Patent EP0426496A2 successfully refreshed from Google Patents.
EP0426496A2
Expired / Lapsed
EP
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Planarizing surfaces of interconnect substrates by diamond turning
Assignee: 3M Co
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Filing: 1990-11-02
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Granted: —
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Expires: 2010-11-02
Abstract
Abstract Each of the individual metal-polymer composite layers of an electronic interconnect such as a multi-chip substrate (MCS) can be made to have uniform thickness by diamond turning both the surface of a body on which the MCS is to be built and then successively diamond turning the face of each metal-polymer composite layer that is built on that body. Apparatus useful in large-scale production of MCSs, as illustrated in Fig. 2, includes a long flexible carrier that can travel in short steps to successively position a series of metal-polymer composites to be diamond turned.
Inventors
- 👤 Richard J. C/O Minnesota Mining & Man.Co Webb
- 👤 Timothy L. C/O Minnesota Mining & Hoopman
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 02:42
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/70; H10P72/74; H10P72/7402; B; B24; B24B; B24B7/00; B24B7/06; B24B7/20; B24B7/22; B24B7/228; H05; H05K; H05K3/00; H05K3/22; H05K3/26; H10W; H10W99/00; H05K2203/00; H05K2203/01; H05K2203/0195; H05K2203/02; H05K2203/025; H05K2203/15; H05K2203/1509; H10P72/7416
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
73 words
Method of producing an electronic interconnect substrate using a body that has a machinable surface, said method comprising the sequential steps of: a) diamond turning the body at said machinable surface to provide a planar surface, b) building on said planar surface a metal-polymer composite incorporating microelectronic circuitry, and c) diamond turning said metal-polymer composite to form a face parallel to said planar surface of the body while leaving vias at said face.
Claim 2
Dependent Claim
73 words
Method of producing an electronic interconnect substrate using a body that has a machinable surface, said method comprising the sequential steps of: a) diamond turning the body at said machinable surface to provide a planar surface, b) building on said planar surface a metal-polymer composite incorporating microelectronic circuitry, and c) diamond turning said metal-polymer composite to form a face parallel to said planar surface of the body while leaving vias at said face.
Claim 3
Dependent Claim
11 words
Method as defined in claim 1 wherein the vias are pillars.
Claim 4
Dependent Claim
68 words
Method as defined in Claim 1 wherein step c) is followed by the sequential steps of: d) building on said face a second metal-polymer composite incorporating microelectronic circuitry that is interconnected to vias at said face, and e) diamond turning said second metal polymer composite to form a second face that also is parallel to said planar surface of the body while leaving vias at said second face.
Claim 5
Dependent Claim
29 words
Method as defined in claim 3 wherein steps d) and e) are sequentially repeated until a multi-chip substrate is produced that has the desired number of interconnected microelectronic circuits.
Claim 6
Dependent Claim
43 words
Method as defined in claim 4 wherein step b) provides a first metal-polymer composite that serves as a ground layer and steps d) and e) are sequentially repeated to provide second, third, and fourth metal-polymer composites that provide X-signal, Y-signal, and power layers.
Claim 7
Dependent Claim
12 words
Method as defined in claim 1 wherein said body comprises a base.
Claim 8
Dependent Claim
26 words
Method as defined in claim 6 wherein said machinable surface of said base is provided by a material selected from a polymer and a nonferrous metal.
Claim 9
Dependent Claim
26 words
Method as defined in claim 7 wherein said base comprises a laminate of said material and a durable substance selected from ceramic, silicon, and ferrous metal.
Claim 10
Dependent Claim
20 words
Method as defined in claim 8 wherein said laminate comprises a ceramic wafer bearing a layer of a machinable polymer.
Claim 11
Dependent Claim
13 words
Method as defined in claim 9 wherein said machinable polymer is a polyimide.
Claim 12
Dependent Claim
28 words
Method as defined in claim 1 wherein said body comprises a mount, and prior to step a) is the step of diamond turning a surface of the mount.
