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Patent EP0396056A2 successfully refreshed from Google Patents.
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EP0396056A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Treatment of copper foil for printed circuits

Assignee: Nippon Mining Holdings Inc
•
Filing: 1990-04-27
•
Granted: —
•
Expires: 2010-04-27
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Abstract

Abstract A process for the treatment of a copper foil for printed circuits comprises forming, over the surface of the copper foil to be treated, of an electroplating alloy deposit selected from the group consisting of electroplating deposits of binary alloys composed of 20 - 40 mg/dm<2> copper and 100 - 3000 mu g/dm<2> cobalt and of ternary alloys of 20 - 40 mg/dm<2> copper, 100 -3000 mu g/dm<2> cobalt, and 100 - 1000 mu g/dm<2> nickel. The copper foil treated has heat resistance, peel strength, and resistance to hydrochloric acid comparable to the Cu-Ni-treated foils. It can be etched with a CuCl2 etchant to form 150 mu m or finer-pitch printed circuits and is also etchable with alkalies. Its magnetizability is below the permissible upper limit.

Inventors

  • 👤 Eiji C/O Nikko Gould Foil Co. Ltd. Hino
  • 👤 Keisuke Nikko Gould Foil Co. Ltd. Yamanishi

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-06 14:58
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/282; C; C25; C25D; C25D3/00; C25D3/02; C25D3/56; C25D3/58; C25D5/00; C25D5/34; C25D5/48; H05K3/38; H05K3/382; H05K3/384; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2203/00; H05K2203/03; H05K2203/0307; H05K2203/07; H05K2203/0703; H05K2203/0723

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 79 words
A process for the treatment of a copper foil for printed circuits characterized by forming, on the surface of the copper foil to be treated, an electroplated alloy layer selected from the group consisting of electro-plated layers of binary alloys composed of from 20 to 40 mg/dm² copper and from 100 to 3000 µg/dm² cobalt and ternary alloys composed of from 20 to 40 mg/dm² copper, from 100 to 3000 µg/dm² cobalt, and from 100 to 1000 µg/dm² nickel.
Claim 2
Dependent Claim 79 words
A process for the treatment of a copper foil for printed circuits characterized by forming, on the surface of the copper foil to be treated, an electroplated alloy layer selected from the group consisting of electro-plated layers of binary alloys composed of from 20 to 40 mg/dm² copper and from 100 to 3000 µg/dm² cobalt and ternary alloys composed of from 20 to 40 mg/dm² copper, from 100 to 3000 µg/dm² cobalt, and from 100 to 1000 µg/dm² nickel.
Claim 3
Dependent Claim 17 words
A process according to claim 1 wherein the electroplated layer formed is then treated for corrosion prevention.
Claim 4
Dependent Claim 29 words
A process according to claim 2 wherein the treatment for corrosion prevention is coating with either chromium oxide alone or with a mixture of chromium oxide and zinc/zinc oxide.
Claim 5
Dependent Claim 27 words
A process according to anyone of claims 1 to 3 wherein the surface of the copper foil is roughened as pre-treatment before forming said electroplated alloy layer.

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