Patent US4215897A successfully refreshed from Google Patents.
Patent EP0401743A1 successfully refreshed from Google Patents.
EP0401743A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Electrically insulated heat pipe type cooling apparatus for semiconductor
Assignee: Furukawa Electric Co Ltd
•
Filing: 1990-06-05
•
Granted: —
•
Expires: 2010-06-05
Abstract
Abstract There is provided an electrically insulated heat pipe type cooling apparatus for a semiconductor (7) comprising a heat absorption section (8) for cooling a semiconductor (7), a heat dissipation section (13) and an intermediate electrical insulation section (5). According to the disclosure, it is capable of highly improving cooling efficiency for a semiconductor (7) and exhibiting satisfactory electrical insulation.
Inventors
- 👤 Takashi Murase
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 12:20
CPC Classifications
F; F28; F28D; F28D15/00; F28D15/02; F28D15/0275; H; H10; H10W; H10W40/00; H10W40/40; H10W40/47; H10W40/70; H10W40/73; F28F; F28F2265/00; F28F2265/24
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
72 words
An electrically insulated heat pipe type cooling apparatus for a semiconductor comprising: at least one heat pipe provided at its intermediate portion with an electrically insulated cylinder, said heat pipe being divided through said intermediate portion into a heat absorption section and a heat dissipation section; said heat absorption section being provided with a metal block for mounting a semiconductor thereon; and said heat dissipation section being provided with a water-cooled structure.
Claim 2
Dependent Claim
72 words
An electrically insulated heat pipe type cooling apparatus for a semiconductor comprising: at least one heat pipe provided at its intermediate portion with an electrically insulated cylinder, said heat pipe being divided through said intermediate portion into a heat absorption section and a heat dissipation section; said heat absorption section being provided with a metal block for mounting a semiconductor thereon; and said heat dissipation section being provided with a water-cooled structure.
Claim 3
Dependent Claim
24 words
The electrically insulated heat pipe type cooling apparatus for semiconductor as claimed in Claim 1, wherein a plurality of said heat pipes are arranged.
Claim 4
Dependent Claim
24 words
The electrically insulated heat pipe type cooling apparatus for a semiconductor as claimed in Claim 1, wherein said water-cooled structure comprises a water-cooled jacket.
Claim 5
Dependent Claim
34 words
The electrically insulated heat pipe type cooling apparatus for a semiconductor as claimed in Claim 1, wherein said heat dissipation sections of two or more metal pipes for said heat pipe are inserted together.
Claim 6
Dependent Claim
39 words
The electrically insulated heat pipe type cooling apparatus for semiconductor as claimed in Claim 4, wherein said water-cooled jacket is provided therein with a baffle plate for directing the flow of water meanderingly in each of said metal pipers.
Claim 7
Dependent Claim
28 words
The electrically insulated heat pipe type cooling apparatus for semiconductor as claimed in Claim 1 or 2, wherein said heat pipe is provided with a water-cooled means individually.
References Cited (Backward Citations)
DE3327125A1
Cited
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.