Patent EP0397929A1 successfully refreshed from Google Patents.
EP0397929A1
Expired / Lapsed
EP
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Printed circuit board with improved soldering qualities
Assignee: Soltec BV
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Filing: 1989-05-17
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Granted: —
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Expires: 2009-05-17
Abstract
Abstract The invention relates to the soldering of printed circuit boards. To avoid the prior art difficulties encountered with the limited effectiveness of reduction agents, the reduction agent is applied such that it is active until the end of the soldering process. By applying the reduction agent on the printed circuit board (1) before the soldering process, the active period of said agent is extended, in that it is not flushed away easily. By applying said reduction agent (10) in cavities (9) provided in the layer of protective lacquer (6) of the printed circuit board (1), this period is even extended further. According to a preferred embodiment, those cavities (9) also comprise the soldering flux.
Inventors
- 👤 Gerrit Schouten
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 19:29
CPC Classifications
B; B23; B23K; B23K1/00; B23K1/08; B23K1/085; B23K1/20; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3489; B23K2101/00; B23K2101/36; B23K2101/40
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
47 words
Soldering process, in which a printed circuit board with its face to be soldered, is conveyed through liquid solder and in which a reduction agent for the solder is active, characterized in that the reduction agent is active until at least the end of the soldering process.
Claim 2
Dependent Claim
47 words
Soldering process, in which a printed circuit board with its face to be soldered, is conveyed through liquid solder and in which a reduction agent for the solder is active, characterized in that the reduction agent is active until at least the end of the soldering process.
Claim 3
Dependent Claim
20 words
Soldering process according to claim 1, characterized in that het reduction agent for the solder also has a protective working.
Claim 4
Dependent Claim
28 words
Soldering process according to claim 1 or 2, characterized in that the reduction agent is present on the printed circuit board at the start of the soldering process.
Claim 5
Dependent Claim
52 words
Printed circuit board to be soldered with the soldering process according to one of the claims 1, 2 or 3, characterized in that the reduction agent has been applied such on the printed circuit board, that the reduction agent continues to be active until at least the end of the soldering process.
Claim 6
Dependent Claim
26 words
Printed circuit board according to claim 4, characterized in that the reduction agent continues to be present until at least the end of the soldering process.
Claim 7
Dependent Claim
35 words
Printed circuit board according to one of the claims 4 or 5, provided with a layer of protective lacquer protecting the solder, characterized in that the reduction agent has been applied on the protective lacquer.
Claim 8
Dependent Claim
46 words
Printed circuit board according to one of the claims 4, 5 or 6, characterized in that the outer layer of the face of the printed circuit board to be soldered has at least partially been provided with cavities in which the reduction agent has been applied.
Claim 9
Dependent Claim
34 words
Printed circuit board according to claim 7, characterized in that the protective lacquer protecting the solder, applied at the face to be soldered of the printed circuit board comprises cavities for the soldering flux.
Claim 10
Dependent Claim
22 words
Printed circuit board according to claim 7 or 8, characterized in that the cavities have been provided according to a grid pattern.
Claim 11
Dependent Claim
21 words
Printed circuit board according to claim 9, characterized in that the cavities have been provided according to a chess board pattern.
References Cited (Backward Citations)
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