Patent EP0390996A2 successfully refreshed from Google Patents.
EP0390996A2
Expired / Lapsed
EP
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IC card module
Assignee: Mitsubishi Electric Corp
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Filing: 1989-08-07
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Granted: —
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Expires: 2009-08-07
Abstract
Abstract An IC card mooule includes a substrate 12 one side of which is provided with a connection terminal 7; and a resin-sealed semiconductor IC 11 which has been previously sealed by a resin. This connection terminal and the resin sealed semiconductor IC are electrically connected to each other and are molded with a molding resin 17 in such a manner that they are covered with the molding resin so as to prevent at least the electrically-connected portion 16 between them from being allowed to appear. Accordingly, reliable modules can be efficiently manufactured, and such reliable modules can be readily mounted on IC card substrates.
Inventors
- 👤 Syojiro C/O Kitaitami Seisakusho Of Kodai
- 👤 Katsunori C/O Kitaitama Seisakusho Of Ochi
- 👤 Fumiaki C/O Zairyo Kenyusho Of Baba
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 14:36
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/07745; G06K19/07747; H; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/284; H10; H10W; H10W70/00; H10W70/60; H10W70/699; H10W74/00; H10W74/10; H10W74/111; H10W74/121; H10W74/40; H10W74/47; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0388; H05K2201/0394; H05K2201/10; H05K2201/10613; H05K2201/10954; H05K2201/10977; H05K2203/00; H05K2203/13; H05K2203/1305; H05K2203/1316; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H10W72/00; H10W72/851; H10W72/874; H10W72/884
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
93 words
An IC card module comprising: a substrate (12) one side of which is provided with a connection terminal (7) a semiconductor IC (11) held on the other side of said substrate and electrically connected to said connection terminal; and a molding resin (17) covering at least part of the electrically-connected portion (14, 16) between said connection terminal and said semiconductor IC and integrally molding said substrate and said resin-sealed semiconductor IC, characterised in that the semiconductor IC is a resin sealed IC and the moulding resin (17) covers the electrical connection (14, 16).
Claim 2
Dependent Claim
93 words
An IC card module comprising: a substrate (12) one side of which is provided with a connection terminal (7) a semiconductor IC (11) held on the other side of said substrate and electrically connected to said connection terminal; and a molding resin (17) covering at least part of the electrically-connected portion (14, 16) between said connection terminal and said semiconductor IC and integrally molding said substrate and said resin-sealed semiconductor IC, characterised in that the semiconductor IC is a resin sealed IC and the moulding resin (17) covers the electrical connection (14, 16).
Claim 3
Dependent Claim
49 words
2 An IC card module according to claim 1 wherein an insulating body (13) is disposed on the said other side of said substrate, said resin-sealed semiconductor IC is held on said insulating body, and said electrically-connected portion is disposed in an opening (15) formed in said insulating body.
Claim 4
Dependent Claim
25 words
An IC card module according to claim 2 wherein said resin sealed semiconductor IC and said insulating body are completely submerged by said molding resin.
Claim 5
Dependent Claim
40 words
An IC card module according to claim 1 wherein said substrate comprises a plate-like terminal substrate and said resin-sealed semiconductor IC is molded from said molding resin as to be fitted within a recessed portion formed in said terminal substrate.
Claim 6
Dependent Claim
57 words
An IC card module according to claim 1 wherein said substrate is a double-sided substrate provided with a circuit on the obverse side thereof and provided with a connection terminal on the reverse side thereof which is electrically connected to said circuit, and said resin-sealed semiconductor IC is mounted on said obverse side of said double-side substrate.
Claim 7
Dependent Claim
35 words
An IC card module according to claim 5 wherein the electrical connection between said circuit and said connection terminal is performed by a conductor enclosed in a through hole which is formed penetrating said substrate.
Claim 8
Dependent Claim
16 words
An IC card module according to any preceding claim wherein said molding resin comprises thermoplastic resin.
Claim 9
Dependent Claim
24 words
An IC card module according to claim 7 wherein said thermoplastic resin comprises at least one selected from polybutyleneterephthalate, polyphenylenesulfide, polycarbonate or ABS resin.
Claim 10
Dependent Claim
17 words
An IC card module according to claim 7 wherein said thermoplastic resin comprises thermotropic liquid crystal polymer.
Claim 11
Dependent Claim
20 words
An IC card module according to any of claims 1 to 6 wherein said molding resin comprises a thermosetting resin.
Claim 12
Dependent Claim
19 words
An IC card module according to any preceding claim wherein said resin-sealed semiconductor IC comprises a thin resin-packed IC.
Claim 13
Dependent Claim
20 words
An IC card module substantially as described with reference to any of Figures 2 to 6 of the accompanying drawings.
Claim 14
Dependent Claim
20 words
An IC card module substantially as described with reference to any of Figures 2 to 6 of the accompanying drawings.
References Cited (Backward Citations)
No citation records indexed.
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