EP0419147A2
Expired / Lapsed
EP
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Resist composition
Assignee: Zeon Corp
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Filing: 1990-09-14
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Granted: —
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Expires: 2010-09-14
Abstract
Abstract Disclosed herein is a resist composition comprising an hydrogenated alkali-soluble phenolic resin, a compound cleavable upon exposure to active rays to form an acid, and a compound crosslinking in the presence of an acid. The composition is suitable for use as a negative resist for minute processing of semiconductor elements.
Inventors
- 👤 Masayuki Oie
- 👤 Shoji Kawata
- 👤 Takamasa Yamada
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-01 19:53
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/0045
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
33 words
A resist composition comprising: (A) a hydrogenated alkali-soluble phenolic resin; (B) a compound capable of generating an acid on irradiation; and (C) a compound capable of cross-linking in the presence of the acid.
Claim 2
Dependent Claim
33 words
A resist composition comprising: (A) a hydrogenated alkali-soluble phenolic resin; (B) a compound capable of generating an acid on irradiation; and (C) a compound capable of cross-linking in the presence of the acid.
Claim 3
Dependent Claim
24 words
A composition as claimed in claim 1, wherein the resin is a phenol-aldehyde condensate, a phenol-ketone condensate, a vinylphenolic polymer or an isopropenylphenolic polymer.
Claim 4
Dependent Claim
21 words
A composition as claimed in claim 1 or claim 2, wherein the degree of hydrogenation of the resin (A) is 0.1-70%.
Claim 5
Dependent Claim
17 words
A composition as claimed in any preceding claim, wherein the acid is a Brønsted or Lewis acid.
Claim 6
Dependent Claim
30 words
A composition as claimed in any preceding claim, wherein the compound (B) is an onium salt, a halogenated organic compound, a halogenated organic compound/organic metal mixture or an o-quinonediazide compound.
Claim 7
Dependent Claim
27 words
A composition as claimed in any preceding claim, which comprises 0.1-50 parts by weight of the compound (B) per 100 parts by weight of the resin (A).
Claim 8
Dependent Claim
24 words
A composition as claimed in any preceding claim, wherein the compound (C) contains a C-O-R group, wherein R is an alkyl or epoxy group.
Claim 9
Dependent Claim
70 words
A composition as claimed in claim 7, wherein either R is alkyl and the compound (C) is selected from alkyl-etherified melamine resins, alkyl-etherified benzoguanamine resins, alkyl-etherified urea resins and alkyl ether group-containing phenolic compounds, or R is an epoxy group and the compound (C) is selected from glycidyl ether epoxy resins, alicyclic aliphatic epoxy resins, glycidyl ester epoxy resins, glycidyl amine epoxy resins, heterocyclic epoxy resins and polyfunctional epoxy resins.
Claim 10
Dependent Claim
27 words
A composition as claimed in any preceding claim, which comprises 0.2-50 parts by weight of the compound (C) per 100 parts by weight of the resin (A).
Claim 11
Dependent Claim
20 words
Use of a composition as claimed in any preceding claim, as a negative resist in the processing of semiconductor elements.
References Cited (Backward Citations)
No citation records indexed.
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