Patent EP0412528A2 successfully refreshed from Google Patents.
EP0412528A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Electronic circuit package and production thereof
Assignee: Fujitsu Ltd
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Filing: 1990-08-08
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Granted: —
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Expires: 2010-08-08
Abstract
Abstract An electronic circuit package which includes first (14) and second (16) conductive metal members and a circuit board (12) held between the first and second metal members (14,16) and having a cutout in which an electronic circuit part is accommodated and a process of producing such electronic circuit package are disclosed. With the electronic circuit package, deterioration of a high speed characteristic of an electronic circuit part accommodated in the package is minimized, and accordingly, when the electronic circuit package is applied to an IC for very high speed optical communications for use with an optical repeater or the like, a very high speed system can be realized. By assembling the components in accordance with a predetermined order, facility in process of production and improvement in reliability of products are attained.
Inventors
- 👤 Yasunari Arai
- 👤 Hiroshi Hamano
- 👤 Izumi Amemiya
- 👤 Takuji Yamamoto
- 👤 Takeshi Ihara
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 15:56
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/4201; G02B6/4204; G02B6/4214; H; H10; H10W; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547
Claims Analysis
Total Claims: 40
Claim 1
Independent Claim
35 words
An electronic circuit package, comprising: first and second conductive metal members; and a circuit board disposed between said first and second metal members and having a cutout in which an electronic circuit part is accommodated.
Claim 2
Dependent Claim
35 words
An electronic circuit package, comprising: first and second conductive metal members; and a circuit board disposed between said first and second metal members and having a cutout in which an electronic circuit part is accommodated.
Claim 3
Dependent Claim
66 words
An electronic circuit package according to claim 1, wherein said circuit board includes a first insulator layer having conductor patterns formed on a surface thereof, and a second insulator layer adhered or stuck to said first insulator layer in such a manner as to cover over said conductor patterns except edge portions of an outer periphery of said circuit board and edge portions of said cutout.
Claim 4
Dependent Claim
55 words
An electronic circuit package according to claim 2, wherein portions of said conductor patterns on said edge portions of said cutout are connected to said electronic circuit part accommodated in said cutout, and portions of said conductor patterns on said edge portions of said outer periphery of said circuit board are connected to package leads.
Claim 5
Dependent Claim
18 words
An electronic circuit package according to claim 1, wherein said circuit board has a plurality of such cutouts.
Claim 6
Dependent Claim
48 words
An electronic circuit package according to claim 4, wherein said first metal member has openings at locations corresponding to said cutouts of said circuit board, and said second metal member has spaces at locations corresponding to said cutouts, to which such electronic circuit parts are to be secured.
Claim 7
Dependent Claim
23 words
An electronic circuit package according to claim 5, wherein each of said openings is covered with a lid member made of a metal.
Claim 8
Dependent Claim
66 words
An electronic circuit package according to claim 6, wherein said circuit board includes a first insulator layer having conductor patterns formed on a surface thereof, and a second insulator layer adhered or stuck to said first insulator layer in such a manner as to cover over said conductor patterns except edge portions of an outer periphery of said circuit board and edge portions of said cutouts.
Claim 9
Dependent Claim
106 words
An electronic circuit package according to claim 7, wherein said conductor patterns include signal strip lines having end portions exposed on a pair of opposing edge portions of each of said cutouts, DC or low speed lines having end portions exposed on edge portions of each of said cutouts opposing to said edge portions of said outer periphery of said circuit board, and ground patterns formed in areas other than areas in which said signal strip lines and DC or low speed lines are formed such that said ground patterns do not contact with any of said signal strip lines and DC or low speed lines.
Claim 10
Dependent Claim
107 words
An electronic circuit package according to claim 8, wherein each of the electronic circuit parts is an IC chip, and portions of said signal strip lines on said edge portions of said cutouts are connected to high speed signal input/output ports of the IC chips while portions of said DC or low speed lines on said edge portions of said cutouts are connected to low speed signal input/output ports and power supply ports of said IC chips and portions of said signal strip lines and/or DC or low speed lines on said edge portions of said outer periphery of said circuit board are connected to package leads.