Claim 13
Dependent Claim
21 words
Method as defined in claim 11 wherein the metal-polymer composite is built in step b) to be removable from the mount.
Claim 14
Dependent Claim
53 words
Method as defined in claim 1 wherein subsequent to the step of diamond turning a surface of the mount and prior to step b) is the step of mounting on the mount a base for the metal-polymer composite to be built in step b), which base has flat surfaces parallel to each other.
Claim 15
Dependent Claim
20 words
Method as defined in claim 1 wherein said base comprises a durable substance selected from ceramic, silicon, and ferrous metal.
Claim 16
Dependent Claim
136 words
Method of producing a plurality of electronic interconnect substrates using a step-and-repeat process, said method comprising the steps of: a) diamond turning a chuck to provide a planar surface, b) building a series of metal-polymer composites on a long flexible carrier, c) advancing the carrier until one of said composites is centered over the planar surface of the chuck, d) Securing to the diamond-turned surface of the chuck the portion of the carrier underlying said one composite, e) diamond turning the surface of said one composite while advancing the chuck, f) releasing the carrier from the chuck, g) retracting the chuck, h) securing the portion of the carrier underlying the next composite to the diamond-turned surface of the chuck, and i) repeating steps e) through h) until all of the secured composites have been diamond turned.
Claim 17
Dependent Claim
136 words
Method of producing a plurality of electronic interconnect substrates using a step-and-repeat process, said method comprising the steps of: a) diamond turning a chuck to provide a planar surface, b) building a series of metal-polymer composites on a long flexible carrier, c) advancing the carrier until one of said composites is centered over the planar surface of the chuck, d) Securing to the diamond-turned surface of the chuck the portion of the carrier underlying said one composite, e) diamond turning the surface of said one composite while advancing the chuck, f) releasing the carrier from the chuck, g) retracting the chuck, h) securing the portion of the carrier underlying the next composite to the diamond-turned surface of the chuck, and i) repeating steps e) through h) until all of the secured composites have been diamond turned.
Claim 18
Dependent Claim
27 words
Method as defined in claim 15 wherein each of steps d) and h) comprises securing the carrier to the chuck by applying a vacuum to the chuck.
Claim 19
Dependent Claim
32 words
An electronic interconnect substrate comprising a plurality of layers of metal-polymer composite incorporating microelectronic circuitry, layers of which have been diamond turned by the method of claim 1 to afford uniform thicknesses.
Claim 20
Dependent Claim
120 words
Apparatus for planarizing surfaces of each of a series of electronic interconnect substrates, each of which has a composite metal-polymer face, said apparatus comprising a) a diamond turning tool, b) a body having a machinable surface, c) means for diamond turning the body with said tool to give said machinable surface a planar surface, d) a flexible carrier, e) means for securing a series of interconnect substrates to one face of the carrier, f) means for stepwise advancing said carrier to position each of said interconnect substrates sequentially over said body, and g) means for temporarily securing to said body the portion of the carrier underlying the positioned composite to permit diamond turning of the exposed face of said composite.
Claim 21
Dependent Claim
120 words
Apparatus for planarizing surfaces of each of a series of electronic interconnect substrates, each of which has a composite metal-polymer face, said apparatus comprising a) a diamond turning tool, b) a body having a machinable surface, c) means for diamond turning the body with said tool to give said machinable surface a planar surface, d) a flexible carrier, e) means for securing a series of interconnect substrates to one face of the carrier, f) means for stepwise advancing said carrier to position each of said interconnect substrates sequentially over said body, and g) means for temporarily securing to said body the portion of the carrier underlying the positioned composite to permit diamond turning of the exposed face of said composite.
Claim 22
Dependent Claim
13 words
Apparatus as defined in claim 18 wherein said body comprises a vacuum chuck.
References Cited (Backward Citations)
No citation records indexed.
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