Patent EP0385787A2 successfully refreshed from Google Patents.
EP0385787A2
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EP
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Method of producing connection electrodes
Assignee: Sharp Corp
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Filing: 1990-03-01
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Granted: —
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Expires: 2010-03-01
Abstract
Abstract A connection electrodes (12) producing method has a step of forming resin layer (13) which can be softened after hardened, on a circuit substrate (11) on which an electrode pattern is formed. Then, only the resin layer material on the electrode pattern is cured and left. Thereafter, conductive particles (14) are adhered to only the resin layer on the electrode pattern by softening the resin layer and by scattering the conductive particles on the circuit substrate with the softened resin layer.
Inventors
- 👤 Hiroshi Matsubara
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 22:35
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; G; G02; G02F; G02F1/00; G02F1/01; G02F1/13; G02F1/133; G02F1/1333; G02F1/1345; G02F1/13452; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H05K3/245; H05K3/247; H05K3/30; H05K3/32; H05K3/321; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0221; H05K2201/0233; H05K2201/03; H05K2201/0332; H05K2201/0364; H05K2201/0373; H05K3/02; H05K3/06; H05K3/10; H05K3/102; H10W72/01; H10W72/012; H10W72/01208; H10W72/01221; H10W72/01225; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/251; H10W72/253; H10W72/255; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/851; H10W72/853; H10W72/856; H10W72/90; H10W72/921; H10W72/923; H10W72/951; H10W72/952
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
89 words
A method of producing connection electrodes comprising the steps of: forming a resin layer made of a resin material capable of being softened after being hardened, on a circuit substrate on which an electrode pattern is formed; curing only the resin layer material on said electrode pattern; leaving only the resin layer on said electrode pattern; and adhering conductive particles to only the resin layer on the electrode pattern by softening the resin layer and by scattering the conductive particles on the circuit substrate with the softened resin layer.
Claim 2
Independent Claim
89 words
A method of producing connection electrodes comprising the steps of: forming a resin layer made of a resin material capable of being softened after being hardened, on a circuit substrate on which an electrode pattern is formed; curing only the resin layer material on said electrode pattern; leaving only the resin layer on said electrode pattern; and adhering conductive particles to only the resin layer on the electrode pattern by softening the resin layer and by scattering the conductive particles on the circuit substrate with the softened resin layer.
Claim 3
Dependent Claim
32 words
A method as claimed in claim 1, wherein said curing step includes a step of effecting illumination with ultraviolet rays through a mask having an opening pattern corresponding to the electrode pattern.
Claim 4
Dependent Claim
26 words
A method as claimed in claim 2, wherein said leaving step includes a step of removing a non-cured part after the illumination with the ultraviolet rays.
Claim 5
Dependent Claim
22 words
A method as claimed in claim 3, wherein said removing step includes a step of dissolving the non-cured part by a solvent.
Claim 6
Dependent Claim
28 words
A method as claimed in claim 1, wherein said adhering step includes a step of removing the conductive particles attached to the portion other than the electrode pattern.
Claim 7
Dependent Claim
20 words
A method as claimed in claim 5, wherein said removing step being carried out after the scattering the conductive particles.
Claim 8
Dependent Claim
21 words
A method as claimed in claim 5, wherein said removing step being carried out simultaneously with the scattering the conductive particles.
Claim 9
Dependent Claim
39 words
A method as claimed in claim 1, wherein said adhering step includes a step of scattering, on the circuit substrate, conductive particles each having a diameter greater than the thickness of the resin layer softened on the electrode pattern.
Claim 10
Dependent Claim
27 words
A method as claimed in claim 1, wherein said adhering step includes a step of scattering, on the circuit substrate, conductive particles each completely formed of metal.
Claim 11
Dependent Claim
33 words
A method as claimed in claim 1, wherein said adhering step includes a step of scattering, on the circuit substrate, conductive particles each formed of an elastic particle coated with a metallic layer.
Claim 12
Dependent Claim
92 words
An electrical component or device (10) which includes an electrode (12) which is supported on a substrate (11) and which is connected or to be connected to a conductive element (21) of another electrical component or device (20) by a connector means (13, 14) which comprises a layer of softenable material (13) and conductive particles (14) partially embedded in said layer so that they are in electrical contact with said electrode (12) and project from the surface of said layer said connector means being confined substantially to the region of said electrode.
Claim 13
Dependent Claim
92 words
An electrical component or device (10) which includes an electrode (12) which is supported on a substrate (11) and which is connected or to be connected to a conductive element (21) of another electrical component or device (20) by a connector means (13, 14) which comprises a layer of softenable material (13) and conductive particles (14) partially embedded in said layer so that they are in electrical contact with said electrode (12) and project from the surface of said layer said connector means being confined substantially to the region of said electrode.
Claim 14
Independent Claim
63 words
A method of forming a connector means (13, 14) on an electrode (12) of an electrical component or device (10), said electrode being supported on a substrate (11), comprising forming a layer of softenable material (13) on said electrode, softening said layer and applying conductive particles to said substrate so that they adhere only to the softened material and become partly embedded therein.
Claim 15
Independent Claim
63 words
A method of forming a connector means (13, 14) on an electrode (12) of an electrical component or device (10), said electrode being supported on a substrate (11), comprising forming a layer of softenable material (13) on said electrode, softening said layer and applying conductive particles to said substrate so that they adhere only to the softened material and become partly embedded therein.
References Cited (Backward Citations)
No citation records indexed.
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