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EP0405620A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Process for producing an optical connector

Assignee: Sumitomo Electric Industries Ltd
•
Filing: 1987-11-13
•
Granted: —
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Expires: 2007-11-13
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Abstract

Abstract A process for producing an optical connector comprises the steps of: preparing a substrate plate wafer (311) and a cover plate wafer (312); forming a plurality of optical fiber grooves (313) on a top surface of said substrate plate wafer and a plurality of windows (315) in said cover plate wafer; stacking the cover plate wafer on the substrate plate wafer; heating the cover and substrate plate wafers at an elevated temperature to join them into a unitary assembly; cutting the unitary assembly in a direction that is parallel to the plurality of optical fiber grooves and in a direction that is perpendicular to the plurality of optical fiber grooves and in traversing the centers of the plurality of windows in the cover plate wafer to produce a plurality of chips of optical fiber connector ferrule having a cutout in the rear portion of each cover plate; and fixing a plurality of optical fibers in a fiber array in position in a plurality of optical fiber holes (313').

Inventors

  • 👤 Toshaki C/O Yokohama Works Kakii
  • 👤 Kazuhito C/O Yokohama Works Saito
  • 👤 Shuzo C/O Yokohama Works Suzuki

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-01 10:36
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/24; G02B6/36; G02B6/38; G02B6/3807; G02B6/389; G02B6/3628; G02B6/3648; G02B6/3656; G02B6/3833; G02B6/3834; G02B6/3838; G02B6/3839; G02B6/3873; G02B6/3885; G02B6/3632; G02B6/3636; G02B6/3652; G02B6/3684; G02B6/3692; G02B6/3696; G02B6/3854; G02B6/3882

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 165 words
A process for producing an optical connector, comprising the steps of: preparing a substrate plate wafer and a cover plate wafer; forming a plurality of optical fiber grooves on a top surface of said substrate plate wafer and a plurality of windows in said cover plate wafer; stacking said cover plate wafer on said substrate plate wafer; heating said cover and substrate plate wafers at an elevated temperature to join them into a unitary assembly; cutting said unitary assembly in a direction that is parallel to said plurality of optical fiber grooves and in a direction that is perpendicular to said plurality of optical fiber grooves and in traversing the centres of said plurality of windows in said cover plate wafer to produce a plurality of chips of optical fiber connector ferrule having a cutout in part of the rear portion of each cover plate; and fixing a plurality of optical fibers in a fiber array in position in a plurality of optical fiber holes.
Claim 2
Dependent Claim 165 words
A process for producing an optical connector, comprising the steps of: preparing a substrate plate wafer and a cover plate wafer; forming a plurality of optical fiber grooves on a top surface of said substrate plate wafer and a plurality of windows in said cover plate wafer; stacking said cover plate wafer on said substrate plate wafer; heating said cover and substrate plate wafers at an elevated temperature to join them into a unitary assembly; cutting said unitary assembly in a direction that is parallel to said plurality of optical fiber grooves and in a direction that is perpendicular to said plurality of optical fiber grooves and in traversing the centres of said plurality of windows in said cover plate wafer to produce a plurality of chips of optical fiber connector ferrule having a cutout in part of the rear portion of each cover plate; and fixing a plurality of optical fibers in a fiber array in position in a plurality of optical fiber holes.
Claim 3
Dependent Claim 45 words
A process for producing an optical connector as claimed in claim 1, further comprising the step of surrounding each of said plurality of chips of optical fiber connector ferrule with a plastic housing except in the area corresponding to said cutout in said cover plate.

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