Claim 11
Dependent Claim
71 words
An electronic circuit package according to claim 9, wherein a metal block is interposed between each of said IC chips and an edge portion of a corresponding one of said cutouts on which said edge portions of said DC or low speed lines are exposed and is secured to said second metal member, and a ground port of a corresponding one of said IC chips is connected to said metal block.
Claim 12
Dependent Claim
50 words
An electronic circuit package according to claim 10, wherein a large number of via-contacts extending through said first and second insulator layers to establish connection with said first and second metal members are provided at least in areas of said ground patterns in the neighborhood of said signal strip lines.
Claim 13
Dependent Claim
41 words
An electronic circuit package according to claim 10, wherein a large number of via-contacts extending through said first and second insulator layers to establish connection with said first and second metal members are provided in entire areas of said ground patterns.
Claim 14
Dependent Claim
62 words
An electronic circuit package according to claim 11, wherein ground patterns with which said via-contacts connect are formed on the opposite faces of said first and second insulator layers to said conductor patterns, and the connection between said via-contacts and said first and second metal members is provided by sticking together with said ground patterns and said first and second metal members.
Claim 15
Dependent Claim
50 words
An electronic circuit package according to claim 13, wherein a ground port provided on each of said IC chips in such a manner as to surround said high speed signal input/output port is connected to a corresponding one of said ground patterns by way of a plurality of bonding wires.
Claim 16
Dependent Claim
22 words
An electronic circuit package according to claim 11, wherein an optical fiber is introduced into the inside of one of said cutouts.
Claim 17
Dependent Claim
28 words
An electronic circuit package according to claim 15, wherein a photoelectric transducer element is disposed in the inside of the cutout into which said optical fiber is introduced.
Claim 18
Dependent Claim
63 words
An electronic circuit package according to claim 16, wherein a mirror or a prism is disposed inside of the cutout in such a manner that the distance between the surface of the photoelectric transducer element and the fiber end can be inspected from the view point perpendicular to the cutout of the package, by way of the reflection of said mirror or prism.
Claim 19
Dependent Claim
90 words
An electronic circuit package according to claim 16, wherein said photoelectric transducer element is connected to the IC chip accommodated in said cutout, and said optical fiber and said photoelectric transducer element are optically coupled to each other such that light which is reflected by an end face of said optical fiber which is polished obliquely with respect to a plane perpendicular to a geometrical center axis of said optical fiber and is then emitted from a side face of said optical fiber is introduced into said photoelectric transducer element.
Claim 20
Dependent Claim
49 words
An electronic circuit package according to claim 9, wherein the IC chips are secured to said second metal member each by way of a receiving table of a predetermined thickness such that the high speed signal input/output ports and signal strip lines are positioned substantially on the same plane.
Claim 21
Dependent Claim
19 words
An electronic circuit package according to claim 19, wherein the receiving tables are integral with said second metal member.
Claim 22
Dependent Claim
20 words
An electronic circuit package according to claim 19, wherein the receiving tables are separate members from said second metal member.
Claim 23
Dependent Claim
18 words
An electronic circuit package according to claim 21, wherein said receiving tables are made of an insulating substance.
Claim 24
Dependent Claim
31 words
An electronic circuit package according to claim 21, wherein each of said receiving tables include a plurality of dielectric layers and conductor layers layered in an alternate relationship to each other.
Claim 25
Dependent Claim
17 words
An electronic circuit package according to claim 23, wherein said dielectric layers are made of aluminum nitride.
Claim 26
Dependent Claim
21 words
An electronic circuit package according to claim 24, wherein the substrate of each of said IC chips is made of silicon.
Claim 27
Dependent Claim
42 words
An electronic circuit package according to claim 9, wherein the number of the cutouts is 3, and the IC chips include an IC chip for the amplification, another IC chip for the timing/decision, and a further IC chip for the serial/parallel conversion.
