecular ratio of Ti to Sr (1-x) Ca x in the range of 0.95≦Sr (1-x)- Ca x /Ti<1.00 (where x is in the range of 0.001≦x≦0.2); at least one or more kinds of the compounds selected from Nb 2 0 5 , Ta 2 0 5 , V 2 0 5 , W 2 0 5 , D Y2 0 3 , Nd 2 0 3 , Y 2 0 3 , La 2 O 3 or CeO 2 are added to said starting material to make their relative molar content in the range from 0.05 to 2.0%; Mn and Si are also included in said starting material to the amount of their combined relative molar content, converting into MnO 2 and SiO 2 respectively, in the range of 0.2 to 5.0%; and NaAlO 2 is further included in said ceramic material to make relative molar content in the range of 0.05 - 4.0%.

Claim 20

A method for manufacturing semiconductor-type laminated ceramic capacitor with a grain boundary-insulated structure comprising the steps of calcinating starting material of mixed powder in air or in nitrogen atmosphere after grinding, mixing and drying said mixed powder; forming raw sheets by dispersing said calcinated powder in a solvent with organic binder and molding said dispersed powder, said calcinated powder being re-ground before dispersing and after calcinating; printing a pattern of inner electrode paste on the surfaces of said raw sheets, terminals of said inner electrodes being extended to each of the corresponding opposite edges of said raw sheet alternatively one by one (wherein patterns of inner electrodes are not printed on uppermost and lowermost parts of raw sheets); calcinating laminated body in air, said laminated body being formed by laminating and compressing said raw sheets on which surface patterns of inner electrode paste have been printed; sintering said laminated raw sheets in reducing atmosphere or in nitrogen atmosphere after calcination; re-oxidizing in air after sintering; and covering said edges of sintered ceramic sheets with outer electrode paste and baking after re-oxidation, terminals of inner electrodes being exposed to said edges, wherein: said starting material of mixed powder comprises of a material of the composition of Sr (1-x) Ca x TiO 3 containing excess Ti to make final molecular ratio of Ti to Sr (1-x) Ca x in the range of 0.95≦Sr (1-x)- Ca x /Ti<1.00 (where x is in the range of 0.001≦x≦0.2); at least one or more kinds of the compounds selected from Nb 2 0 5 , Ta 2 0 5 , V 2 0 5 , W 2 0 5 , D Y2 0 3 , Nd 2 0 3 , Y 2 0 3 , La 2 O 3 or CeO 2 are added to said starting material to make their relative molar content in the range from 0.05 to 2.0%; Mn and Si are also included in said starting material to the amount of their combined relative molar content, converting into MnO 2 and SiO 2 respectively, in the range of 0.2 to 5.0%; and NaAlO 2 is further included in said ceramic material to make relative molar content in the range of 0.05 - 4.0%.

Claim 23

A method for manufacturing semiconductor-type laminated ceramic capacitor with a grain boundary-structure comprising the steps of: calcinating starting material of mixed powder in air or in nitrogen atmosphere after grinding, mixing and drying said mixed powder; forming a raw sheets by dispersing said calcinated powder in a solvent with organic binder and molding said dispersed powder, said calcinated powder being re-ground before dispersing and after calcinating; printing a pattern of inner electrode paste on the surface of said raw sheets, terminals of said inner electrodes being extended to each of the corresponding opposite edges of said raw sheets alternatively one by one (wherein patterns of inner electrodes are not printed on uppermost and lowermost parts of raw sheets); calcinating laminated body in air, said laminated body being formed by laminating and compressing said raw sheets on which surfaces patterns of inner electrode paste has been printed; sintering said laminated raw sheets in reducing atmosphere or in nitrogen atmosphere after calcination; re-oxidizing in air after sintering; and covering said edges of sintered ceramic sheets with outer electrode paste and baking after re-oxidation, terminals of inner electrodes being exposed to said edges, wherein: said starting material of mixed powder comprises of a material of the composition of Sr (1-x) Ca x TiO 3 containing excess Ti to make final molecular ratio of Ti to Sr (1-x) Ca x in the range of 0.95≦Sr (1-x) Ca x /Ti<1.00 (where x is in the range of 0.001≦x≦0.2); at least one or more kinds of the compounds selected from Nb 2 0s, Ta 2 0s, V 2 0 5 , W 2 0 5 , D Y2 0 3 , Nd 2 0 3 , Y 2 0 3 , La 2 0 3 or Ce0 2 are added to said starting material to make their relative molar content in the range from 0.05 to 2.0%; Mn and Si are also included in said starting material to the amount of their combined relative molar content, converting into Mn0 2 and Si0 2 respectively, in the range of 0.2 to 5.0%; and Li 2 SiO 3 is further included in said ceramic material to make relative molar content in the range of 0.05 - 2.0%.

