Abstract A process for producing an optical connector comprises the steps of: preparing a substrate plate wafer (311) and a cover plate wafer (312); forming a plurality of optical fiber grooves (313) on a top surface of said substrate plate wafer and a plurality of windows (315) in said cover plate wafer; stacking the cover plate wafer on the substrate plate wafer; heating the cover and substrate plate wafers at an elevated temperature to join them into a unitary assembly; cutting the unitary assembly in a direction that is parallel to the plurality of optical fiber grooves and in a direction that is perpendicular to the plurality of optical fiber grooves and in traversing the centers of the plurality of windows in the cover plate wafer to produce a plurality of chips of optical fiber connector ferrule having a cutout in the rear portion of each cover plate; and fixing a plurality of optical fibers in a fiber array in position in a plurality of optical fiber holes (313').
A process for producing an optical connector, comprising the steps of: preparing a substrate plate wafer and a cover plate wafer; forming a plurality of optical fiber grooves on a top surface of said substrate plate wafer and a plurality of windows in said cover plate wafer; stacking said cover plate wafer on said substrate plate wafer; heating said cover and substrate plate wafers at an elevated temperature to join them into a unitary assembly; cutting said unitary assembly in a direction that is parallel to said plurality of optical fiber grooves and in a direction that is perpendicular to said plurality of optical fiber grooves and in traversing the centres of said plurality of windows in said cover plate wafer to produce a plurality of chips of optical fiber connector ferrule having a cutout in part of the rear portion of each cover plate; and fixing a plurality of optical fibers in a fiber array in position in a plurality of optical fiber holes.
Claim 2
Dependent Claim
165 words
A process for producing an optical connector, comprising the steps of: preparing a substrate plate wafer and a cover plate wafer; forming a plurality of optical fiber grooves on a top surface of said substrate plate wafer and a plurality of windows in said cover plate wafer; stacking said cover plate wafer on said substrate plate wafer; heating said cover and substrate plate wafers at an elevated temperature to join them into a unitary assembly; cutting said unitary assembly in a direction that is parallel to said plurality of optical fiber grooves and in a direction that is perpendicular to said plurality of optical fiber grooves and in traversing the centres of said plurality of windows in said cover plate wafer to produce a plurality of chips of optical fiber connector ferrule having a cutout in part of the rear portion of each cover plate; and fixing a plurality of optical fibers in a fiber array in position in a plurality of optical fiber holes.
Claim 3
Dependent Claim
45 words
A process for producing an optical connector as claimed in claim 1, further comprising the step of surrounding each of said plurality of chips of optical fiber connector ferrule with a plastic housing except in the area corresponding to said cutout in said cover plate.
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