Claim 28
Dependent Claim
29 words
An electronic circuit package according to claim 26, wherein an optical fiber is introduced into one of the cutouts in which said IC chip for the amplification is accommodated.
Claim 29
Dependent Claim
28 words
An electronic circuit package according to claim 27, wherein a photoelectric transducer element is disposed in the inside of said cutout into which said optical fiber is introduced.
Claim 30
Dependent Claim
89 words
An electronic circuit package according to claim 28, wherein said photoelectric transducer element is connected to said IC chip for the amplification, and said optical fiber and said photoelectric transducer element are optically coupled to each other such that light which is reflected by an end face of said optical fiber which is polished obliquely with respect to a plane perpendicular to a geometrical center axis of said optical fiber and is then emitted from a side face of said optical fiber is introduced into said photoelectric transducer element.
Claim 31
Dependent Claim
151 words
A process of producing an electronic circuit package, comprising: a first step of applying, to the opposite faces of a circuit board having a cutout in which an IC chip is to be accommodated, a first metal member having an opening at a location thereof corresponding to said cutout and a second metal member having a space to which the IC chip is to be secured; a second step of securing the IC chip and a metal block to which a ground port of said IC chip is to be connected to said second metal member in said cutout; a third step of connecting said IC chip to said circuit board and metal block by means of wire bonding; and a fourth step of covering over said opening of said first metal member with a lid member made of a metal; said first to fourth steps being proceeded in this order.
Claim 32
Dependent Claim
151 words
A process of producing an electronic circuit package, comprising: a first step of applying, to the opposite faces of a circuit board having a cutout in which an IC chip is to be accommodated, a first metal member having an opening at a location thereof corresponding to said cutout and a second metal member having a space to which the IC chip is to be secured; a second step of securing the IC chip and a metal block to which a ground port of said IC chip is to be connected to said second metal member in said cutout; a third step of connecting said IC chip to said circuit board and metal block by means of wire bonding; and a fourth step of covering over said opening of said first metal member with a lid member made of a metal; said first to fourth steps being proceeded in this order.
Claim 33
Dependent Claim
34 words
A process of producing an electronic circuit package according to claim 30, wherein the application of said first and second metal members and said circuit board at said first step is achieved by brazing.
Claim 34
Dependent Claim
33 words
A process of producing an electronic circuit package according to claim 31, wherein said first and second metal members are made of copper tungsten while said circuit board is made principally of ceramics.
Claim 35
Dependent Claim
32 words
A process of producing an electronic circuit package according to claim 31, wherein said first and second metal members are made of kovar while said circuit board is made principally of ceramics.
Claim 36
Dependent Claim
33 words
A process of producing an electronic circuit package according to claim 30, wherein, at said second step, said IC chip and metal block are secured in this order to said second metal member.
Claim 37
Dependent Claim
37 words
A process of producing an electronic circuit package according to claim 34, wherein said IC chip and metal block are secured to said second metal member by a scrubbing joining technique using an AuSn eutectic crystal material.
Claim 38
Dependent Claim
35 words
A process of producing an electronic circuit package according to claim 34, wherein said IC chip and metal block are secured to said second metal member by a scrubbing joining technique using silver paste bond.
Claim 39
Dependent Claim
99 words
A process of producing an electronic circuit package according to claim 31, wherein an additional step of joining a side plate having an introducing hole for the introduction of an optical fiber to a side face of said first or second metal member is provided either in said first step or between said first and second steps, and another additional step of introducing a pipe member in and to which an optical fiber is inserted and secured into said cutout by way of said introducing hole of said side plate and joining said pipe member to said side plate.
Claim 40
Dependent Claim
36 words
A process of producing an electronic circuit package according to claim 37, wherein said side plate and pipe member are made of kovar, and said pipe member is joined to said side plate by laser welding.
References Cited (Backward Citations)
No citation records indexed.
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