Claim 24

A method for manufacturing semiconductor-type laminated ceramic capacitor with a grain boundary-structure comprising the steps of: calcinating starting material of mixed powder in air or in nitrogen atmosphere after grinding, mixing and drying said mixed powder; forming a raw sheets by dispersing said calcinated powder in a solvent with organic binder and molding said dispersed powder, said calcinated powder being re-ground before dispersing and after calcinating; printing a pattern of inner electrode paste on the surface of said raw sheets, terminals of said inner electrodes being extended to each of the corresponding opposite edges of said raw sheets alternatively one by one (wherein patterns of inner electrodes are not printed on uppermost and lowermost parts of raw sheets); calcinating laminated body in air, said laminated body being formed by laminating and compressing said raw sheets on which surfaces patterns of inner electrode paste has been printed; sintering said laminated raw sheets in reducing atmosphere or in nitrogen atmosphere after calcination; re-oxidizing in air after sintering; and covering said edges of sintered ceramic sheets with outer electrode paste and baking after re-oxidation, terminals of inner electrodes being exposed to said edges, wherein: said starting material of mixed powder comprises of a material of the composition of Sr (1-x) Ca x TiO 3 containing excess Ti to make final molecular ratio of Ti to Sr (1-x) Ca x in the range of 0.95≦Sr (1-x) Ca x /Ti<1.00 (where x is in the range of 0.001≦x≦0.2); at least one or more kinds of the compounds selected from Nb 2 0s, Ta 2 0s, V 2 0 5 , W 2 0 5 , D Y2 0 3 , Nd 2 0 3 , Y 2 0 3 , La 2 0 3 or Ce0 2 are added to said starting material to make their relative molar content in the range from 0.05 to 2.0%; Mn and Si are also included in said starting material to the amount of their combined relative molar content, converting into Mn0 2 and Si0 2 respectively, in the range of 0.2 to 5.0%; and Li 2 SiO 3 is further included in said ceramic material to make relative molar content in the range of 0.05 - 2.0%.

Claim 27

A method for manufacturing a semiconductor-type laminated ceramic capacitor with a grain boundary-insulated structure comprising the steps of: calcinating starting material of mixed powder in air or in nitrogen atmosphere after grinding, mixing and drying said mixed powder; forming raw sheets by dispersing said calcinated powder in a solvent with organic binder and molding said dispersed powder, said calcinated powder being re-ground before dispersing and after calcinating; printing a pattern of inner electrode paste on the surface of said raw sheets, terminals of said inner electrodes being extended to each of the corresponding opposite edges of said raw sheets alternatively one by one (wherein patterns of inner electrodes are not printed on uppermost and lowermost parts of raw sheets); calcinating laminated body in air, said laminated body being formed by laminating and compressing said raw sheets on which surfaces patterns of inner electrode paste has been printed; sintering said laminated raw sheets in reducing atmosphere or in nitrogen atmosphere after calcination; re-oxidizing in air after sintering; and covering said edges of sintered ceramic sheets with outer electrode paste and baking after re-oxidation, terminals of inner electrodes being exposed to said edges, wherein: said starting material of mixed powder comprises of a material of the composition of Sr (1-x) Ca x TiO 3 containing excess Ti to make final molecular ratio of Ti to Sr (1-x )Ca x in the range of 0.95≦Sr (1-x)- Ca,/Ti<1.00 (where x is in the range of 0.001≦x≦0.2); at least one or more kinds of the compounds selected from Nb 2 0 3 , Ta 2 0 5 , V 2 0 5 , W 2 0 5 , D Y2 0 3 , Nd 2 0 3 , Y 2 0 3 , La 2 0 3 or Ce0 2 are added to said starting material to make their relative molar content in the range from 0.05 to 2.0%; Mn and Si are also included in said starting material to the amount of their combined relative molar content, converting into Mn0 2 and Si0 2 respectively, in the range of 0.2 to 5.0%; and LiAI0 2 is further included in said ceramic material to make relative molar content in the range of 0.05 - 4.0%.

