Patent US4157657A successfully refreshed from Google Patents.
Patent EP0419147A2 successfully refreshed from Google Patents.
← Back to Patent Explorer
EP0419147A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Resist composition

Assignee: Zeon Corp
•
Filing: 1990-09-14
•
Granted: —
•
Expires: 2010-09-14
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract Disclosed herein is a resist composition comprising an hydrogenated alkali-soluble phenolic resin, a compound cleavable upon exposure to active rays to form an acid, and a compound crosslinking in the presence of an acid. The composition is suitable for use as a negative resist for minute processing of semiconductor elements.

Inventors

  • 👤 Masayuki Oie
  • 👤 Shoji Kawata
  • 👤 Takamasa Yamada

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-01 22:02
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/0045

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 33 words
A resist composition comprising: (A) a hydrogenated alkali-soluble phenolic resin; (B) a compound capable of generating an acid on irradiation; and (C) a compound capable of cross-linking in the presence of the acid.
Claim 2
Dependent Claim 33 words
A resist composition comprising: (A) a hydrogenated alkali-soluble phenolic resin; (B) a compound capable of generating an acid on irradiation; and (C) a compound capable of cross-linking in the presence of the acid.
Claim 3
Dependent Claim 24 words
A composition as claimed in claim 1, wherein the resin is a phenol-aldehyde condensate, a phenol-ketone condensate, a vinylphenolic polymer or an isopropenylphenolic polymer.
Claim 4
Dependent Claim 21 words
A composition as claimed in claim 1 or claim 2, wherein the degree of hydrogenation of the resin (A) is 0.1-70%.
Claim 5
Dependent Claim 17 words
A composition as claimed in any preceding claim, wherein the acid is a Brønsted or Lewis acid.
Claim 6
Dependent Claim 30 words
A composition as claimed in any preceding claim, wherein the compound (B) is an onium salt, a halogenated organic compound, a halogenated organic compound/organic metal mixture or an o-quinonediazide compound.
Claim 7
Dependent Claim 27 words
A composition as claimed in any preceding claim, which comprises 0.1-50 parts by weight of the compound (B) per 100 parts by weight of the resin (A).
Claim 8
Dependent Claim 24 words
A composition as claimed in any preceding claim, wherein the compound (C) contains a C-O-R group, wherein R is an alkyl or epoxy group.
Claim 9
Dependent Claim 70 words
A composition as claimed in claim 7, wherein either R is alkyl and the compound (C) is selected from alkyl-etherified melamine resins, alkyl-etherified benzoguanamine resins, alkyl-etherified urea resins and alkyl ether group-containing phenolic compounds, or R is an epoxy group and the compound (C) is selected from glycidyl ether epoxy resins, alicyclic aliphatic epoxy resins, glycidyl ester epoxy resins, glycidyl amine epoxy resins, heterocyclic epoxy resins and polyfunctional epoxy resins.
Claim 10
Dependent Claim 27 words
A composition as claimed in any preceding claim, which comprises 0.2-50 parts by weight of the compound (C) per 100 parts by weight of the resin (A).
Claim 11
Dependent Claim 20 words
Use of a composition as claimed in any preceding claim, as a negative resist in the processing of semiconductor elements.

References Cited (Backward Citations)

No citation records indexed.

USPTO Annuity & Maintenance Windows

Maintenance schedule is calculated for granted US utility patents.

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag