Patent EP0402966A2 successfully refreshed from Google Patents.
EP0402966A2
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EP
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Method for treating copper circuit pattern of interlayer circuit board
Assignee: Panasonic Electric Works Co Ltd
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Filing: 1990-05-03
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Granted: —
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Expires: 2010-05-03
Abstract
Abstract A method for processing copper circuit pattern of interlayer circuit board carries out a reduction treatment with respect to the copper circuit pattern by causing a reducing gas to act on a surface of an oxide of copper formed on the copper circuit pattern for its surface roughening. A strong reducing action is thereby provided to the roughened surface of the oxide of copper and, consequently, the interlayer circuit board having the copper circuit pattern in which the oxide of copper mainly comprising cupric oxide is varied to cuprous oxide or a metallic copper can be obtained.
Inventors
- 👤 Tomio C/O Matsushita Electric Works Ltd. Awano
- 👤 Motoyuki C/O Matsushita Electric Works Akamatsu
- 👤 Tomoaki C/O Matsushita Electric Works Yamane
- 👤 Tsutomu C/O Matsushita Electric Works Ichiki
- 👤 Hideo C/O Matsushita Electric Works Funo
- 👤 Takashi C/O Matsushita Electric Works Sagara
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 13:00
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/38; H05K3/382; H05K3/385; H05K2203/00; H05K2203/03; H05K2203/0315; H05K2203/11; H05K2203/1157; H05K3/4611
Claims Analysis
Total Claims: 33
Claim 1
Independent Claim
85 words
A method for treating copper circuit pattern of interlayer circuit board wherein said copper circuit pattern provided onto said interlayer circuit board is subjected to an oxidation to form an oxide of copper on the surface of the copper circuit pattern, and thereafter a reduction is carried out with respect to the surface of hte oxide of copper for reducing the same, characterized in that the reduction is carried out by causing a reducing gas to act on the surface of the oxide of copper.
Claim 2
Independent Claim
85 words
A method for treating copper circuit pattern of interlayer circuit board wherein said copper circuit pattern provided onto said interlayer circuit board is subjected to an oxidation to form an oxide of copper on the surface of the copper circuit pattern, and thereafter a reduction is carried out with respect to the surface of hte oxide of copper for reducing the same, characterized in that the reduction is carried out by causing a reducing gas to act on the surface of the oxide of copper.
Claim 3
Dependent Claim
14 words
The method of claim 1 wherein said reducing gas is hydrogen in nascent state.
Claim 4
Dependent Claim
47 words
The method of claim 1 wherein said oxide of copper is provided over its surface with a coating of a metal easier to be ionized than the oxide of copper, and thereafter said reduction is carried out by dissolving said metal coating and generating said reducing gas.
Claim 5
Dependent Claim
21 words
The method of claim 3 wherein said metal easier to be ionized is one of the standard electrode potential below +0.3V.
Claim 6
Dependent Claim
27 words
The method of claim 3 wherein said metal easier to be ionized is at least one selected from the group consisting of Sn, Fe, Zn and Al.
Claim 7
Dependent Claim
24 words
The method of claim 3 wherein said metal easier to be ionized is in powdery state of an average particle diameter smaller than 100µm.
Claim 8
Dependent Claim
26 words
The method of claim 6 wherein said metal powder is one having a compound of said metal formed on the surface of particles of the metal.
Claim 9
Dependent Claim
30 words
The method of claim 3 wherein said metal coating provided by bringing said interlayer circuit board into contact with a liquid in which said metal in powdery state is dispersed.
Claim 10
Dependent Claim
24 words
The method of claim 8 wherein said liquid having therein said metal powder dispersed includes a substance which restrains agglomeration of the metal powder.
Claim 11
Dependent Claim
15 words
The method of claim 9 wherein said agglomeration restraining substance is a fine inorganic powder.
Claim 12
Dependent Claim
16 words
The method of claim 9 wherein said agglomeration restraining substance is a water soluble organic solvent.
Claim 13
Dependent Claim
13 words
The method of claim 9 wherein said agglomeration restraining substance is a gelatinizer.
Claim 14
Dependent Claim
24 words
The method of claim 3 wherein said metal coating over said oxide of copper is carried out in a range of 1 to 300g/m².
Claim 15
Dependent Claim
40 words
The method of claim 1 wherein said reduction is carried out by bringing said interlayer circuit board into contact with a treating liquid in which hydrogen is being generated by an added metal of the standard electrode potential below +0.3V.
Claim 16
Dependent Claim
12 words
The method of claim 14 wherein said hydrogen is in nascent state.
Claim 17
Dependent Claim
27 words
The method of claim 14 wherein said added metal is in powdery state, and said treating liquid is of water in which said metal powder is dispersed.
Claim 18
Dependent Claim
21 words
The method of claim 14 wherein said treating liquid is of an acidic solution in which said added metal is dissolved.
Claim 19
Dependent Claim
21 words
The method of claim 14 wherein said treating liquid is of an alkaline solution in which said added metal is dissolved.
Claim 20
Dependent Claim
23 words
The method of claim 14 wherein said added metal is at least one selected from a group consisting of Sn, Fe and Zn.
Claim 21
Dependent Claim
20 words
The method of claim 14 wherein said added metal is in a powder of an average particle diameter below 100µm.
Claim 22
Dependent Claim
27 words
The method of claim 14 wherein said added metal is in a powder, and said treating liquid contains a substance which restrains agglomeration of said metal powder.
Claim 23
Dependent Claim
16 words
The method of claim 21 wherein said agglomeration restraining substance is of a fine inorganic powder.
Claim 24
Dependent Claim
44 words
The method of claim 14 wherein said added metal is in a powder, and said interlayer circuit board brought into contact with said treating liquid is rinsed with an acidic solution to remove said metal powder remained as deposited on the interlayer circuit board.
Claim 25
Dependent Claim
44 words
The method of claim 14 wherein said added metal is in a powder, and said interlayer circuit board brought into contact with said treating liquid is rinsed with an alkaline solution to remove said metal powder remained as deposited on the interlayer circuit board.
Claim 26
Dependent Claim
46 words
The method of claim 14 wherein said added metal is in a powder, and said interlayer circuit board brought into contact with said treating liquid is subjected at least to air blown thereagainst to remove said metal powder remained as deposited on the interlayer circuit board.
Claim 27
Dependent Claim
47 words
The method of claim 14 wherein said added metal is in a powder, and said interlayer circuit board brought into contact with said treating liquid is subjected at least to a liquid blown thereagainst to remove said metal powder remained as deposited on the interlayer circuit board.
Claim 28
Dependent Claim
15 words
The method of claim 17 wherein said treating liquid is of an acidic reducing agent.
Claim 29
Dependent Claim
15 words
The method of claim 18 wherein said treating liquid is of an acidic reducing agent.
Claim 30
Dependent Claim
17 words
The method of claim 27 wherein said acidic reducing agent is of an oxidation-reduction potential below +0.3V.
Claim 31
Dependent Claim
17 words
The method of claim 28 wherein said acidic reducing agent is of an oxidation-reduction potential below +0.3V.
Claim 32
Dependent Claim
27 words
The method of claim 29 wherein said acidic reducing agent is at least one selected from the group consisting of formic acid, sulfamic acid and hypophosphoric acid.
Claim 33
Dependent Claim
27 words
The method of claim 30 wherein said acidic reducing agent is at least one selected from the group consisting of formic acid, sulfamic acid and hypophosphoric acid.
References Cited (Backward Citations)
No citation records indexed.
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