Claim 28

A method for manufacturing a semiconductor-type laminated ceramic capacitor with a grain boundary-insulated structure comprising the steps of: calcinating starting material of mixed powder in air or in nitrogen atmosphere after grinding, mixing and drying said mixed powder; forming raw sheets by dispersing said calcinated powder in a solvent with organic binder and molding said dispersed powder, said calcinated powder being re-ground before dispersing and after calcinating; printing a pattern of inner electrode paste on the surface of said raw sheets, terminals of said inner electrodes being extended to each of the corresponding opposite edges of said raw sheets alternatively one by one (wherein patterns of inner electrodes are not printed on uppermost and lowermost parts of raw sheets); calcinating laminated body in air, said laminated body being formed by laminating and compressing said raw sheets on which surfaces patterns of inner electrode paste has been printed; sintering said laminated raw sheets in reducing atmosphere or in nitrogen atmosphere after calcination; re-oxidizing in air after sintering; and covering said edges of sintered ceramic sheets with outer electrode paste and baking after re-oxidation, terminals of inner electrodes being exposed to said edges, wherein: said starting material of mixed powder comprises of a material of the composition of Sr (1-x) Ca x TiO 3 containing excess Ti to make final molecular ratio of Ti to Sr (1-x )Ca x in the range of 0.95≦Sr (1-x)- Ca,/Ti<1.00 (where x is in the range of 0.001≦x≦0.2); at least one or more kinds of the compounds selected from Nb 2 0 3 , Ta 2 0 5 , V 2 0 5 , W 2 0 5 , D Y2 0 3 , Nd 2 0 3 , Y 2 0 3 , La 2 0 3 or Ce0 2 are added to said starting material to make their relative molar content in the range from 0.05 to 2.0%; Mn and Si are also included in said starting material to the amount of their combined relative molar content, converting into Mn0 2 and Si0 2 respectively, in the range of 0.2 to 5.0%; and LiAI0 2 is further included in said ceramic material to make relative molar content in the range of 0.05 - 4.0%.

Claim 31

A method for manufacturing semiconductor-type laminated ceramic capacitor with a grain boundary-insulated structure comprising the steps of: calcinating starting material of mixed powder in air or in nitrogen atmosphere after grinding, mixing and drying said mixed powder; forming raw sheets by dispersing said calcinated powder in a solvent with organic binder and molding said dispersed powder, said calcinated powder being re-ground before dispersing and after calcinating; printing a pattern of inner electrode paste on the surface of said raw sheets, terminals of said inner electrodes being extended to each of the corresponding opposite edges of said raw sheets alternatively one by one (wherein patterns of inner electrodes are not printed on uppermost and lowermost parts of raw sheets); calcinating laminated body in air, said laminated body being formed by laminating and compressing said raw sheets on which surfaces patterns of inner electrode paste has been printed; sintering said laminated raw sheets in a reducing atmosphere or in a nitrogen atmosphere after calcination; re-oxidizing in air after sintering; and covering said edges of sintered ceramic sheets with outer electrode paste and baking after re-oxidation, terminals of inner electrodes being exposed to said edges, wherein: said starting material of mixed powder comprises of a material of the composition of Sr (1-x) Ca x TiO 3 containing excess Ti to make final molecular ratio of Ti to Sr (1-x) Ca x in the range of 0.95≦Sr (1-x)- Ca x /Ti<1.00 (where x is in the range of 0.001≦x≦0.2); at least one or more kinds of the compounds selected from Nb 2 0 5 , Ta 2 0 5 , V 2 0 5 , W 2 0 5 , Dy 2 0 3 , Nd 2 0 , Y 2 0 3 , La 2 0 3 or Ce0 2 are added to said starting material to make their relative molar content in the range from 0.05 to 2.0%; Mn and Si are also included in said starting material to the amount of their combined relative molar content, converting into Mn0 2 and Si0 2 respectively, in the range of 0.2 to 5.0%; and Na 2 Si0 3 and A1 2 0 3 are further included in said ceramic material to make their relative molar contents in the range of 0.05 - 2.0% and 0.05 - 2.0%, respectively.

Claim 32

A method for manufacturing semiconductor-type laminated ceramic capacitor with a grain boundary-insulated structure comprising the steps of: calcinating starting material of mixed powder in air or in nitrogen atmosphere after grinding, mixing and drying said mixed powder; forming raw sheets by dispersing said calcinated powder in a solvent with organic binder and molding said dispersed powder, said calcinated powder being re-ground before dispersing and after calcinating; printing a pattern of inner electrode paste on the surface of said raw sheets, terminals of said inner electrodes being extended to each of the corresponding opposite edges of said raw sheets alternatively one by one (wherein patterns of inner electrodes are not printed on uppermost and lowermost parts of raw sheets); calcinating laminated body in air, said laminated body being formed by laminating and compressing said raw sheets on which surfaces patterns of inner electrode paste has been printed; sintering said laminated raw sheets in a reducing atmosphere or in a nitrogen atmosphere after calcination; re-oxidizing in air after sintering; and covering said edges of sintered ceramic sheets with outer electrode paste and baking after re-oxidation, terminals of inner electrodes being exposed to said edges, wherein: said starting material of mixed powder comprises of a material of the composition of Sr (1-x) Ca x TiO 3 containing excess Ti to make final molecular ratio of Ti to Sr (1-x) Ca x in the range of 0.95≦Sr (1-x)- Ca x /Ti<1.00 (where x is in the range of 0.001≦x≦0.2); at least one or more kinds of the compounds selected from Nb 2 0 5 , Ta 2 0 5 , V 2 0 5 , W 2 0 5 , Dy 2 0 3 , Nd 2 0 , Y 2 0 3 , La 2 0 3 or Ce0 2 are added to said starting material to make their relative molar content in the range from 0.05 to 2.0%; Mn and Si are also included in said starting material to the amount of their combined relative molar content, converting into Mn0 2 and Si0 2 respectively, in the range of 0.2 to 5.0%; and Na 2 Si0 3 and A1 2 0 3 are further included in said ceramic material to make their relative molar contents in the range of 0.05 - 2.0% and 0.05 - 2.0%, respectively.

