Patent US1793048A successfully refreshed from Google Patents.
Patent EP0392348A2 successfully refreshed from Google Patents.
EP0392348A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Toughened thermosetting structural materials
Assignee: Cytec Technology Corp
•
Filing: 1990-04-05
•
Granted: —
•
Expires: 2010-04-05
Abstract
Abstract The incorporation of 2 to 35 µm particles of a differentially soluble engineering thermoplastic into heat curable epoxy resin systems significantly increases the toughness of such systems without loss of other desirable properties. These toughened epoxy resin systems are useful in preparing carbon fiber reinforced composites having compression strength after impact (CAI) of greater than 45 Ksi 310 MPa after a 1500 in-lb/in impact.
Inventors
- 👤 Hans Gert Recker
- 👤 Timothy J. Hartness
- 👤 Thomas Folda
- 👤 Helmut Tesch
- 👤 Thomas Weber
- 👤 Jack Douglas Boyd
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 13:15
CPC Classifications
C; C08; C08L; C08L63/00; C08J; C08J5/00; C08J5/24; C08J5/241; C08J5/243; C08J2363/00; Y; Y10; Y10S; Y10S428/00; Y10S428/902; Y10T; Y10T428/00; Y10T428/30; Y10T428/31504; Y10T428/31511; Y10T442/00; Y10T442/20; Y10T442/2926; Y10T442/2951; Y10T442/2984
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
72 words
A heat-curable epoxy resin system, comprising a) an epoxy resin having a functionality of two or greater; b) an aromatic diamine or diphenol curing agent; and c) from 15 to 50 weight percent of a differentially soluble amorphous thermoplastic in particulate form, said particles having a mean diameter of from 2 µm to 35 µm, wherein such composition displays no substantial phase separation into thermoplastic rich and epoxy rich zones upon cure.
Claim 2
Dependent Claim
102 words
A heat curable epoxy resin system comprising: a) an epoxy resin having a functionality of two or greater; b) an aromatic diamine or diphenol curing agent; c) from 10 to 30 weight percent of a differentially soluble amorphous thermoplastic, said differentially soluble thermoplastic being in particulate form having a mean size of from 2 µm to 35 µm; and d) from 5 to 20 weight percent of a thermoplastic polyimide which is soluble or substantially soluble in the resin system at the resin mix temperature, wherein such composition displays no substantial phase separation into thermoplastic rich and epoxy rich zones upon cure.
Claim 3
Dependent Claim
16 words
The heat-curable resin of claims 1 or 2 wherein said differentially soluble thermoplastic is a polysulfone.
Claim 4
Dependent Claim
32 words
The heat-curable resin of claims 1 or 2 wherein said differentially soluble thermoplastic is insoluble in the epoxy resin system at the mix temperature and is readily soluble at the cure temperature.
Claim 5
Dependent Claim
26 words
The heat-curable resin of claims 1 or 2 wherein said aromatic diamine curing agent is selected from the group consisting of 4,4′-diaminodiphenylsulfone, 3,3′-diaminodiphenylsulfone, and mixtures thereof.
Claim 6
Dependent Claim
37 words
The heat-curable resin of claims 1 or 2 wherein said resin having a functionality of two or greater is selected from the group consisting of the glycidylethers of phenolated dicyclopentadiene, bisphenol F, bisphenol A, N,N,N′,N′-tetraglycidylmethylenedianiline, and N,N,O-tris[glycidyl]-p-aminophenol.
Claim 7
Dependent Claim
36 words
7 A heat-curable prepreg, comprising a) carbon fiber reinforcement in an amount of from 30 to 90 weight percent based on the weight of the prepreg; b) the epoxy resin system of claims 1 or 2.
Claim 8
Dependent Claim
173 words
A process for establishing a non-phase-separated thermoplastic gradient in the interply area in a fiber reinforced composite prepared from heat-curable matrix resin impregnated fiber reinforced prepregs, comprising: a) employing as the prepreg matrix resin a heat-curable base resin system; b) slurrying into said base resin system from 15 to 50 weight percent of a differentially soluble thermoplastic having a mean particle size from 2 µm to 35 µm to form a thermoplastic particle-containing resin system; c) preparing a heat-curable prepreg by impregnating fiber reinforcement with said thermoplastic particle-containing resin such that a non-uniform distribution of thermoplastic particles is achieved with the major weight part of said particles being located exterior to the plane of the fibers; d) adjusting the gel time of the base resin such that during cure of said heat-curable prepreg (c) substantial to total dissolution of the thermoplastic particles occurs but substantial diffusion away from the interlaminar zone is prevented, thus forming a thermoplastic gradient between the planes of fiber reinforcement whose maximum is located substantially mediate to such planes.
Claim 9
Dependent Claim
19 words
The process of claim 8 wherein the adjustment of gel time is made through the addition of a catalyst.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.