Patent US1578209A successfully refreshed from Google Patents.
Patent EP0413109A2 successfully refreshed from Google Patents.
EP0413109A2
Expired / Lapsed
EP
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Fabrication of printed circuit boards using conducting polymer
Assignee: International Business Machines Corp
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Filing: 1990-06-21
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Granted: —
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Expires: 2010-06-21
Abstract
Abstract A process for fabricating a printed circuit board concerns the use of a soluble, air-stable conducting polymer (52) applied to plated through holes, blind holes or vias or to a predetermined portion of the printed circuit board surface for selectively metal plating on the polymer without the necessity of either an electroless plating bath or the use of precious metal seeds. A preferred conducting polymer (52) is polyaniline. A preferred metal plating is preferably copper or a noble metal such as palladium or silver.
Inventors
- 👤 Marie Angelopoulos
- 👤 Wu-Song Huang
- 👤 Jae M. Park
- 👤 James R. White
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 14:19
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/188; C; C08; C08G; C08G73/00; C08G73/02; C08G73/026; C08G73/0266; C25; C25D; C25D5/00; C25D5/54; C25D5/56; H05K3/40; H05K3/42; H05K3/423; H05K3/424; H05K2201/00; H05K2201/03; H05K2201/032; H05K2201/0329; H05K3/108; H05K3/425; H05K3/426
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
47 words
A process for fabricating a printed circuit board comprising the steps of: providing a substrate (50); applying a soluble air-stable conducting polymer (52) to a predetermined portion of said substrate, and electroplating a metal film (54) from a conventional aqueous electroplating solution onto said conducting polymer (52).
Claim 2
Dependent Claim
47 words
A process for fabricating a printed circuit board comprising the steps of: providing a substrate (50); applying a soluble air-stable conducting polymer (52) to a predetermined portion of said substrate, and electroplating a metal film (54) from a conventional aqueous electroplating solution onto said conducting polymer (52).
Claim 3
Dependent Claim
36 words
A process as set forth in claim 1, further comprising the step of drilling and cleaning at least one hole in said substrate (50) and applying said conducting polymer (52) to said at least one hole.
Claim 4
Dependent Claim
38 words
A process as set forth in claims 1 or 2 further comprising the steps of: applying, exposing and developing a photoresist on said conducting polymer (52); stripping said photoresist after said electroplating, and etching said conducting polymer (52).
Claim 5
Dependent Claim
61 words
A process as set forth in anyone of the preceding claims wherein the conducting polymer (52) is selected from the group consisting of substituted and unsubstituted polyaniline, substituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenevinylene, substituted and unsubstituted polyfuranevinylene, substituted and unsubstituted polyprrolevinylene, substituted and unsubstituted polythiophenes, polyazines, substituted polyfuranes, substituted polyselenophenes, substituted and unsubstituted poly-p-phenylene sulfides and polyacetylene formed from soluble percursors.
Claim 6
Dependent Claim
62 words
A process as set forth in anyone of the preceding claims, wherein the metal film (54) is a film comprising a metal having a redox potential which is more positive than the redox potential of the conducting polymer (52), said metal film (54) being preferably a noble metal film selected from the group consisting of silver and palladium or a copper film.
Claim 7
Dependent Claim
25 words
A process as set forth in anyone of the preceding claims wherein said predetermined portion of said substrate (50) is at least one circuit line.
Claim 8
Dependent Claim
26 words
A process as set forth in anyone of the preceding claims wherein said applying a conducting polymer (52) is by casting, painting, spin-coating or dip coating.
Claim 9
Dependent Claim
61 words
A process for fabricating a printed circuit board comprising the steps of: providing a substrate (50); applying a conducting polymer (52) to said substrate; selectively exposing a predetermined region of the polymer (52) to a source of energy for rendering said predetermined region conductive, and electroplating a metal film (54) from a conventional aqueous electroplating solution onto said conductive predetermined region.
Claim 10
Dependent Claim
61 words
A process for fabricating a printed circuit board comprising the steps of: providing a substrate (50); applying a conducting polymer (52) to said substrate; selectively exposing a predetermined region of the polymer (52) to a source of energy for rendering said predetermined region conductive, and electroplating a metal film (54) from a conventional aqueous electroplating solution onto said conductive predetermined region.
Claim 11
Dependent Claim
27 words
A process as set forth in claim 8 wherein said source of energy is selected from the group consisting of electromagnetic radiation, an electron beam and heat.
Claim 12
Dependent Claim
18 words
A process as set forth in claim 8 wherein said predetermined portion is at least one circuit line.
References Cited (Backward Citations)
No citation records indexed.
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