Claim 35

A method for manufacturing semiconductor-type laminated ceramic capacitor with a grain boundary-insulated structure comprising the steps of: calcinating starting material of mixed powder in air or in nitrogen atmosphere after grinding, mixing and drying said mixed powder; forming raw sheets by dispersing said calcinated powder in a solvent with organic binder and molding said dispersed powder, said calcinated powder being re-ground before dispersing and after calcinating; printing a pattern of inner electrode paste on the surface of said raw sheets, terminals of said inner electrodes being extended to each of the corresponding opposite edges of said raw sheets alternatively one by one (wherein patterns of inner electrodes are not printed on uppermost and lowermost parts of raw sheets); calcinating laminated body in air, said laminated body being formed by laminating and compressing said raw sheets on which surfaces patterns of inner electrode paste has been printed; sintering said laminated raw sheets in reducing atmosphere or in nitrogen atmosphere after calcination; re-oxidizing in air after sintering; and covering said edges of sintered ceramic sheets with outer electrode paste and baking after re-oxidation, terminals of inner electrodes being exposed to said edges, wherein: said starting material of mixed powder comprises of a material of the composition of Sr (1-x) Ca x TiO 3 containing excess Ti to make final molecular ratio of Ti to Sr (1-x) Ca x in the range of 0.95≦Sr (1-x)- Ca x /Ti<1.00 (where x is in the range of 0.001≦x≦0.2); at least one or more kinds of the compounds selected from Nb 2 O 5 , Ta 2 O 5 , V 2 O 5 , W 2 O 5 , D Y2 0 3 , Nd 2 O 3 , Y 2 0 3 , La 2 O 3 or Ce0 2 are added to said starting material to make their relative molar content in the range from 0.05 to 2.0%; Mn and Si are also included in said starting material to the amount of their combined relative molar content, converting into Mn0 2 and Si0 2 respectively, in the range of 0.2 to 5.0%; and Li 2 SiO 3 and Al 2 O 3 are further included in said ceramic material to make their relative molar contents in the range of 0.05 - 2.0% and 0.05 - 2.0%, respectively.

Claim 36

A method for manufacturing semiconductor-type laminated ceramic capacitor with a grain boundary-insulated structure comprising the steps of: calcinating starting material of mixed powder in air or in nitrogen atmosphere after grinding, mixing and drying said mixed powder; forming raw sheets by dispersing said calcinated powder in a solvent with organic binder and molding said dispersed powder, said calcinated powder being re-ground before dispersing and after calcinating; printing a pattern of inner electrode paste on the surface of said raw sheets, terminals of said inner electrodes being extended to each of the corresponding opposite edges of said raw sheets alternatively one by one (wherein patterns of inner electrodes are not printed on uppermost and lowermost parts of raw sheets); calcinating laminated body in air, said laminated body being formed by laminating and compressing said raw sheets on which surfaces patterns of inner electrode paste has been printed; sintering said laminated raw sheets in reducing atmosphere or in nitrogen atmosphere after calcination; re-oxidizing in air after sintering; and covering said edges of sintered ceramic sheets with outer electrode paste and baking after re-oxidation, terminals of inner electrodes being exposed to said edges, wherein: said starting material of mixed powder comprises of a material of the composition of Sr (1-x) Ca x TiO 3 containing excess Ti to make final molecular ratio of Ti to Sr (1-x) Ca x in the range of 0.95≦Sr (1-x)- Ca x /Ti<1.00 (where x is in the range of 0.001≦x≦0.2); at least one or more kinds of the compounds selected from Nb 2 O 5 , Ta 2 O 5 , V 2 O 5 , W 2 O 5 , D Y2 0 3 , Nd 2 O 3 , Y 2 0 3 , La 2 O 3 or Ce0 2 are added to said starting material to make their relative molar content in the range from 0.05 to 2.0%; Mn and Si are also included in said starting material to the amount of their combined relative molar content, converting into Mn0 2 and Si0 2 respectively, in the range of 0.2 to 5.0%; and Li 2 SiO 3 and Al 2 O 3 are further included in said ceramic material to make their relative molar contents in the range of 0.05 - 2.0% and 0.05 - 2.0%, respectively.