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EP0397929A1 Expired / Lapsed EP ⏱️ 0.0 years remaining

Printed circuit board with improved soldering qualities

Assignee: Soltec BV
•
Filing: 1989-05-17
•
Granted: —
•
Expires: 2009-05-17
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Abstract

Abstract The invention relates to the soldering of printed circuit boards. To avoid the prior art difficulties encountered with the limited effectiveness of reduction agents, the reduction agent is applied such that it is active until the end of the soldering process. By applying the reduction agent on the printed circuit board (1) before the soldering process, the acti­ve period of said agent is extended, in that it is not flu­shed away easily. By applying said reduction agent (10) in cavi­ties (9) provided in the layer of protective lacquer (6) of the prin­ted circuit board (1), this period is even extended further. Ac­cording to a preferred embodiment, those cavities (9) also com­prise the soldering flux.

Inventors

  • 👤 Gerrit Schouten

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-04 10:03
CPC Classifications
B; B23; B23K; B23K1/00; B23K1/08; B23K1/085; B23K1/20; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3489; B23K2101/00; B23K2101/36; B23K2101/40

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 47 words
Soldering process, in which a printed circuit board with its face to be soldered, is conveyed through li­quid solder and in which a reduction agent for the solder is active, characterized in that the reduction agent is active until at least the end of the soldering process.
Claim 2
Dependent Claim 47 words
Soldering process, in which a printed circuit board with its face to be soldered, is conveyed through li­quid solder and in which a reduction agent for the solder is active, characterized in that the reduction agent is active until at least the end of the soldering process.
Claim 3
Dependent Claim 20 words
Soldering process according to claim 1, charac­terized in that het reduction agent for the solder also has a protective working.
Claim 4
Dependent Claim 28 words
Soldering process according to claim 1 or 2, characterized in that the reduction agent is present on the printed circuit board at the start of the soldering process.
Claim 5
Dependent Claim 52 words
Printed circuit board to be soldered with the soldering process according to one of the claims 1, 2 or 3, characterized in that the reduction agent has been applied such on the printed circuit board, that the reduction agent continues to be active until at least the end of the solde­ring process.
Claim 6
Dependent Claim 26 words
Printed circuit board according to claim 4, cha­racterized in that the reduction agent continues to be pre­sent until at least the end of the soldering process.
Claim 7
Dependent Claim 35 words
Printed circuit board according to one of the claims 4 or 5, provided with a layer of protective lacquer protecting the solder, characterized in that the reduction agent has been applied on the protective lacquer.
Claim 8
Dependent Claim 46 words
Printed circuit board according to one of the claims 4, 5 or 6, characterized in that the outer layer of the face of the printed circuit board to be soldered has at least partially been provided with cavities in which the re­duction agent has been applied.
Claim 9
Dependent Claim 34 words
Printed circuit board according to claim 7, characterized in that the protective lacquer protecting the solder, applied at the face to be soldered of the printed circuit board comprises cavities for the soldering flux.
Claim 10
Dependent Claim 22 words
Printed circuit board according to claim 7 or 8, characterized in that the cavities have been provided accor­ding to a grid pattern.
Claim 11
Dependent Claim 21 words
Printed circuit board according to claim 9, characterized in that the cavities have been provided accor­ding to a chess board pattern.

References Cited (Backward Citations)

US4429457A Cited
EP0131730A1 Cited
US4538757A Cited
GB2174326A Cited
EP0285701A1 Cited

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