Patent EP0410472A2 successfully refreshed from Google Patents.
EP0410472A2
Expired / Lapsed
EP
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Electric contact
Assignee: Yazaki Corp
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Filing: 1990-07-27
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Granted: —
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Expires: 2010-07-27
Abstract
Abstract In an electric contact having a Cu-based layer, a Ni-based layer formed on the Cu-based layer, and a Pd-based layer formed on the Ni-based layer, the Ni-based layer having a thickness of at least 0.8 µm is so formed as to include a noncrystal nickel alloy layer having a thickness of at least 0.08 µm, in order to reduce the thickness of the Pd-based layer down to about 0.08 µm, that is, the cost of the contact without deteriorating the contact durability, as compared with a 0.6 to 2 µm thick prior-art Pd-based layer.
Inventors
- 👤 Kinya Horibe
- 👤 Tomio Hirano
- 👤 Minoru Ikeda
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 22:09
CPC Classifications
H; H01; H01H; H01H11/00; H01H11/04; H01H11/041; H01R; H01R13/00; H01R13/02; H01R13/03; H01H2011/046; Y; Y10; Y10S; Y10S428/00; Y10S428/922; Y10S428/9265; Y10S428/929; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12771; Y10T428/12861; Y10T428/12875; Y10T428/12889; Y10T428/12903; Y10T428/1291; Y10T428/12944
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
66 words
An electric contact comprising: (a) a metallic base layer; (b) a Ni-based layer formed on said metallic base layer and having a thickness of at least 0.8 µm, said Ni-based layer being formed with a noncrystal Ni-based layer having a thickness of at least 0.08 µm; and (c) a noble-metal-based layer formed on said noncrystal Ni-based layer and having a thickness of at least 0.08 µm.
Claim 2
Dependent Claim
66 words
An electric contact comprising: (a) a metallic base layer; (b) a Ni-based layer formed on said metallic base layer and having a thickness of at least 0.8 µm, said Ni-based layer being formed with a noncrystal Ni-based layer having a thickness of at least 0.08 µm; and (c) a noble-metal-based layer formed on said noncrystal Ni-based layer and having a thickness of at least 0.08 µm.
Claim 3
Dependent Claim
17 words
The electric contact of claim 1, which further comprises a gold layer formed on said noble-metal-based layer.
Claim 4
Dependent Claim
30 words
The electric contact of claim 1, wherein thickness of said Ni-based layer is from 0.8 to 2 µm, and thickness of said noncrystal Ni-based layer is 0.08 µm or more.
Claim 5
Dependent Claim
18 words
The electric contact of claim 1, wherein thickness of said noble-metal-based layer is from 0.08 to 0.5 µm.
Claim 6
Dependent Claim
16 words
The electric contact of claim 2, wherein thickness of said gold layer is bout 0.1 µm.
Claim 7
Dependent Claim
15 words
The electric contact of claim 1, wherein said metallic base layer is a Cu-based layer.
Claim 8
Dependent Claim
14 words
The electric contact of claim 1, wherein said noble-metal-based layer is a palladium-based layer.
Claim 9
Dependent Claim
27 words
The electric contact of claim 1, wherein said noncrystal Ni-based layer is a layer selected from the group consisting of Ni-P, Ni-B, Ni-Fe-P, Ni-P-W, Ni-Co-P or Ni-W.
Claim 10
Dependent Claim
16 words
The electric contact of claim 8, wherein said noncrystal Ni-based layer is formed by electrolytic plating.
Claim 11
Dependent Claim
16 words
The electric contact of claim 8, wherein said noncrystal Ni-based layer is formed by nonelectrolytic plating.
Claim 12
Dependent Claim
14 words
The electric contact of claim 7, wherein said palladium-based layer is a palladium layer.
Claim 13
Dependent Claim
15 words
The electric contact of claim 7, wherein said palladium-based layer is a palladium-nickel alloy layer.
Claim 14
Dependent Claim
15 words
The electric contact of claim 7, wherein said palladium-based layer is formed by electrolytic plating.
Claim 15
Dependent Claim
14 words
The electric contact of claim 7, wherein said palladium-based layer is formed by electrodeposition.
References Cited (Backward Citations)
EP0160761A1
Cited
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